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EPM9320LI84-20

CPLD - Complex Programmable Logic Devices CPLD - MAX 9000 320 Macro 60 IOs

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:Altera (Intel)

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
零件包装代码
LCC
包装说明
PLASTIC, LCC-84
针数
84
Reach Compliance Code
unknown
ECCN代码
EAR99
其他特性
484 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
最大时钟频率
100 MHz
系统内可编程
YES
JESD-30 代码
S-PQCC-J84
JESD-609代码
e0
JTAG BST
YES
长度
29.3116 mm
湿度敏感等级
3
专用输入次数
I/O 线路数量
60
宏单元数
320
端子数量
84
最高工作温度
85 °C
最低工作温度
-40 °C
组织
0 DEDICATED INPUTS, 60 I/O
输出函数
MACROCELL
封装主体材料
PLASTIC/EPOXY
封装代码
QCCJ
封装等效代码
LDCC84,1.2SQ
封装形状
SQUARE
封装形式
CHIP CARRIER
峰值回流温度(摄氏度)
220
电源
3.3/5,5 V
可编程逻辑类型
EE PLD
传播延迟
23 ns
认证状态
Not Qualified
座面最大高度
5.08 mm
最大供电电压
5.5 V
最小供电电压
4.5 V
标称供电电压
5 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
J BEND
端子节距
1.27 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
30
宽度
29.3116 mm
Base Number Matches
1
文档预览
®
Includes
MAX 9000A
MAX 9000
Programmable Logic
Device Family
Data Sheet
June 2003, ver. 6.5
Features...
High-performance CMOS EEPROM-based programmable logic
devices (PLDs) built on third-generation Multiple Array MatriX
(MAX
®
) architecture
5.0-V in-system programmability (ISP) through built-in IEEE Std.
1149.1 Joint Test Action Group (JTAG) interface
Built-in JTAG boundary-scan test (BST) circuitry compliant with IEEE
Std. 1149.1-1990
High-density erasable programmable logic device (EPLD) family
ranging from 6,000 to 12,000 usable gates (see
Table 1)
10-ns pin-to-pin logic delays with counter frequencies of up to
144 MHz
Fully compliant with the peripheral component interconnect Special
Interest Group’s (PCI SIG)
PCI Local Bus Specification, Revision 2.2
Dual-output macrocell for independent use of combinatorial and
registered logic
FastTrack
®
Interconnect for fast, predictable interconnect delays
Input/output registers with clear and clock enable on all I/O pins
Programmable output slew-rate control to reduce switching noise
MultiVolt
I/O interface operation, allowing devices to interface with
3.3-V and 5.0-V devices
Configurable expander product-term distribution allowing up to 32
product terms per macrocell
Programmable power-saving mode for more than 50% power
reduction in each macrocell
Table 1. MAX 9000 Device Features
Feature
Usable gates
Flipflops
Macrocells
Logic array blocks (LABs)
Maximum user I/O pins
t
PD1
(ns)
t
FSU
(ns)
t
FCO
(ns)
f
CNT
(MHz)
EPM9320
EPM9320A
6,000
484
320
20
168
10
3.0
4.5
144
EPM9400
8,000
580
400
25
159
15
5
7
118
EPM9480
10,000
676
480
30
175
10
3.0
4.8
144
EPM9560
EPM9560A
12,000
772
560
35
216
10
3.0
4.8
144
Altera Corporation
DS-M9000-6.5
1
MAX 9000 Programmable Logic Device Family Data Sheet
...and More
Features
Programmable macrocell flipflops with individual clear, preset,
clock, and clock enable controls
Programmable security bit for protection of proprietary designs
Software design support and automatic place-and-route provided by
Altera’s MAX+PLUS
®
II development system on Windows-based
PCs as well as Sun SPARCstation, HP 9000 Series 700/800, and IBM
RISC System/6000 workstations
Additional design entry and simulation support provided by EDIF
2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM),
Verilog HDL, VHDL, and other interfaces to popular EDA tools from
manufacturers such as Cadence, Exemplar Logic, Mentor Graphics,
OrCAD, Synopsys, Synplicity, and VeriBest
Programming support with Altera’s Master Programming Unit
(MPU), BitBlaster
TM
serial download cable, ByteBlaster
TM
parallel
port download cable, and ByteBlasterMV
TM
parallel port download
cable, as well as programming hardware from third-party
manufacturers
Offered in a variety of package options with 84 to 356 pins (see
Table 2)
Note (1)
304-Pin
RQFP
216
Table 2. MAX 9000 Package Options & I/O Counts
Device
EPM9320
EPM9320A
EPM9400
EPM9480
EPM9560
EPM9560A
Notes:
(1)
84-Pin
PLCC
60
(2)
60
(2)
59
(2)
208-Pin
RQFP
132
132
139
146
153
153
240-Pin
RQFP
159
175
191
191
280-Pin
PGA
168
216
356-Pin
BGA
168
168
216
216
(2)
MAX 9000 device package types include plastic J-lead chip carrier (PLCC), power
quad flat pack (RQFP), ceramic pin-grid array (PGA), and ball-grid array (BGA)
packages.
