Micro Chip Fuse
Micro Chip Fuse
Type:
ERBRD
ERBRE
ERBRG
Features
●
Small
size
●
Fast-acting and withstanding in-rush current characteristics
●
RoHS compliant
Approved Safety Standards
UL248-14 : File No.E194052
c-UL C22.2 No.248-14 : File No.E194052
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
E
R
B
R
D
1
R
0
0
X
Product Code
Micro Chip Fuse
R
Structure
Rectangular type
Product shape
0402 inch size
D
(1.0 mm×0.5 mm)
E
G
0603 inch size
(1.6 mm×0.8 mm)
1206 inch size
(3.2 mm×1.6 mm)
Rated Current (A)
0R25 0.25 A 1R40 1.4 A
0R31 0.315 A 1R50 1.5 A
0R37 0.375 A 2R00 2.0 A
0R50 0.50 A 2R50 2.5 A
0R63 0.63 A 3R00 3.0 A
0R75 0.75 A 3R15 3.15 A
1R00 1.0 A
4R00 4.0 A
1R25 1.25 A 5R00 5.0 A
Code
X
V
Packaging
Pressed Carrier Taping
2 mm pitch, 10,000 pcs.
Punched Carrier Taping
4 mm pitch, 5,000 pcs.
Part No.
ERBRD
ERBRE
ERBRG
Construction
Dimensions in mm (not to scale)
L
a
W
Protective Coating
Electrode (Base)
t
b
Fusing Element
Almina Substrate
Electrode
(Outer)
Part No.
(inch size)
ERBRD
(0402)
ERBRE
(0603)
ERBRG
(1206)
Dimensions (mm)
L
1.00
1.60
3.20
±0.10
W
+0.10
a
±0.10
b
0.25
0.30
0.55
±0.10
t
0.39
0.54
0.65
±0.10
Mass
(Weight)
(g/1000 pcs.)
0.7
2.2
10
0.50
–0.05
0.15
0.80
–0.05
0.24
1.60
±0.15
+0.15
±0.15
±0.15
±0.15
±0.10
±0.20
0.30
±0.20
±0.20
±0.10
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Sep. 2016
Micro Chip Fuse
Ratings
●
0402 inch /1005 mm size : Type ERBRD
Part No.
ERBRD□R□□X
0R25 0R31 0R37 0R50 0R63 0R75 1R00 1R25 1R50 2R00 2R50 3R00 4R00 5R00
0.25 0.315 0.375
V
700
X
520
Y
440
0.5
F
310
0.63
6
220
0.75
G
190
1.0
H
125
1.25
J
82
1.5
K
70
2.0
N
53
2.5
O
42
3.0
P
37
4.0
S
24
5.0
T
19.5
Rated Current (A)
Marking Code
Internal R (mΩ) at 25 °C max.
Fusing Current/Fusing Time
(at 25 °C)
Rated Voltage
(Open Circuit Voltage)
Interrupting Rating
(at Rated Voltage)
Category Temp. Range
Rated Current
×100
% / 4 hours min.
Rated Current
×200
% / 5 seconds max.
Rated Current
×300
% / 0.2 seconds max.
32 VDC
35 A
−40 °C to +125 °C
●
0603 inch / 1608 mm size : Type ERBRE
Part No.
ERBRE□R□□V
0R50
0.5
F
330
0R75
0.75
G
190
1R00
1.0
H
125
1R25
1.25
J
94
1R40
1.4
14
85
1R50
1.5
K
72
2R00
2.0
N
51
2R50
2.5
O
40
3R00
3.0
P
33
3R15
3.15
31
32
4R00
4.0
S
22
5R00
5.0
T
19
Rated Current (A)
Marking Code
Internal R (mΩ) at 25 °C max.
Fusing Current/Fusing Time
(at 25 °C)
Rated Voltage
(Open Circuit Voltage)
Interrupting Rating
(at Rated Voltage)
Category Temp. Range
Rated Current
×100
% / 4 hours min.
Rated Current
×200
% / 5 seconds max.
Rated Current
×300
% / 0.2 seconds max.
32 VDC
50 A
−40 °C to +125 °C
●
1206 inch / 3216 mm size : Type ERBRG
Part No.
ERBRG□R□□V
0R50
0.5
F
560
0R75
0.75
G
340
1R00
1.0
H
210
1R25
1.25
J
175
1R50
1.5
K
115
2R00
2.0
N
85
2R50
2.5
O
65
3R00
3.0
P
45
4R00
4.0
S
35
Rated Current (A)
Marking Code
Internal R (mΩ) at 25 °C max.
Fusing Current/Fusing Time
(at 25 °C)
Rated Voltage
(Open Circuit Voltage)
Interrupting Rating
(at Rated Voltage)
Category Temp. Range
Rated Current
×100
% / 4 hours min.
Rated Current
×200
% / 5 seconds max.
Rated Current
×300
% / 0.2 seconds max.
63 VDC
50 A
−40 °C to +125 °C
32 VDC
½
The thin type is available about 1005 (0402 inch) size. Please contact us for details.
