Micro Chip Fuse
Micro Chip Fuse
Type:
Planed final production : Sep.2011
ERBSE
ERBSD
■
Features
●
Small size
●
Fast-acting and withstanding in-rush current characteristics
■
Approved Safety Standards
●
UL248-14 : File No.E194052
●
c-UL(CSA)C22.2 No.248-14 : File No.E194052
■
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
E
R
B
S
E
1
R
0
0
U
Product Code
Micro Chip Fuse
Fusing Characteristics
Fast-acting and
S withstanding in-rush
current
Product shape
1608 size
E
(1.6 mm 0.8 mm)
D
1005 size
(1.0 mm 0.5 mm)
0R25
0R31
0R37
0R50
0R75
1R00
1R25
Rated Current (A)
0.25 A 1R50 1.5 A
0.315 A 2R00 2.0 A
0.375 A 2R50 2.5 A
3R00 3.0 A
0.5 A
0.75 A 4R00 4.0 A
5R00 5.0 A
1.0 A
1.25 A
U
Packaging
Punched carrier taping
■
Construction
■
Dimensions in mm (not to scale)
Marking
Fusing Element
Ceramic Core
Electrode
(Outer)
Trimming
Protective Coating
a
t
L
W
Type
(inches)
ERBSE
(0603)
ERBSD
(0402)
Dimensions (mm)
L
1.60
±0.15
1.00
±0.10
W
0.80
±0.15
0.50
±0.10
a
0.30
±0.20
0.20
±0.15
t
0.70
±0.10
0.40
±0.10
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Dec. 2007
Micro Chip Fuse
■
Ratings
●
1608 Size
Part No.
Rated Current (A)
Marking Code
Internal R (m ) at 25 °C max.
Fusing Current/Fusing Time
(at 25 °C)
Rated Voltage
(Open Circuit Voltage)
Interrupting Rating
(at Rated Voltage)
Category Temp. Range
(Operating Temp. Range)
ERBSE R
0R50
0.5
F
370
0R75
0.75
G
245
1R00
1.0
H
155
1R25
1.25
J
120
Rated Current
Rated Current
Rated Current
1R50
1.5
K
90
2.0
N
60
U
2R50
2.5
O
48
3R00
3.0
P
36
4R00
4.0
S
28
5R00
5.0
T
20
2R00
100 %/4 hours min.
200 %/5 seconds max.
300 %/0.2 seconds max.
32 VDC
50 A
−40 °C to +100 °C
35 A
●
1005 Size
Part No.
Rated Current (A)
Marking Code
Internal R (m ) at 25 °C max.
Fusing Current/Fusing Time
(at 25 °C)
Rated Voltage
(Open Circuit Voltage)
Interrupting Rating
(at Rated Voltage)
Category Temp. Range
(Operating Temp. Range)
ERBSD R
0R25
0.25
V
700
0R31
0.315
X
570
0R37
0.375
Y
460
0R50
0.5
F
330
0R75
0.75
G
200
1R00
1.0
H
135
U
1R25
1.25
J
100
1R50
1.5
K
80
2R00
2.0
N
53
2R50
2.5
O
40
3R00
3.0
P
33
Rated Current
Rated Current
Rated Current
100 %/4 hours min.
200 %/5 seconds max.
300 %/0.2 seconds max.
24 VDC
35 A
−40 °C to +100 °C
Power Derating Curve
Rated Load (%)
100
80
60
40
20
0
70
°C
• For Circuit, current rating shall be derated in
accordance with the figure on the right.
• This current derating curve is for fusing
characteristics.
