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EP2C15AF484C8

Field Programmable Gate Array, 14448-Cell, PBGA484, FBGA-484

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:Intel(英特尔)

厂商官网:http://www.intel.com/

下载文档
器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Intel(英特尔)
包装说明
FBGA-484
Reach Compliance Code
compliant
其他特性
ALSO REQUIRES 3.3 SUPPLY
JESD-30 代码
S-PBGA-B484
JESD-609代码
e0
长度
23 mm
输入次数
315
逻辑单元数量
14448
输出次数
307
端子数量
484
最高工作温度
85 °C
最低工作温度
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA484,22X22,40
封装形状
SQUARE
封装形式
GRID ARRAY
峰值回流温度(摄氏度)
220
电源
1.2,1.5/3.3,3.3 V
可编程逻辑类型
FIELD PROGRAMMABLE GATE ARRAY
认证状态
Not Qualified
座面最大高度
2.6 mm
最大供电电压
1.25 V
最小供电电压
1.15 V
标称供电电压
1.2 V
表面贴装
YES
温度等级
COMMERCIAL EXTENDED
端子面层
TIN LEAD
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
宽度
23 mm
文档预览
Cyclone II Device Handbook, Volume 1
101 Innovation Drive
San Jose, CA 95134
www.altera.com
CII5V1-3.2
Copyright © 2007 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device des-
ignations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
service marks of Altera Corporation in the U.S. and other countries. All other product or service names are the property of their respective holders. Al-
tera products are protected under numerous U.S. and foreign patents and pending applications, maskwork rights, and copyrights. Altera warrants
performance of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make
changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the ap-
plication or use of any information, product, or service described herein except as expressly agreed to in writing by Altera
Corporation. Altera customers are advised to obtain the latest version of device specifications before relying on any published in-
formation and before placing orders for products or services
.
ii
Altera Corporation
Contents
Chapter Revision Dates ........................................................................... xi
About This Handbook ............................................................................ xiii
How to Contact Altera .......................................................................................................................... xiii
Typographic Conventions .................................................................................................................... xiii
Section I. Cyclone II Device Family Data Sheet
Revision History .................................................................................................................................... 1–1
Chapter 1. Introduction
Introduction ............................................................................................................................................
Low-Cost Embedded Processing Solutions ..................................................................................
Low-Cost DSP Solutions .................................................................................................................
Features ...................................................................................................................................................
Document Revision History .................................................................................................................
1–1
1–1
1–1
1–2
1–8
Chapter 2. Cyclone II Architecture
Functional Description .......................................................................................................................... 2–1
Logic Elements ....................................................................................................................................... 2–2
LE Operating Modes ........................................................................................................................ 2–4
Logic Array Blocks ................................................................................................................................ 2–7
LAB Interconnects ............................................................................................................................ 2–8
LAB Control Signals ......................................................................................................................... 2–8
MultiTrack Interconnect ..................................................................................................................... 2–10
Row Interconnects .......................................................................................................................... 2–10
Column Interconnects .................................................................................................................... 2–12
Device Routing ............................................................................................................................... 2–15
Global Clock Network & Phase-Locked Loops ............................................................................... 2–16
Dedicated Clock Pins ..................................................................................................................... 2–20
Dual-Purpose Clock Pins .............................................................................................................. 2–20
Global Clock Network ................................................................................................................... 2–21
Global Clock Network Distribution ............................................................................................ 2–23
PLLs .................................................................................................................................................. 2–25
Embedded Memory ............................................................................................................................. 2–27
Memory Modes ............................................................................................................................... 2–30
Clock Modes .................................................................................................................................... 2–31
M4K Routing Interface .................................................................................................................. 2–31
Embedded Multipliers ........................................................................................................................ 2–32
Altera Corporation
iii
Contents
Multiplier Modes ............................................................................................................................
Embedded Multiplier Routing Interface .....................................................................................
I/O Structure & Features ....................................................................................................................
External Memory Interfacing .......................................................................................................
Programmable Drive Strength .....................................................................................................
Open-Drain Output ........................................................................................................................
Slew Rate Control ...........................................................................................................................
Bus Hold ..........................................................................................................................................
Programmable Pull-Up Resistor ..................................................................................................
Advanced I/O Standard Support ................................................................................................
High-Speed Differential Interfaces ..............................................................................................
Series On-Chip Termination .........................................................................................................
I/O Banks ........................................................................................................................................
MultiVolt I/O Interface .................................................................................................................
2–35
2–36
2–37
2–44
2–49
2–50
2–51
2–51
2–51
2–52
2–53
2–55
2–57
2–60
Chapter 3. Configuration & Testing
IEEE Std. 1149.1 (JTAG) Boundary Scan Support .............................................................................
Configuration .........................................................................................................................................
Operating Modes ...................................................................................................................................
Configuration Schemes .........................................................................................................................
Cyclone II Automated Single Event Upset Detection ......................................................................