½
Please contact us when another rated current is needed.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Sep. 2016
Micro Chip Fuse
Fusing Characteristics (25 °C typical)
0.25 A
0.315 A
0.375 A
0.5 A
0.63 A
0.75 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
5.0 A
0.75 A
1.0 A
1.25 A
1.4 A
1.5 A
2.0 A
2.5 A
3.0 A
3.15 A
4.0 A
5.0 A
10
10
1
1
Fusing Time (s)
Fusing Time (s)
0.1
0.1
0.01
0.01
0.001
½
Reference Only
0.001
½
Reference Only
0.0001
0.1
1
10
Fusing Current (A)
100
0.0001
0.1
0.5 A
●
0402 inch / 1005 mm size
(Type ERBRD)
●
0603 inch / 1608 mm size
(Type ERBRE)
1
10
Fusing Current (A)
100
10
1
Fusing Time (s)
0.1
0.01
0.001
½
Reference Only
0.0001
0.1
1
0.75 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
0.5 A
●
1206 inch /3216 mm size
(Type ERBRG)
Fusing Current (A)
10
100
Packaging Methods
●
Standard Quantity
Part No.
ERBRD
ERBRE
ERBRG
inch size
0402
0603
1206
Kind of Taping
Pressed Carrier Taping
Punched Carrier Taping
(Unit : mm)
P
1
P
2
P
0
E
fC
W
fN
W
1
fA
W
2
Pitch (P
1
)
2 mm
4 mm
●
Quantity
10,000 pcs./ reel
5,000 pcs./ reel
(Unit : mm)
●
Carrier Taping
Pressed
Carrier
Punched
Carrier
Taping Reel
fD
0
B
T
T
A
P
1
(2 mm pitch)
F
Part No.
ERBRD
ERBRE
ERBRG
Part No.
ERBRD
ERBRE
ERBRG
A
0.68
1.10
2.00
±0.10
±0.10
±0.15
B
1.20
1.90
3.60
±0.10
±0.10
±0.20
W
8.00
±0.20
F
3.50
±0.05
E
1.75
±0.10
Part No.
ERBRD
ERBRE
ERBRG
0A
180.0
–1.5
0
0N
60
+1.0
0
0C
13.0
±0.2
W
1
9.0
+1.0
0
W
2
11.4
±1.0
P
1
2.00
4.00
±0.10
P
2
2.00
±0.05
P
0
4.00
±0.10
0D
0
1.50
+0.10
0
T
0.67
0.78
±0.07
±0.07
±0.07
±0.10
0.84
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Sep. 2016
Micro Chip Fuse
Recommended Soldering Conditions
Part No.
(inch size)
ERBRD(0402)
A
B
Dimensions (mm)
A
0.5 to 0.6
0.7 to 0.9
2.0 to 2.4
B
1.4 to 1.6
2.0 to 2.2
4.4 to 5.0
C
0.4 to 0.6
0.8 to 1.0
1.2 to 1.8
C
ERBRE(0603)
ERBRG(1206)
Recommended Soldering Conditions
Recommendations and precautions are described below.
●
Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Peak
Temperature
Preheating
Heating
For soldering (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Preheating
Main heating
Peak
Temperature
150 °C to 180 °C
Above 230 °C
max. 260 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
Time
●
Recommended
soldering conditions for flow
For soldering
Temperature
Time
140 °C to 180 °C
60 s to 120 s
245 ± 5 °C
20 s to 30 s
For lead-free soldering
Temperature
Time
150 °C to 180 °C
60 s to 120 s
max. 260 °C
max. 10 s
Preheating
Soldering
<Repair with hand soldering>
●
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less.
Solder each electrode for 3 seconds or less.
●
Never touch this product with the tip of a soldering iron.
Safety Precautions
The following are precautions for individual products. Please also refer to the common precautions for fuses in this
catalog.
1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses) under
normal conditions is within 70% of the rated current.
2. Do not continuously pass a current exceeding the rated current through the fuses.
3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take care
not to cause unwanted fusing. Calculate the I
2
t value of the pulse and check the tolerance to the number of
pulses according to the I
2
t-t characteristic curve before deciding to use the fuses. Before checking the tolerance,
consult our sales staff in advance.
4. The fuses are designed to be blown out by a current that is double or greater than the rated current. Ensure that
the abnormal current generated when a circuit abnormality occurs in your product is at least double or greater
than the rated current of the fuses. In addition, ensure that the abnormal current of your product does not exceed
the maximum interrupting current of the fuses.
5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the primary
side.
6. Ensure that the voltage applied to the fuses are within their rated voltage.
7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the fuses
on your products and carefully check and evaluate their category temperature range.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Sep. 2016
Safety Precautions (Common precautions for Fuses)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate its operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
½
Systems equipped with a protection circuit and a protection device
½
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in severe dust condition
3. In salty air or air with a high concentration of corrosive gas, such as Cl
2
, H
2
S, NH
3
, SO
2
, or NO
2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components (except Thermal Cutoffs).
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %.
The performance of Thermal Cutoffs is guaranteed for a year after our delivery, provided that they are stored at a
temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl
2
, H
2
S, NH
3
, SO
2
, or NO
2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
00 May. 2015