Perform a complete thermal analysis before committing a design to this device
package. See
Application Note 74 (Evaluating Power for Altera Devices).
2
Altera Corporation
MAX 9000 Programmable Logic Device Family Data Sheet
General
Description
The MAX 9000 family of in-system-programmable, high-density, high-
performance EPLDs is based on Altera’s third-generation MAX
architecture. Fabricated on an advanced CMOS technology, the EEPROM-
based MAX 9000 family provides 6,000 to 12,000 usable gates, pin-to-pin
delays as fast as 10 ns, and counter speeds of up to 144 MHz. The -10 speed
grade of the MAX 9000 family is compliant with the
PCI Local Bus
Specification, Revision 2.2.
Table 3
shows the speed grades available for
MAX 9000 devices.
Table 3. MAX 9000 Speed Grade Availability
Device
-10
EPM9320
EPM9320A
EPM9400
EPM9480
EPM9560
EPM9560A
Speed Grade
-15
v
v
v
v
v
v
v
v
v
-20
v
Table 4
shows the performance of MAX 9000 devices for typical functions.
Table 4. MAX 9000 Performance
Application
Note (1)
Macrocells Used
-10
16-bit loadable counter
16-bit up/down counter
16-bit prescaled counter
16-bit address decode
16-to-1 multiplexer
Note:
(1)
Internal logic array block (LAB) performance is shown. Numbers in parentheses show external delays from row
input pin to row I/O pin.
Speed Grade
-15
118
118
118
7.9 (15)
10.9 (18)
Units
-20
100
100
100
10 (20)
16 (26)
MHz
MHz
MHz
ns
ns
16
16
16
1
1
144
144
144
5.6 (10)
7.7 (12.1)
The MAX 9000 architecture supports high-density integration of system-
level logic functions. It easily integrates multiple programmable logic
devices ranging from PALs, GALs, and 22V10s to field-programmable
gate array (FPGA) devices and EPLDs.
Altera Corporation
3
MAX 9000 Programmable Logic Device Family Data Sheet
All MAX 9000 device packages provide four dedicated inputs for global
control signals with large fan-outs. Each I/O pin has an associated I/O
cell register with a clock enable control on the periphery of the device. As
outputs, these registers provide fast clock-to-output times; as inputs, they
offer quick setup times.
MAX 9000 EPLDs provide 5.0-V in-system programmability (ISP). This
feature allows the devices to be programmed and reprogrammed on the
printed circuit board (PCB) for quick and efficient iterations during design
development and debug cycles. MAX 9000 devices are guaranteed for 100
program and erase cycles.
MAX 9000 EPLDs contain 320 to 560 macrocells that are combined into
groups of 16 macrocells, called logic array blocks (LABs). Each macrocell
has a programmable-AND/fixed-OR array and a configurable register with
independently programmable clock, clock enable, clear, and preset
functions. For increased flexibility, each macrocell offers a dual-output
structure that allows the register and the product terms to be used
independently. This feature allows register-rich and combinatorial-
intensive designs to be implemented efficiently. The dual-output
structure of the MAX 9000 macrocell also improves logic utilization, thus
increasing the effective capacity of the devices. To build complex logic
functions, each macrocell can be supplemented with both shareable
expander product terms and high-speed parallel expander product terms
to provide up to 32 product terms per macrocell.
The MAX 9000 family provides programmable speed/power
optimization. Speed-critical portions of a design can run at high
speed/full power, while the remaining portions run at reduced
speed/low power. This speed/power optimization feature enables the
user to configure one or more macrocells to operate at 50% or less power
while adding only a nominal timing delay. MAX 9000 devices also
provide an option that reduces the slew rate of the output buffers,
minimizing noise transients when non-speed-critical signals are
switching. MAX 9000 devices offer the MultiVolt feature, which allows
output drivers to be set for either 3.3-V or 5.0-V operation in mixed-
voltage systems.
4
Altera Corporation
MAX 9000 Programmable Logic Device Family Data Sheet
The MAX 9000 family is supported by Altera’s MAX+PLUS II
development system, a single, integrated software package that offers
schematic, text—including VHDL, Verilog HDL, and the Altera
Hardware Description Language (AHDL)—and waveform design entry,
compilation and logic synthesis, simulation and timing analysis, and
device programming. The MAX+PLUS II software provides EDIF 2 0 0
and 3 0 0, LPM, and other interfaces for additional design entry and
simulation support from other industry-standard PC- and UNIX-
workstation-based EDA tools. The MAX+PLUS II software runs on
Windows-based PCs as well as Sun SPARCstation, HP 9000 Series
700/800, and IBM RISC System/6000 workstations.
f
Functional
Description
For more information on development tools, see the
MAX+PLUS II
Programmable Logic Development System & Software Data Sheet.
