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ELJ-EA100KF

Fixed Inductors 1210 10uH 10% 160 mA 340mohm Wirewound

器件类别:无源元件   

厂商名称:Panasonic(松下)

厂商官网:http://www.panasonic.co.jp/semicon/e-index.html

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器件参数
参数名称
属性值
Product Attribute
Attribute Value
制造商
Manufacturer
Panasonic(松下)
产品种类
Product Category
Fixed Inductors
RoHS
Details
端接类型
Termination Style
SMD/SMT
屏蔽
Shielding
Unshielded
电感
Inductance
10 uH
容差
Tolerance
20 %
最大直流电流
Maximum DC Current
160 mA
最大直流电阻
Maximum DC Resistance
260 mOhms
最小工作温度
Minimum Operating Temperature
- 20 C
最大工作温度
Maximum Operating Temperature
+ 85 C
Q Minimum
10
测试频率
Test Frequency
2.52 MHz
安装风格
Mounting Style
PCB Mount
封装 / 箱体
Package / Case
1210 (3225 metric)
长度
Length
3.2 mm
宽度
Width
2.5 mm
高度
Height
2.2 mm
应用
Application
RF
系列
Packaging
Cut Tape
系列
Packaging
MouseReel
系列
Packaging
Reel
产品
Product
Fixed Inductors
自谐振频率
Self Resonant Frequency
29 MHz
外壳代码 - in
Case Code - in
1210
外壳代码 - mm
Case Code - mm
3225
工厂包装数量
Factory Pack Quantity
2000
单位重量
Unit Weight
0.000564 oz
文档预览
Fixed Inductors (Chip Inductors)
6. Low DC Resistance Type EA
Discontinued
Features
Low DCR, suitable for power circuitry.
Magnetic shield effect using ferrite mixed outer molding.
Capable of being Re-flow or flow soldered.
Good for mounting.
RoHS compliant
Recommended Applications
AV equipment, Wireless communication equipment and various types of general electronic equipment.
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
Packaging Design No.
Product code
Chip Inductors
EA
Type
3225 (1210)
Size : mm (inch)
Inductance
3R3
470
561
3.3 μH
47 μH
560 μH
Inductance tolerance
K
M
±10 %
±20 %
F
Taping
Storage Conditions
: Normal temperature (–5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to
direct sunlight and harmful gases and care should be taken so as not to cause dew.
Operating Temperature : –20 to +85 °C
Package
Storage Period
Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation
of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the
passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.
■Packaging
Methods, Soldering Conditions and Safety Precautions
Please see Data Files.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Sep. 2012
1
Discontinued
EA Type 3225 (1210)
Dimensions in mm (not to scale)
Marking
Fixed Inductors (Chip Inductors)
Recommended Land Pattern in mm (not to scale)
2.5±0.2
1.9±0.1
3.2±0.3
1.6 to 2.0
4.0 to 4.6
0.6±0.2
Standard Packing Quantity
2000 pcs./Reel
Standard Parts
Part No.
ELJ EA1R0MF
ELJ EA1R5MF
ELJ EA2R2MF
ELJ EA3R3MF
ELJ EA4R7MF
ELJ EA6R8MF
ELJ EA100KF
ELJ EA150KF
ELJ EA220KF
ELJ EA330KF
ELJ EA470KF
ELJ EA680KF
ELJ EA101KF
ELJ EA151KF
ELJ EA221KF
ELJ EA331KF
(μH)
1.0
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
150
220
330
0.796
20
0.796
K : ±10 %
2.52
10
2.52
M : ±20 %
7.96
7
7.96
Inductance
Tolerance Test Freq.
(%)
(MHz)
Q
min.
Test Freq.
(MHz)
SRF
½1
(MHz) min.
100
80
65
50
46
36
29
25
18
16
13
10
8.0
7.0
5.0
4.0
R
DC
½2
(Ω) ±30%
0.07
0.08
0.10
0.12
0.14
0.19
0.26
0.32
0.50
0.70
1.0
1.5
2.4
3.1
5.5
7.1
DC Current
(mA) max.
500
390
350
270
240
200
160
145
115
95
80
60
50
45
35
30
½1
: Self Resonant Frequency
½2
: DC Resistance
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Sep. 2012
2.2±0.2
2
1.9 to 2.4
Fixed Inductors (Chip Inductors)
Packaging Methods (Taping)
Punched Carrier Tape Dimensions in mm (not to scale)
t
1
P
0
fD
0
E
Type
□F
A
RF, QF, PF
0.71
P
2
RF, QF, PF
2.0
B
1.21
P
0
4.0
W
8.0
0D
0
01.5
E
1.75
t
1
0.7
max.
F
3.5
t
2
1.0
max.
P
1
2.0
Part
t
2
P
1
P
2
A
Tape running
direction
Embossed Carrier Tape Dimensions in mm (not to scale)
B
F
W
Type
□E,
Type ND, Type
□C
A
B
1.8
2.25
2.90
P
0
4.0
4.0
4.0
W
8.0
8.0
8.0
0D
0
01.5
01.5
01.5
E
1.75
1.75
1.75
0D
1
F
3.5
3.5
3.5
t
1
P
1
4.0
4.0
4.0
t
2
1.2
RE, QE, PE
1.0
1.45
t
1
f
D
0
E
ND
W
A
F
B
NC, FC, PC, LC, SC 2.40
P
2
RE, QE, PE
2.0
2.0
2.0
Tape running
direction
00.6
(0.27)
Chip
component
t
2
f
D
1
P
1
P
2
P
0
ND
NC, FC, PC, LC, SC
01.0
(0.25) 1.55
01.1
(0.25) 1.85
t
1
E
f
D
0
Type
□A
A
W
B
3.60
P
0
4.0
W
8.0
0D
0
E
1.75
t
1
F
3.5
t
2
P
1
4.0
A
B
F
NA, FA, PA, LA,
2.80
SA, EA, DA
P
2
NA, FA, PA, LA,
SA, EA, DA
Type
□B
t
2
Chip component
P
1
P
2
P
0
Tape running
direction
2.0
01.5
(0.25) 2.40
E
t
1
A
f
D
0
P
2
P
0
A
W
B
4.90
P
0
4.0
W
12.0
0D
0
E
1.75
t
1
F
5.5
t
2
P
1
8.0
FB, PB
3.60
P
2
B
F
t
2
Chip component
P
1
Tape running direction
FB, PB
2.0
01.5
(0.30) 3.50
Taping Reel Dimensions in mm (not to scale)
Parts
E
C
B
Types
A
B
60
60
C
13
13
D
21
21
E
2
2
W
9
13
D
W
A
RF, QF, PF, RE, QE, PE, ND,
180
NC, FC, PC, LC, SC,
NA, FA, PA, LA, SA, EA, DA
FB, PB
180
Standard Packing Quantity/Reel
Quantity