Custom-Built Circuitry ....................................................................................................................
Software Interface .............................................................................................................................
Document Revision History .................................................................................................................
3–1
3–5
3–5
3–6
3–7
3–7
3–7
3–8
Chapter 4. Hot Socketing & Power-On Reset
Introduction ............................................................................................................................................
Cyclone II Hot-Socketing Specifications ............................................................................................
Devices Can Be Driven before Power-Up .....................................................................................
I/O Pins Remain Tri-Stated during Power-Up ............................................................................
Hot-Socketing Feature Implementation in Cyclone II Devices .......................................................
Power-On Reset Circuitry ....................................................................................................................
"Wake-up" Time for Cyclone II Devices .......................................................................................
Conclusion ..............................................................................................................................................
Document Revision History .................................................................................................................
4–1
4–1
4–2
4–2
4–3
4–5
4–5
4–7
4–7
Chapter 5. DC Characteristics & Timing Specifications
Operating Conditions ........................................................................................................................... 5–1
Single-Ended I/O Standards .......................................................................................................... 5–5
Differential I/O Standards .............................................................................................................. 5–7
DC Characteristics for Different Pin Types ..................................................................................... 5–11
On-Chip Termination Specifications ........................................................................................... 5–12
Power Consumption ........................................................................................................................... 5–13
Timing Specifications .......................................................................................................................... 5–14
Preliminary & Final Timing Specifications ................................................................................. 5–14
Performance .................................................................................................................................... 5–15
Internal Timing ............................................................................................................................... 5–18
iv
Cyclone II Device Handbook, Volume 1
Altera Corporation
Contents
Cyclone II Clock Timing Parameters ...........................................................................................
Clock Network Skew Adders .......................................................................................................
IOE Programmable Delay .............................................................................................................
Default Capacitive Loading of Different I/O Standards ..........................................................
I/O Delays .......................................................................................................................................
Maximum Input & Output Clock Rate .......................................................................................
High Speed I/O Timing Specifications .......................................................................................
External Memory Interface Specifications ..................................................................................
JTAG Timing Specifications ..........................................................................................................
PLL Timing Specifications ............................................................................................................
Duty Cycle Distortion .........................................................................................................................
DCD Measurement Techniques ...................................................................................................
Document Revision History ...............................................................................................................
5–22
5–28
5–29
5–30
5–31
5–43
5–52
5–60
5–61
5–63
5–64
5–65
5–71
Chapter 6. Reference & Ordering Information
Software ..................................................................................................................................................
Device Pin-Outs .....................................................................................................................................
Ordering Information ...........................................................................................................................
Document Revision History .................................................................................................................
6–1
6–1
6–1
6–2
Section II. Clock Management
Revision History .................................................................................................................................... 6–1
Chapter 7. PLLs in Cyclone II Devices
Introduction ............................................................................................................................................ 7–1
Cyclone II PLL Hardware Overview .................................................................................................. 7–2
PLL Reference Clock Generation ................................................................................................... 7–6
Clock Feedback Modes ....................................................................................................................... 7–10
Normal Mode .................................................................................................................................. 7–10
Zero Delay Buffer Mode ................................................................................................................ 7–11
No Compensation Mode ............................................................................................................... 7–12
Source-Synchronous Mode ........................................................................................................... 7–13
Hardware Features .............................................................................................................................. 7–14
Clock Multiplication & Division .................................................................................................. 7–14
Programmable Duty Cycle ........................................................................................................... 7–15
Phase-Shifting Implementation .................................................................................................... 7–16
Control Signals ................................................................................................................................ 7–17
Manual Clock Switchover ............................................................................................................. 7–20
Clocking ................................................................................................................................................ 7–21
Global Clock Network ................................................................................................................... 7–21
Clock Control Block ....................................................................................................................... 7–24
Global Clock Network Clock Source Generation ...................................................................... 7–26
Global Clock Network Power Down ........................................................................................... 7–28
clkena signals .................................................................................................................................. 7–29
Board Layout ........................................................................................................................................ 7–30
Altera Corporation
v
Cyclone II Device Handbook, Volume 1
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