05211
EMIF2SPK-10FCC
Only One Name Means ProT
ek’Tion™
EMI FIL
TER/TVS ARRA
Y
APPLICA
TIONS
✔
Cellular Phones
✔
Notebooks
✔
Personal Digital Assistant (PDA)
✔
Ground Positioning System (GPS)
✔
Audio Ports
IEC COMPA
TIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
✔
ESD Protection > 25 kilovolts
✔
Bidirectional EMI Filtering/TVS Low Pass Filters
✔
Low Insertion Loss: -3db Roll-Off @ 80MHz
✔
Bidirectional Configuration
✔
Protects Up to Two(2) Signal Lines
✔
RoHS Compliant on Lead-Free Versions
MECHANICAL CHARACTERISTICS
✔
5 Bump Flip Chip Package
✔
Weight 0.73 milligrams (Approximate)
✔
Available in Tin-Lead or Lead-Free Plating
✔
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔
Flammability Rating UL 94V-0
✔
8mm Tape and Reel Per EIA Standard 481
PIN CONFIGURA
TION
5 BUMP FC
G
05211.R1 9/05
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EMIF2SPK-10FCC
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Operating Temperature
Storage Temperature
DC Power Per Resistor
Typical Resistance (@ ±15% Tolerance)
SYMBOL
T
J
T
STG
P
R
VALUE
-40°C to 85°C
-55°C to 150°C
100
10
UNITS
°C
°C
mW
OHMS
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
DIODE
LEAKAGE
CURRENT
@ 5V
I
D
µA
1
MINIMUM
ATTENUATION
CUT-OFF
FREQUENCY
(50 Ohms I/O
ZERO BIAS)
TYPICAL
CAPACITANCE
PER LINE
(See Note 1)
@0V, 1 MHz
C
pF
80
V
WM
VOLTS
EMIF2SPK-10FCC
Note 1:
±20% tolerance.
@ 1mA
V
(BR)
VOLTS
6.0
@
800-3000 MHz
dB
30
fc
MHz
80
5.0
05211.R1 9/05
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EMIF2SPK-10FCC
APPLICA
TION INFORMA
TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-270°C
T
P
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
T
P
Ramp-up
Temperature - °C
Ramp-down
T
L
T
SMAX
155°
T
SMIN
140°
T
S
- Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
05211.R1 9/05
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EMIF2SPK-10FCC
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
BOTTOM VIEW
PACKAGE DIMENSIONS
MILLIMETERS
DIM
MIN
0.914
1.285
0.495
0.245
0.430
0.430
0.180
0.180
0.432
0.330
INCHES
MIN
0.036
0.0506
0.0195
0.0096
0.0169
0.0169
0.0071
0.0071
0.017
0.013
A
G
C
O
G
H
I
1
2
D
I
J
E
F
B
SIDE VIEW
MAX
1.016
1.375
0.505
0.255
0.440
0.440
0.280
0.280
0.559
0.457
MAX
0.040
0.0541
0.0199
0.0100
0.0173
0.0173
0.0110
0.0110
0.022
0.018
A
B
C
D
E
F
G
H
I
J
0.30 DIA.
63/67 Sn/Pb
SOLDER BUMPS
NOTE:
1. Controlling dimensions in millimeters.
Outline & Dimensions: Rev 0 - 3/04, 06055
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia.
178mm (7”)
Tape Width
8mm
A0
B0
K0
D
E
F
W
P0
P2
P
t
1.08 ± 0.05 1.60 ± 0.05 0.72 ± 0.05 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 0.20±0.025
P0
t
D
P2
10 Pitches Cumulative
Tolerance on Tape. ± 0.2
E
Top cover tape
A0
K0
B0
F
W
P
User Direction of Feed
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA-481.
2. Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e.,
EMIF2SPK-10FCC-T73-1.
3. Suffix - LF - Lead-Free, i.e.,
EMIF2SPK-10FCC-LF-T73-1.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
05211.R1 9/05
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DSP 与 ARM 处理器