Types
RF, QF, PF
RE, QE, PE, ND
NC, FC, PC, LC, SC
NA, FA, PA, LA, SA, EA, DA
FB, PB
Quantity
10000
3000
2000
2000
500
pcs.
pcs.
pcs.
pcs.
pcs.
½
Under conditions of high temperature and humidity
deterioration of the taping and packaging may be
accelerated.
Please carefully control storage conditions and use the
product within 6 months of receipt.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 Sep. 2012
3
Fixed Inductors (Chip Inductors)
Soldering Conditions
Reflow soldering conditions
Temperature (°C)
T3
T2
T1
t1
t2
0
Time
Pb free solder recommended temperature profile
Type
□F
□E
□D
□C
□A
□B
Preheat
T1 [°C]
150 to 180
150 to 180
150 to 180
150 to 180
150 to 180
150 to 180
t1 [s]
60 to 120
60 to 120
60 to 120
60 to 120
60 to 120
60 to 120
Soldering
T2 [°C]
230 °C
230 °C
230 °C
230 °C
230 °C
230 °C
t2 [s]
40 max.
40 max.
40 max.
40 max.
40 max.
40 max.
Peak Temperature
T3
250 °C, 10 s
250 °C, 10 s
245 °C, 10 s
245 °C, 10 s
245 °C, 10 s
245 °C, 10 s
T3 Limit
260 °C, 10 s
260 °C, 10 s
250 °C, 10 s
250 °C, 10 s
250 °C, 10 s
250 °C, 10 s
Time of
Reflow
2 times max.
2 times max.
2 times max.
2 times max.
2 times max.
2 times max.
Flow soldering conditions
Preheat: 130 to 150 °C, 60 to 180 s, Soldering: 260 °C, 5 s max.
Notes
Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation
of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the
passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.
In case the product has been stored for a period longer than 6 months, use the product only after confirmation of its
solderability.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 Sep. 2012
4
Fixed Inductors (Chip Inductors)
Safety Precautions
(Common precautions for Chip Inductors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (au to mo bile, train, vessel), traffic lights, medical equipment, aerospace equipment, elec tric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
½
Systems equipped with a protection circuit and a protection device
½
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
Precautions for use
1. Operation range and environments
1
These products are designed and manufactured for general and stan dard use in general elec tron ic
equipment (e.g. AV equipment, home electric applianc es, office equipment, information and com mu nication
equipment)
2
These products are not intended for use in the following special conditions. Before using the products, carefully check
the effects on their quality and performance, and determine whether or not they can be used.
• In liquid, such as water, oil, chemicals, or organic solvent
• In direct sunlight, outdoors, or in dust
• In salty air or air with a high concentration of corrosive gas, such as Cl
2
, H
2
S, NH
3
, SO
2
, or NO
2
• In an environment where these products cause dew condensation
1
Do not bring magnets or magnetized materials close to the product. The influence of their magnetic field can
change the inductance value.
2
Do not apply strong mechanical shocks by either dropping or collision with other parts.
Excessive schock can damage the part.
2. Handling
1
Please refer to the recommended land pattern for each type shown on the datasheet.
2
Avoid placing the chip inductor on any metal pattern except the recommended land pattern because a drop of Q
and mutual conductance may occur.
3
In case of flow soldering, venting of soldering flux gases should be made for high density assemblies to get a
good solder connection.
4
In case of reflow soldering, consider the layout because taller components close to chip inductor tend to block
thermal conduction.
3. Land pattern design
1
In general, magnetic and electric characteristics of ferrite cores can be changed by applying excessively strong
force. Placement force should not exceed 20 N.
2
Do not bend or twist the PWB after mounting the part.
4. Mounting
5. Cleaning
1
Do not use acid or alkali agents. Some cleaning solvents may damage the part.
Confirm by testing the reliability in advance of mass production.
2
If Ultrasonic cleaning is used, please confirm the reliability in advance.
It is possible that combined resonance of component and PWB and cavitation can cause an abnormal vibration
mode to exist causing damage.
6. Caution about applying excessive current
The rated current is defined as the smaller value of either the current value when the inductance drops 10 %
down from the initial point or the current value when the average temperature of coil inside rises 20 °C up from
the initial point. Do not operate product over the specific max. current.
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Sep. 2012
5
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