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ERA-6EEB1130V

RESISTOR METAL FILM

器件类别:无源元件   

厂商名称:Panasonic(松下)

厂商官网:http://www.panasonic.co.jp/semicon/e-index.html

器件标准:

下载文档
器件参数
参数名称
属性值
电阻值
113 Ohms
容差
±0.1%
功率(W)
0.125W,1/8W
成分
薄膜
温度系数
±25ppm/°C
工作温度
-55°C ~ 125°C
封装/外壳
0805(2012 公制)
供应商器件封装
805
大小/尺寸
0.079" 长 x 0.049" 宽(2.00mm x 1.25mm)
高度 - 安装(最大值)
0.024"(0.60mm)
端子数
2
文档预览
151ERA011012
Date of Issue :
February 15.2011
Issue No.
:
Digi-Key
Classification :
New
Changed
PRODUCT SPECIFICATION FOR APPROVAL
Product Description
Product Part Number
:
:
Metal Film (Thin Film)Chip Resistors (RoHS Compliance)
ERA6Y##***V
ERA6E##****V
JAPAN
Country of Origin
Applications
:
:
Standard electronic equipment
*If you approve this specification, please fill in and sign the below and return 1 copy to us.
Approval No
Approval Date
Executed by
:
:
:
(signature)
Title
Dept.
:
:
Circuit Components Business Unit
Panasonic Electronic Devices Co., Ltd.
401 Sadamasa-cho,
Fukui City 910-8502 Japan
Phone : +81-776-56-8034
Prepared by
Contact Person
Signature
Name(Print)
Title
Authorized by
Signature
Name(Print)
Title :
:
:
Engineering Section
H.Yabukoshi
:
:
T.Iseki
Manager of Engineering
Subject
Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-SRA-E202M
9-1
Part No.
ERA6
L
a
W
(1)
(2)
(3)
(4)
Substrate
Protective
coating
Resistive
element
Inner
termination
Between
termination
Outer
termination
Alumina
Epoxy resin
NiCr alloy
1. Dimension
a
special termination
Ni plating
Sn plating
(1)
(2)
(3)
(4)
(5)
(6)
t
(5)
(6)
b
L
mm
2.00±0.20
inch
.078±.008
2. Power deratimg Curve
b
W
1.25±0.10
.049±.004
120
100
60
40
20
0
-55
-40
0
40
80
125
120
140
160
70
a
0.40±0.25
.016±.010
b
0.40±0.25
.016±.010
t
0.50±0.10
.019±.004
Rated Load(%)
Operating
Temperature Range
-55~+125°C
3. Ratings
Item
Rated power
Ambient Temperature (°C)
Flg.1
Explanation
When used at ambient temperture over
0.125 W
70°C, the load power should be reduced
(at 70 °C or lower)
as shown in Fig.1
The rated voltage of each resistance should be calculated from the
equation below, and when the rated voltage exceeds the
½imiting
element voltage, the
½imiting
element voltage should be the rated
voltage.
Limiting element voltage :100V
E
=
P
×
R
E
: rated voltage (V)
P
: rated power (W)
R
: nominal resistance value (Ω)
Rated value
Rated voltage
&
Rated Continuous
Working Voltage
(RCWV)
Panasonic Electronic Devices Co., Ltd.
Subject
Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-SRA-E202M
9-2
Explanation
Part No.
ERA6
Item
Rated value
Code.
D
B
Tolerance
D
B
Tolerance for resis.
±
0.5%
±
0.1%
Tolerance for
resistance
Resistance range
Resistance range Series E-96 series :special
E-24 When E-96 series overlap
10
Ω
~1M
Ω
E-24 series, E-24 series
100
Ω
~100k
Ω
E-24 should be the first priority
4. Explanation of Part Number
E
R
(1)
A
6
(2)
Y
(3)
E
(4)
D
(5)
1
0
(6)
2
V
(7)
(1) Product Code : Metal Film Chip Resistors
(2) Size and Rated Power : 2.0 mm x 1.25 mm, 0.125W
(3) Series and marking
Code
Series
Marking
Y
E-24 series
3 digit marking
E
E-96 series
No marking
(4) T.C.R.
Code
T.C.R.
Resistance range
-6
H
± 50x10 /°C
10Ω
~ 97.6Ω
-6
E
± 25x10 /°C
100Ω
~ 100 kΩ
-6
K
±100x10 /°C
102kΩ ~ 1MΩ
(5)Resistance Tolerance
Code
Resistance Tolerance
D
+/- 0.5%
B
+/- 0.1%
(6) Resistance Value
