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EP2C35F484C8

FPGA, 2076 CLBS, 402.5 MHz, PBGA484
现场可编程门阵列, 2076 CLBS, 402.5 MHz, PBGA484

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:Altera (Intel)

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Altera (Intel)
零件包装代码
BGA
包装说明
FBGA-484
针数
484
Reach Compliance Code
_compli
ECCN代码
3A991
其他特性
ALSO REQUIRES 3.3 SUPPLY
最大时钟频率
402.5 MHz
JESD-30 代码
S-PBGA-B484
JESD-609代码
e0
长度
23 mm
湿度敏感等级
3
可配置逻辑块数量
2076
输入次数
322
逻辑单元数量
33216
输出次数
306
端子数量
484
最高工作温度
85 °C
最低工作温度
组织
2076 CLBS
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA484,22X22,40
封装形状
SQUARE
封装形式
GRID ARRAY
峰值回流温度(摄氏度)
220
电源
1.2,1.5/3.3,3.3 V
可编程逻辑类型
FIELD PROGRAMMABLE GATE ARRAY
认证状态
Not Qualified
座面最大高度
2.6 mm
最大供电电压
1.25 V
最小供电电压
1.15 V
标称供电电压
1.2 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子面层
Tin/Lead (Sn63Pb37)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
宽度
23 mm
文档预览
Cyclone II Device Handbook, Volume 1
101 Innovation Drive
San Jose, CA 95134
www.altera.com
CII5V1-3.3
Copyright © 2008 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device des-
ignations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
service marks of Altera Corporation in the U.S. and other countries. All other product or service names are the property of their respective holders. Al-
tera products are protected under numerous U.S. and foreign patents and pending applications, maskwork rights, and copyrights. Altera warrants
performance of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make
changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the ap-
plication or use of any information, product, or service described herein except as expressly agreed to in writing by Altera
Corporation. Altera customers are advised to obtain the latest version of device specifications before relying on any published in-
formation and before placing orders for products or services
.
ii
Altera Corporation
Contents
Chapter Revision Dates ........................................................................... xi
About This Handbook ............................................................................ xiii
How to Contact Altera .......................................................................................................................... xiii
Typographic Conventions .................................................................................................................... xiii
Section I. Cyclone II Device Family Data Sheet
Revision History .................................................................................................................................... 1–1
Chapter 1. Introduction
Introduction ............................................................................................................................................
Low-Cost Embedded Processing Solutions ..................................................................................
Low-Cost DSP Solutions .................................................................................................................
Features ...................................................................................................................................................
Referenced Documents .........................................................................................................................
Document Revision History .................................................................................................................
1–1
1–1
1–1
1–2
1–9
1–9
Chapter 2. Cyclone II Architecture
Functional Description .......................................................................................................................... 2–1
Logic Elements ....................................................................................................................................... 2–2
LE Operating Modes ........................................................................................................................ 2–4
Logic Array Blocks ................................................................................................................................ 2–7
LAB Interconnects ............................................................................................................................ 2–8
LAB Control Signals ......................................................................................................................... 2–8
MultiTrack Interconnect ..................................................................................................................... 2–10
Row Interconnects .......................................................................................................................... 2–10
Column Interconnects .................................................................................................................... 2–12
Device Routing ............................................................................................................................... 2–15
Global Clock Network & Phase-Locked Loops ............................................................................... 2–16
Dedicated Clock Pins ..................................................................................................................... 2–20
Dual-Purpose Clock Pins .............................................................................................................. 2–20
Global Clock Network ................................................................................................................... 2–21
Global Clock Network Distribution ............................................................................................ 2–23
PLLs .................................................................................................................................................. 2–25
Embedded Memory ............................................................................................................................. 2–27
Memory Modes ............................................................................................................................... 2–30
Clock Modes .................................................................................................................................... 2–31
M4K Routing Interface .................................................................................................................. 2–31
Altera Corporation
iii
Contents
Embedded Multipliers ........................................................................................................................