100
°C
–40 –20 0 20 40 60 80 100 120 140
Ambient Temperature (°C)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Dec. 2007
Micro Chip Fuse
■
Fusing Characteristics (25 °C typical)
●
I–t
Characteristics
0.75 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
5.0 A
0.5 A
●
Type ERBSD
10
10
1
1
Fusing Time (s)
Fusing Time (s)
0.1
0.1
0.01
0.01
0.001
½
Reference Only
0.001
½
Reference Only
0.0001
0.1
1
10
Fusing Current (A)
100
0.0001
0.1
1
0.75 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
●
Type ERBSE
0.25 A
0.315 A
0.375 A
0.5 A
10
Fusing Current (A)
100
●
I
2
t–t Characteristics
●
Type ERBSE
100
10
1
I
2
t (A
2
s)
0.1
0.01
0.001
½
Reference Only
5.0 A
4.0 A
3.0 A
2.5 A
2.0 A
1.5 A
1.25 A
1.0 A
0.75 A
0.5 A
●
Type ERBSD
100
10
1
I
2
t (A
2
s)
0.1
0.01
0.001
½
Reference Only
3.0 A
2.5 A
2.0 A
1.5 A
1.25 A
1.0 A
0.75 A
0.5 A
0.375 A
0.315 A
0.25 A
0.0001
0.0001
0.001
0.01
t (s)
0.1
1
0.0001
0.0001
0.001
0.01
t (s)
0.1
1
■
Packaging Methods
●
Standard Quantity
Type
ERBSE
ERBSD
Kind of Taping
Punched Carrier Taping
Pitch (P
1
)
4 mm
2 mm
●
Taping Reel
T
Sprocket hole
φD
0
A
B
F E
W
Compartment
φC
φB
φA
W
Quantity
5000 pcs./ reel
10000 pcs./ reel
●
Punched Carrier Taping
T Chip component
P
1
P
2
P
0
Taping running direction
Dimen
sions
(mm)
Type
ERBSE
ERBSD
A
B
W
F
E
±0.10
±0.20
1.00
1.80
8.00
±0.20
3.50
±0.05
1.75
±0.10
±0.05
0.65
1.15
±0.05
φA
Dimensions
+0
(mm)
180.0
−3.0
φB
60 min.
φC
13.0
±1.0
W
9.0
±1.0
T
11.4
±1.0
Dimen
sions
(mm)
Type
P
1
P
2
P
0
T
φD
0
±0.10
ERBSE 4.00
0.85
±0.07
2.00
±0.05
4.00
±0.10
1.50
+0.10
–0
ERBSD 2.00
±0.10
0.60
±0.07
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Dec. 2007
Micro Chip Fuse
■
Recommended Land Pattern
Dimensions (mm)
A
0.9
0.6
B
2.1 to 2.3
1.4 to 1.6
C
0.8
0.5
C
Type
ERBSE
ERBSD
A
B
■
Recommended Soldering Conditions
Recommendations and precautions are described below.
●
Recommended soldering conditions for reflow
·Reflow soldering shall be performed a maximum of
two times.
·Please contact us for additional information when
used in conditions other than those specified.
·Please measure the temperature of the terminals and
study every kind of solder and printed circuit board
for solderability before actual use.
Peak
Temperature
Preheating
For soldering (Example : Sn/Pb)
Temperature
Preheating
Main heating
Peak
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Preheating
Heating
Time
60 s to 120 s
30 s to 40 s
max. 10 s
150 °C to 180 °C
Above 230 °C
max. 260 °C
Main heating
Peak
Time
<Repair with hand soldering>
●
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
●
Never touch this product with the tip of a soldering iron.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.
1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses)
under normal conditions is within 70% of the rated current.
2. Do not continuously pass a current exceeding the rated current through the fuses.
3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take
care not to cause unwanted fusing. Calculate the
I
2
t value of the pulse and check the tolerance to the number
of pulses according to the
I
2
t-t characteristic curve before deciding to use the fuses. Before checking the
tolerance, consult our sales staff in advance.
4. The fuses are designed to be blown out by a current that is double or greater than the rated current. Ensure
that the abnormal current generated when a circuit abnormality occurs in your product is at least double or
greater than the rated current of the fuses. In addition, ensure that the abnormal current of your product does not
exceed the maximum interrupting current of the fuses.
5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the primary
side.
6. Ensure that the voltage applied to the fuses are within their rated voltage.
7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the fuses
on your products and carefully check and evaluate their operating temperature range.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
½
Systems equipped with a protection circuit and a protection device
½
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl
2
, H
2
S, NH
3
, SO
2
, or NO
2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl
2
, H
2
S, NH
3
, SO
2
, or NO
2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Feb. 2006
– EX2 –
