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EP2S130F780C5

FPGA - Field Programmable Gate Array FPGA - Stratix II 6627 LABs 534 IOs

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:Altera (Intel)

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
零件包装代码
BGA
包装说明
29 X 29 MM, 1 MM PITCH, FBGA-780
针数
780
Reach Compliance Code
not_compliant
ECCN代码
3A001.A.7.A
最大时钟频率
640 MHz
CLB-Max的组合延迟
5.962 ns
JESD-30 代码
S-PBGA-B780
JESD-609代码
e0
长度
29 mm
湿度敏感等级
3
可配置逻辑块数量
53016
输入次数
534
逻辑单元数量
132540
输出次数
526
端子数量
780
最高工作温度
85 °C
最低工作温度
组织
53016 CLBS
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA780,28X28,40
封装形状
SQUARE
封装形式
GRID ARRAY
峰值回流温度(摄氏度)
220
电源
1.2,1.5/3.3,3.3 V
可编程逻辑类型
FIELD PROGRAMMABLE GATE ARRAY
认证状态
Not Qualified
座面最大高度
3.5 mm
最大供电电压
1.25 V
最小供电电压
1.15 V
标称供电电压
1.2 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子面层
Tin/Lead (Sn63Pb37)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
宽度
29 mm
Base Number Matches
1
文档预览
Stratix II Device Handbook, Volume 1
101 Innovation Drive
San Jose, CA 95134
www.altera.com
SII5V1-4.5
Copyright © 2011 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device des-
ignations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
service marks of Altera Corporation in the U.S. and other countries. All other product or service names are the property of their respective holders. Al-
tera products are protected under numerous U.S. and foreign patents and pending applications, maskwork rights, and copyrights. Altera warrants
performance of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make
changes to any products and services at any time without notice. Altera assumes no responsibility or liabil-
ity arising out of the application or use of any information, product, or service described herein except as
expressly agreed to in writing by Altera Corporation. Altera customers are advised to obtain the latest ver-
sion of device specifications before relying on any published information and before placing orders for
products or services
.
ii
Altera Corporation
Contents
Chapter Revision Dates .......................................................................... vii
About this Handbook ................................................................................ i
How to Contact Altera ............................................................................................................................... i
Typographic Conventions ......................................................................................................................... i
Section I. Stratix II Device Family Data Sheet
Revision History ....................................................................................................................... Section I–1
Chapter 1. Introduction
Introduction ............................................................................................................................................ 1–1
Features ................................................................................................................................................... 1–1
Document Revision History ................................................................................................................. 1–6
Chapter 2. Stratix II Architecture
Functional Description .......................................................................................................................... 2–1
Logic Array Blocks ................................................................................................................................ 2–3
LAB Interconnects ............................................................................................................................ 2–4
LAB Control Signals ......................................................................................................................... 2–5
Adaptive Logic Modules ...................................................................................................................... 2–6
ALM Operating Modes ................................................................................................................... 2–9
Register Chain ................................................................................................................................. 2–20
Clear & Preset Logic Control ........................................................................................................ 2–22
MultiTrack Interconnect ..................................................................................................................... 2–22
TriMatrix Memory ............................................................................................................................... 2–28
Memory Block Size ......................................................................................................................... 2–29
Digital Signal Processing Block ......................................................................................................... 2–40
Modes of Operation ....................................................................................................................... 2–44
DSP Block Interface ........................................................................................................................ 2–44
PLLs & Clock Networks ..................................................................................................................... 2–48
Global & Hierarchical Clocking ................................................................................................... 2–48
Enhanced & Fast PLLs ................................................................................................................... 2–57
Enhanced PLLs ............................................................................................................................... 2–68
Fast PLLs .......................................................................................................................................... 2–69
I/O Structure ........................................................................................................................................ 2–69
Double Data Rate I/O Pins ........................................................................................................... 2–77
External RAM Interfacing ............................................................................................................. 2–81
Programmable Drive Strength ..................................................................................................... 2–83
Altera Corporation
iii
Contents
Stratix II Device Handbook, Volume 1
Open-Drain Output ........................................................................................................................ 2–84
Bus Hold .......................................................................................................................................... 2–84
Programmable Pull-Up Resistor .................................................................................................. 2–85
Advanced I/O Standard Support ................................................................................................ 2–85
On-Chip Termination .................................................................................................................... 2–89
MultiVolt I/O Interface ................................................................................................................. 2–93
High-Speed Differential I/O with DPA Support ............................................................................ 2–96
Dedicated Circuitry with DPA Support .................................................................................... 2–100