Multiplier Modes ............................................................................................................................
Embedded Multiplier Routing Interface .....................................................................................
I/O Structure & Features ....................................................................................................................
External Memory Interfacing .......................................................................................................
Programmable Drive Strength .....................................................................................................
Open-Drain Output ........................................................................................................................
Slew Rate Control ...........................................................................................................................
Bus Hold ..........................................................................................................................................
Programmable Pull-Up Resistor ..................................................................................................
Advanced I/O Standard Support ................................................................................................
High-Speed Differential Interfaces ..............................................................................................
Series On-Chip Termination .........................................................................................................
I/O Banks ........................................................................................................................................
MultiVolt I/O Interface .................................................................................................................
2–32
2–35
2–36
2–37
2–44
2–49
2–50
2–51
2–51
2–51
2–52
2–53
2–55
2–57
2–60
Chapter 3. Configuration & Testing
IEEE Std. 1149.1 (JTAG) Boundary Scan Support .............................................................................
Configuration .........................................................................................................................................
Operating Modes ...................................................................................................................................
Configuration Schemes .........................................................................................................................
Cyclone II Automated Single Event Upset Detection ......................................................................
Custom-Built Circuitry ....................................................................................................................
Software Interface .............................................................................................................................
Document Revision History .................................................................................................................
3–1
3–5
3–5
3–6
3–7
3–7
3–7
3–8
Chapter 4. Hot Socketing & Power-On Reset
Introduction ............................................................................................................................................
Cyclone II Hot-Socketing Specifications ............................................................................................
Devices Can Be Driven before Power-Up .....................................................................................
I/O Pins Remain Tri-Stated during Power-Up ............................................................................
Hot-Socketing Feature Implementation in Cyclone II Devices .......................................................
Power-On Reset Circuitry ....................................................................................................................
"Wake-up" Time for Cyclone II Devices .......................................................................................
Conclusion ..............................................................................................................................................
Document Revision History .................................................................................................................
4–1
4–1
4–2
4–2
4–3
4–5
4–5
4–7
4–7
Chapter 5. DC Characteristics and Timing Specifications
Operating Conditions ........................................................................................................................... 5–1
Single-Ended I/O Standards .......................................................................................................... 5–5
Differential I/O Standards .............................................................................................................. 5–7
DC Characteristics for Different Pin Types ..................................................................................... 5–11
On-Chip Termination Specifications ........................................................................................... 5–12
Power Consumption ........................................................................................................................... 5–13
Timing Specifications .......................................................................................................................... 5–14
Preliminary and Final Timing Specifications ............................................................................. 5–14
Performance .................................................................................................................................... 5–15
iv
Cyclone II Device Handbook, Volume 1
Altera Corporation
Contents
Internal Timing ...............................................................................................................................
Cyclone II Clock Timing Parameters ...........................................................................................
Clock Network Skew Adders .......................................................................................................
IOE Programmable Delay .............................................................................................................
Default Capacitive Loading of Different I/O Standards ..........................................................
I/O Delays .......................................................................................................................................
Maximum Input and Output Clock Rate ....................................................................................
High Speed I/O Timing Specifications .......................................................................................
External Memory Interface Specifications ..................................................................................
JTAG Timing Specifications ..........................................................................................................
PLL Timing Specifications ............................................................................................................
Duty Cycle Distortion .........................................................................................................................
DCD Measurement Techniques ...................................................................................................
Referenced Documents .......................................................................................................................
Document Revision History ...............................................................................................................
5–18
5–23
5–29
5–30
5–31
5–33
5–46
5–55
5–63
5–64
5–66
5–67
5–68
5–74
5–74
Chapter 6. Reference & Ordering Information
Software ..................................................................................................................................................
Device Pin-Outs .....................................................................................................................................
Ordering Information ...........................................................................................................................
Document Revision History .................................................................................................................