<E-24 series> 3-digits type 123
→12×10
3
→12kΩ
<E-96 series> 4-digits type 1303
130×10
3
130kΩ
(7) Packaging Configuration
Code
Packaging Configuration
V
Taping (5000pcs/reel)
Panasonic Electronic Devices Co., Ltd.
Subject
Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-SRA-E202M
9-3
Part No.
ERA6
5. Appearance & Construction
Item
Rated value
Explanation
1. The resistive element should be covered with protective coating
that don’t fade easily. The surface of coating should avoid
unevenness, flaw, pinhole and discoloration.
Appearance &
2. The electrode should be printed uniformly, as shown in the
Construction
dimensions. The plating should not fade easily, and should avoid
unevenness, flaw, pinhole, projection and discoloration.
3. The electrode should be connected electrically, mechanically to
resistive element.
As far as there shall not designation especially, the following test and measurement
shall be operated under normal temperature (5~35°C), normal humidity(45~85%),
normal atmospheric pressure(
8.6
×
10
4
~
1.06
×
10
5
Pa
).
6. Performance Specification
Specifications
Item
Chip Resistor
DC Resistance value shall
DC
be within the specified
Resistance
tolerance
Resit. range
TCR
10Ω
± 50x10
-6
/°C
~97.6Ω
100Ω
±25x10
-6
/°C
~100 kΩ
102kΩ
±100x10
-6
/°C
~ 1MΩ
Explanation
At 20°C, 65%RH
Temperature
Coefficient
Short-time
overload
Dielectric
Withstanding
Natural resistance change per
Temperature degree centigrade.
R 2
R1
×
10
6
/
°
C
R 1(t 2
t 1)
R1 : Resistance value at reference
temperature(t1)
R2
: Resistance value at test
temperature(t2)
t2 – t1 = 100°C t1 = 25°C
Resistors shall be applied 2.5 times the
rated voltage for 5 seconds.
± (0.5 % + 0.1Ω)
However, the upper limit of the voltage in
the test shall be 200V.
A.C. 200 V shall be applied between sub-
No evidence of flashover, strate and electrodes for 60 s.
Insulation
mechanical damage,
Resistance
arcing or insulation break-
Meter
down
or
AC power
supply
Min.1,000MΩ
Resistors shall be facing down.
After applying DC 200V to the resistor,
insulation resistance shall be measured.
Insulation
Resistance
Panasonic Electronic Devices Co., Ltd.
Subject
Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-SRA-E202M
9-4
Part No.
ERA6
7. Mechanical characteristic
Specifications
Item
Chip Resistor
Explanation
Substrate :
Glass epoxy(t=1.6mm)
Span
: 90mm
Bending distance :3mm (10 seconds)
1 .4
Te s t
p rin tin g
b o a rd
1 .6 5
(m m )
1 .2
1 .4
Without distinct deforma-
tion in appearance
Bending
Strength
± (0.5 % + 0.05Ω)
100
40
Solderability
Resistance to
Soldering Heat
Termination should be
covered uniformly with
solder
(min. 95% coverage)
± (0.5 % + 0.05Ω)
Resistance to
Solvent
Without distinct
deformation in appearance (1)Dipping 10 +/- 1 hours, dry in room
condition for 30 +/- 10 minutes.
± (0.5 % + 0.05Ω)
Resistors shall be dipped in the melted sol-
der bath at 235±5 °C for 2±0.5 sec.
Flux shall be removed from the surface
of termination with clean organic solvent.
Resistors shall be dipped in the melted
solder bath at
270
±
3
°C for
10
±
1
°C sec.
Solvent solution : Isopropyl alcohol
(2)Ultrasonic wave washing : 5 +/- 1 min.
(0.3W/cm
2
,28kHz)
Dry in room condition for 30 +/-10
minutes.
Panasonic Electronic Devices Co., Ltd.
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