Fast PLL & Channel Layout ........................................................................................................ 2–102
Document Revision History ............................................................................................................. 2–104
Chapter 3. Configuration & Testing
IEEE Std. 1149.1 JTAG Boundary-Scan Support ............................................................................... 3–1
SignalTap II Embedded Logic Analyzer ............................................................................................ 3–4
Configuration ......................................................................................................................................... 3–4
Operating Modes .............................................................................................................................. 3–5
Configuration Schemes ................................................................................................................... 3–7
Configuring Stratix II FPGAs with JRunner ............................................................................... 3–10
Programming Serial Configuration Devices with SRunner ..................................................... 3–10
Configuring Stratix II FPGAs with the MicroBlaster Driver ................................................... 3–11
PLL Reconfiguration ...................................................................................................................... 3–11
Temperature Sensing Diode (TSD) ................................................................................................... 3–11
Automated Single Event Upset (SEU) Detection ............................................................................ 3–13
Custom-Built Circuitry .................................................................................................................. 3–14
Software Interface ........................................................................................................................... 3–14
Document Revision History ............................................................................................................... 3–14
Chapter 4. Hot Socketing & Power-On Reset
Stratix II
Hot-Socketing Specifications ...............................................................................................................
Devices Can Be Driven Before Power-Up ....................................................................................
I/O Pins Remain Tri-Stated During Power-Up ...........................................................................
Signal Pins Do Not Drive the V
CCIO
, V
CCINT
or V
CCPD
Power Supplies ....................................
Hot Socketing Feature Implementation in Stratix II Devices ..........................................................
Power-On Reset Circuitry ....................................................................................................................
Document Revision History .................................................................................................................
4–1
4–2
4–2
4–2
4–3
4–5
4–6
Chapter 5. DC & Switching Characteristics
Operating Conditions ........................................................................................................................... 5–1
Absolute Maximum Ratings ........................................................................................................... 5–1
Recommended Operating Conditions .......................................................................................... 5–2
DC Electrical Characteristics .......................................................................................................... 5–3
I/O Standard Specifications ........................................................................................................... 5–4
Bus Hold Specifications ................................................................................................................. 5–17
On-Chip Termination Specifications ........................................................................................... 5–17
Pin Capacitance .............................................................................................................................. 5–19
Power Consumption ........................................................................................................................... 5–20
iv
Altera Corporation
Contents
Contents
Timing Model ....................................................................................................................................... 5–20
Preliminary & Final Timing .......................................................................................................... 5–20
I/O Timing Measurement Methodology .................................................................................... 5–21
Performance .................................................................................................................................... 5–27
Internal Timing Parameters .......................................................................................................... 5–34
Stratix II Clock Timing Parameters .............................................................................................. 5–41
Clock Network Skew Adders ....................................................................................................... 5–50
IOE Programmable Delay ............................................................................................................. 5–51
Default Capacitive Loading of Different I/O Standards .......................................................... 5–52
I/O Delays ....................................................................................................................................... 5–54
Maximum Input & Output Clock Toggle Rate .......................................................................... 5–66
Duty Cycle Distortion ......................................................................................................................... 5–77
DCD Measurement Techniques ................................................................................................... 5–78
High-Speed I/O Specifications .......................................................................................................... 5–87
PLL Timing Specifications .................................................................................................................. 5–91
External Memory Interface Specifications ....................................................................................... 5–94
JTAG Timing Specifications ............................................................................................................... 5–96
Document Revision History ............................................................................................................... 5–97
Chapter 6. Reference & Ordering Information
Software ..................................................................................................................................................
Device Pin-Outs .....................................................................................................................................
Ordering Information ...........................................................................................................................
Document Revision History .................................................................................................................
6–1
6–1
6–1
6–2
Altera Corporation
v
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