6–1
6–1
6–1
6–2
Section II. Clock Management
Revision History .................................................................................................................................... 6–1
Chapter 7. PLLs in Cyclone II Devices
Introduction ............................................................................................................................................ 7–1
Cyclone II PLL Hardware Overview .................................................................................................. 7–2
PLL Reference Clock Generation ................................................................................................... 7–6
Clock Feedback Modes ....................................................................................................................... 7–10
Normal Mode .................................................................................................................................. 7–10
Zero Delay Buffer Mode ................................................................................................................ 7–11
No Compensation Mode ............................................................................................................... 7–12
Source-Synchronous Mode ........................................................................................................... 7–13
Hardware Features .............................................................................................................................. 7–14
Clock Multiplication & Division .................................................................................................. 7–14
Programmable Duty Cycle ........................................................................................................... 7–15
Phase-Shifting Implementation .................................................................................................... 7–16
Control Signals ................................................................................................................................ 7–17
Manual Clock Switchover ............................................................................................................. 7–20
Clocking ................................................................................................................................................ 7–21
Global Clock Network ................................................................................................................... 7–21
Clock Control Block ....................................................................................................................... 7–24
Global Clock Network Clock Source Generation ...................................................................... 7–26
Global Clock Network Power Down ........................................................................................... 7–28
Altera Corporation
v
Cyclone II Device Handbook, Volume 1
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参数对比
与EP2C35F484C8相近的元器件有:EP2S15F484I4N、EP2S60F672I4N、EP2S90F1020I4。描述及对比如下:
型号 EP2C35F484C8 EP2S15F484I4N EP2S60F672I4N EP2S90F1020I4
描述 FPGA, 2076 CLBS, 402.5 MHz, PBGA484 FPGA, 780 CLBS, 717 MHz, PBGA484 FPGA, 3022 CLBS, 717 MHz, PBGA672 FPGA, 1172 CLBS, 402.5 MHz, PBGA256
是否无铅 含铅 不含铅 不含铅 含铅
是否Rohs认证 不符合 符合 符合 不符合
厂商名称 Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
零件包装代码 BGA BGA BGA BGA
包装说明 FBGA-484 BGA, BGA484,22X22,40 BGA, BGA672,26X26,40 33 X 33 MM, 1 MM PITCH, FBGA-1020
针数 484 484 672 1020
Reach Compliance Code _compli compliant compli _compli
ECCN代码 3A991 3A991 3A991 3A001.A.7.A
最大时钟频率 402.5 MHz 717 MHz 717 MHz 717 MHz
JESD-30 代码 S-PBGA-B484 S-PBGA-B484 S-PBGA-B672 S-PBGA-B1020
JESD-609代码 e0 e1 e1 e0
长度 23 mm 23 mm 27 mm 33 mm
湿度敏感等级 3 3 3 3
可配置逻辑块数量 2076 780 3022 36384
输入次数 322 342 492 758
逻辑单元数量 33216 15600 60440 90960
输出次数 306 334 484 750
端子数量 484 484 672 1020
最高工作温度 85 °C 100 °C 100 °C 100 °C
最低工作温度 - -40 °C -40 °C -40 °C
组织 2076 CLBS 780 CLBS 3022 CLBS 36384 CLBS
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA
封装等效代码 BGA484,22X22,40 BGA484,22X22,40 BGA672,26X26,40 BGA1020,32X32,40
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 220 260 245 220
电源 1.2,1.5/3.3,3.3 V 1.2,1.5/3.3,3.3 V 1.2,1.5/3.3,3.3 V 1.2,1.5/3.3,3.3 V
可编程逻辑类型 FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.6 mm 3.5 mm 3.5 mm 3.5 mm
最大供电电压 1.25 V 1.25 V 1.25 V 1.25 V
最小供电电压 1.15 V 1.15 V 1.15 V 1.15 V
标称供电电压 1.2 V 1.2 V 1.2 V 1.2 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 OTHER INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 40 40 30
宽度 23 mm 23 mm 27 mm 33 mm
CLB-Max的组合延迟 - 5.117 ns 5.117 ns 5.117 ns
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