MAX 9000 devices use a third-generation MAX architecture that yields
both high performance and a high degree of utilization for most
applications. The MAX 9000 architecture includes the following elements:
Logic array blocks
Macrocells
Expander product terms (shareable and parallel)
FastTrack Interconnect
Dedicated inputs
I/O cells
Figure 1
shows a block diagram of the MAX 9000 architecture.
Altera Corporation
5
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参数对比
与EPM9320LI84-20相近的元器件有:EPM9560ABC356-10、EPM9560ARC208-10N、EPM9320LC84-15、EPM9560RC240-15、EPM9560ARC240-10N。描述及对比如下:
型号 EPM9320LI84-20 EPM9560ABC356-10 EPM9560ARC208-10N EPM9320LC84-15 EPM9560RC240-15 EPM9560ARC240-10N
描述 CPLD - Complex Programmable Logic Devices CPLD - MAX 9000 320 Macro 60 IOs CPLD - Complex Programmable Logic Devices CPLD - MAX 9000 560 Macro 216 IOs Multilayer Ceramic Capacitors MLCC - SMD/SMT 10uF 20% 10Volts Modulator / Demodulator Wideband Integ Demod with PLL and VCO CPLD - Complex Programmable Logic Devices CPLD - MAX 9000 560 Macro 191 IOs CPLD - Complex Programmable Logic Devices CPLD - MAX 9000 560 Macro 191 IOs
是否无铅 含铅 含铅 不含铅 含铅 含铅 不含铅
是否Rohs认证 不符合 不符合 符合 不符合 不符合 符合
零件包装代码 LCC BGA QFP LCC QFP QFP
包装说明 PLASTIC, LCC-84 BGA-356 FQFP, PLASTIC, LCC-84 POWER, RQFP-240 FQFP,
针数 84 356 208 84 240 240
Reach Compliance Code unknown not_compliant compliant unknown unknown compliant
其他特性 484 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V 560 MACROCELLS; 35 LABS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V 560 MACROCELLS; 35 LABS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V 484 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V 560 MACROCELLS; 35 LABS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
最大时钟频率 100 MHz 144.9 MHz 144.9 MHz 117.6 MHz 117.6 MHz 144.9 MHz
JESD-30 代码 S-PQCC-J84 S-PBGA-B356 S-PQFP-G208 S-PQCC-J84 S-PQFP-G240 S-PQFP-G240
JESD-609代码 e0 e0 e2 e0 e0 e3
长度 29.3116 mm 35 mm 28 mm 29.3116 mm 32 mm 32 mm
湿度敏感等级 3 3 3 3 3 3
I/O 线路数量 60 216 153 60 191 191
端子数量 84 356 208 84 240 240
最高工作温度 85 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 0 DEDICATED INPUTS, 60 I/O 0 DEDICATED INPUTS, 216 I/O 0 DEDICATED INPUTS, 153 I/O 0 DEDICATED INPUTS, 60 I/O 0 DEDICATED INPUTS, 191 I/O 0 DEDICATED INPUTS, 191 I/O
输出函数 MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 QCCJ LBGA FQFP QCCJ FQFP FQFP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 CHIP CARRIER GRID ARRAY, LOW PROFILE FLATPACK, FINE PITCH CHIP CARRIER FLATPACK, FINE PITCH FLATPACK, FINE PITCH
峰值回流温度(摄氏度) 220 220 245 220 220 245
可编程逻辑类型 EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD
传播延迟 23 ns 11.4 ns 11.4 ns 16 ns 16.6 ns 11.4 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.08 mm 1.63 mm 4.1 mm 5.08 mm 4.1 mm 4.1 mm
最大供电电压 5.5 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
最小供电电压 4.5 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn63Pb37) Matte Tin/Copper (Sn/Cu) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) MATTE TIN (472) OVER COPPER
端子形式 J BEND BALL GULL WING J BEND GULL WING GULL WING
端子节距 1.27 mm 1.27 mm 0.5 mm 1.27 mm 0.5 mm 0.5 mm
端子位置 QUAD BOTTOM QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 40 30 30 40
宽度 29.3116 mm 35 mm 28 mm 29.3116 mm 32 mm 32 mm
系统内可编程 YES YES - YES YES -
JTAG BST YES YES - YES YES -
宏单元数 320 560 - 320 560 -
封装等效代码 LDCC84,1.2SQ BGA356,26X26,50 - LDCC84,1.2SQ HQFP240,1.37SQ,20 -
电源 3.3/5,5 V 3.3/5,5 V - 3.3/5,5 V 3.3/5,5 V -
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