05206
EMIF4-100FCD4
EMI FILTER/TVS ARRAY
APPLICATIONS
✔
Cellular Phones
✔
Notebooks
✔
Personal Digital Assistant (PDA)
✔
Ground Positioning System (GPS)
✔
SMART Card
IEC COMPATIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
15 BUMP FLIP CHIP
FEATURES
✔
ESD Protection > 25 kilovolts
✔
4 Symmetrical I/O Channel EMI Filtering/TVS for ESD Protection
✔
Low Insertion Loss: -3db Roll-Off @ 60MHz
✔
Four Seperate TVS Diodes for ESD Protection
✔
Low Lead Inductance
✔
RoHS Compliant
MECHANICAL CHARACTERISTICS
✔
15 Bump Flip Chip Package
✔
Weight 0.73 milligrams (Approximate)
✔
Available in Lead-Free Plating
✔
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔
Consult Factory for Leaded Device Availability
✔
Flammability Rating UL 94V-0
✔
8mm Tape and Reel Per EIA Standard 481
PIN CONFIGURATION
D2
I/O1
I/O2
I/O3
I/O4
D4
G1
G2
G3
D1
I/O1
I/O2
I/O3
I/O4
D3
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EMIF4-100FCD4
DEVICE CHARACTERISTICS
MAXIMUM RATINGS
@ 25°C Unless Otherwise Specified
PARAMETER
Operating Temperature
Storage Temperature
DC Power Per Resistor
Typical Resistance @ ± 20%
SYMBOL
T
A
T
STG
P
R
VALUE
-40 to 85
-55 to 150
100
100
UNITS
°C
°C
mW
OHMS
ELECTRICAL CHARACTERISTICS PER LINE
PART
NUMBER
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
REVERSE
LEAKAGE
CURRENT
@3.3V
I
D
µA
0.5
@ 25°C Unless Otherwise Specified
MINIMUM
ATTENUATION
CUT-OFF
FREQUENCY
(50 OHMS I/O)
ZERO BIAS
TYPICAL
CAPACITANCE
PER LINE
(See Note 1)
@2.5V, 1MHz
C
LINE
pF
30
TYPICAL
FORWARD
VOLTAGE
V
WM
VOLTS
EMIF4-100FCD4
Note 1:
± 20% tolerance.
5.0
@ 1mA
V
(BR)
VOLTS
6.0
@10mA
V
F
VOLTS
0.8
@
800-3000 MHz
dB
30
fC
MHz
60
1.100
FIGURE 1
RESISTANCE VS TEMPERATURE
(Normalized to Resistance at 25°C)
Normalized Resistance
1.060
1.020
0.980
0.940
0.900
-40
-20
0
20
40
Temperature °C
60
80
100
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EMIF4-100FCD4
GRAPHS
FIGURE 2
INSERTION LOSS - EMIF4-100FCD4
0
-5
-10
-15
Gain (dB)
-20
-25
-30
-35
-40
-45
-50
0.1
1
10
100
0 Volts
2.5 Volts
1000
10000
Frequency (MHz)
FIGURE 3
OVERSHOOT & CLAMPING VOLTAGE
35
5 Volts per Division
25
15
5
-5
ESD Test Pulse: +15 kilovolt, 1/30ns (waveform)
FIGURE 4
OVERSHOOT & FORWARD CLAMPING VOLTAGE
4
1 Volts per Division
2
0
-2
-4
ESD Test Pulse: -15 kilovolt, 1/30ns (waveform)
05206.R3 2/07
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EMIF4-100FCD4
SOLDER RECOMMENDATIONS
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-270°C
T
P
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
T
P
Ramp-up
Temperature - °C
Ramp-down
T
L
T
SMAX
155°
T
SMIN
140°
T
S
- Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
05206.R3 2/07
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EMIF4-100FCD4
15 BUMP FLIP CHIP PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
BOTTOM VIEW
PACKAGE DIMENSIONS
MILLIMETERS
INCHES
MIN
0.1148
0.0506
0.0195
0.0096
0.0169
0.0169
0.0071
0.0071
0.0170
0.0130
A
G
O
G
I
1
0.30 DIA.
63/67 Sn/Pb
Solder Bumps
C
D
E
F
H
DIM
SIDE VIEW
MIN
2.915
1.285
0.495
0.245
0.430
0.430
0.180
0.180
0.432
0.330
MAX
3.005
1.375
0.505
0.255
0.440
0.440
0.280
0.280
0.559
0.457
MAX
0.1183
0.0541
0.0199
0.0100
0.0173
0.0173
0.0110
0.0110
0.0220
0.0180
B
A
B
C
D
E
F
G
H
I
J
2
3
4
5
6
I
J
NOTE:
1. Controlling dimensions in millimeters.
SOLDER PAD LAYOUT
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance
with EIA-481.
2. Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces
per reel, i.e.,
EMIF4-100FCD4-T73-1.
3. Suffix - LF = Lead-Free, i.e.,
EMIF4-100FCD4LF-T73-1.
4. Suffix - C = Coated Version, i.e.,
EMIF4-100FCD4-LF-T73C-1.
0.86
Non solder mask defined pad
0.275mm
Solder mask opening
0.325mm
Solder stencil opening
0.330mm
0.50
0.25
Outline & Dimensions: Rev 2 - 8/06, 06042
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia.
178mm (7”)
Tape Width
8mm
A0
B0
K0
D
E
F
W
P0
P2
P
t
1.78 ± 0.05 3.35 ± 0.05 0.76 ± 0.05 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 0.20±0.025
P0
t
D
P2
10 Pitches Cumulative
Tolerance on Tape. ± 0.2
MARKING CODE
DIAGRAM
FCD4
FCD4
FCD4
E
Top cover tape
A0
K0
B0
F
W
P
User Direction of Feed
COPYRIGHT © ProTek Devices 2007
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
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