型号
- 型号
- 关键词
| 型号 | EPM9560ARI240-15 | EPM9560ARC208-15 | EPM9560ARI208-15 | EPM9560ARC240-15 | EPM9320ARI208-7 | EPM9320ARC208-15 | EPM9320ARC208-7 | EPM9320ABC356-15 | EPM9320ABC356-7 |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EE PLD, 16.6ns, CMOS, PQFP240, HEAT SINK, POWER, QFP-240 | EE PLD, 16.6ns, CMOS, PQFP208, HEAT SINK, POWER, QFP-208 | EE PLD, 16.6ns, CMOS, PQFP208, HEAT SINK, POWER, QFP-208 | EE PLD, 16.6ns, CMOS, PQFP240, HEAT SINK, POWER, QFP-240 | EE PLD, 8.2ns, 320-Cell, CMOS, PQFP208, HEAT SINK, POWER, QFP-208 | EE PLD, 16ns, CMOS, PQFP208, HEAT SINK, POWER, QFP-208 | EE PLD, 8.2ns, 320-Cell, CMOS, PQFP208, HEAT SINK, POWER, QFP-208 | EE PLD, 16ns, CMOS, PBGA356, HEAT SINK, BGA-356 | EE PLD, 8.2ns, 320-Cell, CMOS, PBGA356, HEAT SINK, BGA-356 |
| 厂商名称 | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | BGA | BGA |
| 包装说明 | HFQFP, | HFQFP, | HFQFP, | HFQFP, | HFQFP, HQFP208,1.2SQ,20 | HFQFP, | HFQFP, HQFP208,1.2SQ,20 | HLBGA, | HLBGA, BGA356,26X26,50 |
| 针数 | 240 | 208 | 208 | 240 | 208 | 208 | 208 | 356 | 356 |
| Reach Compliance Code | compliant | compliant | unknown | compliant | compliant | compliant | compliant | compliant | compliant |
| 其他特性 | 560 MACROCELLS; 772 FLIP-FLOPS; 35 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 560 MACROCELLS; 772 FLIP-FLOPS; 35 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 560 MACROCELLS; 772 FLIP-FLOPS; 35 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 560 MACROCELLS; 772 FLIP-FLOPS; 35 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 320 MACROCELLS; 484 FLIP-FLOPS; 20 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V |
| JESD-30 代码 | S-PQFP-G240 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G240 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PBGA-B356 | S-PBGA-B356 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e0 | e3 | e0 | e1 | e0 |
| 长度 | 32 mm | 28 mm | 28 mm | 32 mm | 28 mm | 28 mm | 28 mm | 35 mm | 35 mm |
| I/O 线路数量 | 191 | 153 | 153 | 191 | 132 | 132 | 132 | 168 | 168 |
| 端子数量 | 240 | 208 | 208 | 240 | 208 | 208 | 208 | 356 | 356 |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 0 DEDICATED INPUTS, 191 I/O | 0 DEDICATED INPUTS, 153 I/O | 0 DEDICATED INPUTS, 153 I/O | 0 DEDICATED INPUTS, 191 I/O | 0 DEDICATED INPUTS, 132 I/O | 0 DEDICATED INPUTS, 132 I/O | 0 DEDICATED INPUTS, 132 I/O | 0 DEDICATED INPUTS, 168 I/O | 0 DEDICATED INPUTS, 168 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HFQFP | HFQFP | HFQFP | HFQFP | HFQFP | HFQFP | HFQFP | HLBGA | HLBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE | GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 16.6 ns | 16.6 ns | 16.6 ns | 16.6 ns | 8.2 ns | 16 ns | 8.2 ns | 16 ns | 8.2 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.2 mm | 4.07 mm | 4.07 mm | 4.2 mm | 4.07 mm | 4.07 mm | 4.07 mm | 1.63 mm | 1.63 mm |
| 最大供电电压 | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) | TIN SILVER COPPER | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | BALL | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | BOTTOM | BOTTOM |
| 宽度 | 32 mm | 28 mm | 28 mm | 32 mm | 28 mm | 28 mm | 28 mm | 35 mm | 35 mm |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| ECCN代码 | 3A991 | 3A991 | - | 3A991 | - | EAR99 | - | EAR99 | - |