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ERJPA2F1403X

Fixed Resistor, Metal Glaze/thick Film, 0.2W, 140000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP

器件类别:无源元件    电阻器   

厂商名称:Panasonic(松下)

厂商官网:http://www.panasonic.co.jp/semicon/e-index.html

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Panasonic(松下)
包装说明
CHIP
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
IEC60115-8
构造
RECTANGULAR PACKAGE
JESD-609代码
e3
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
155 °C
最低工作温度
-55 °C
封装高度
0.35 mm
封装长度
1 mm
封装形状
RECTANGULAR PACKAGE
封装形式
SMT
封装宽度
0.5 mm
包装方法
TR, PUNCHED, 7 INCH
额定功率耗散 (P)
0.2 W
额定温度
70 °C
参考标准
AEC-Q200
电阻
140000 Ω
电阻器类型
FIXED RESISTOR
尺寸代码
0402
表面贴装
YES
技术
METAL GLAZE/THICK FILM
温度系数
100 ppm/°C
端子面层
Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状
WRAPAROUND
容差
1%
工作电压
50 V
文档预览
Anti-Surge Thick Film Chip Resistors
Anti-Surge Thick Film Chip Resistors
Type:
ERJ PA2, P03, PA3, P06, P08, P14
Features
ESD
surge characteristics superior to standard metal film resistors
High reliability
Metal glaze thick film resistive element and three layers of electrodes
Suitable for both reflow and flow soldering
High power … 0.20 W : 0402 inch / 1005 mm size (ERJPA2), 0603 inch / 1608 mm size (ERJP03)
0.25 W : 0603 inch / 1608 mm size (ERJPA3)
0.50 W : 0805 inch / 2012 mm size (ERJP06), 1210 inch / 3225 mm size (ERJP14)
0.66 W : 1206 inch / 3216 mm size (ERJP08)
Reference Standards… IEC 60115-8, JIS C 5201-8, JEITA RC-2134C
AEC-Q200 qualified
RoHS compliant
As for Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions,
Please see Data Files
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
R
J
P
Resistance Tolerance
0
6
D
1
0
0
2
V
Size, Power Rating
Product Code
Thick Film
Code Inch Power R.
Chip Resistors PA2 0402 0.20 W
P03 0603 0.20 W
PA3 0603 0.25 W
P06 0805 0.50 W
P08 1206 0.66 W
P14 1210 0.50 W
Resistance Value
The first two or three digits are significant figures
of resistance and the third or 4th one denotes
number of zeros following.
Three digit type (±5 %),
four digit type (±1 %, ±0.5 %)
Example: 222→2.2 kΩ, 1002→10 kΩ
Code
X
Packaging Methods
Packaging
Punched Carrier Taping
2 mm pitch, 10,000 pcs.
Punched Carrier Taping
4 mm pitch, 5,000 pcs.
Part No.
ERJPA2
ERJP03
ERJPA3
ERJP06
ERJP08
Code Tolerance
D
± 0.5 %
F
±1%
J
±5%
V
U
Embossed Carrier Taping
ERJP14
4 mm pitch, 5,000 pcs.
Construction
Dimensions in mm (not to scale)
L
a
Protective coating
Electrode (Inner)
W
Alumina substrate
t
b
Electrode
(Between)
Dimensions (mm)
L
W
a
b
t
1.00
±0.05
0.50
±0.05
0.20
±0.15
0.25
±0.05
0.35
±0.05
1.60
±0.15
0.80
+0.15
0.15
+0.15
0.30
±0.15
0.45
±0.10
–0.10
–0.05
1.60
±0.15
0.80
+0.15
0.15
+0.15
0.25
±0.10
0.45
±0.10
–0.10
–0.05
2.00
±0.20
1.25
±0.10
0.25
±0.20
0.40
±0.20
0.60
±0.10
3.20
+0.05
–0.20
Part No.
ERJPA2
ERJP03
ERJPA3
Mass (Weight)
[g/1000 pcs.]
0.8
2
2
4
10
16
Thick film
resistive element
Electrode (Outer)
ERJP06
ERJP08
ERJP14
1.60
+0.05
–0.15
0.40
±0.20
0.50
±0.20
0.60
±0.10
3.20
±0.20
2.50
±0.20
0.35
±0.20
0.50
±0.20
0.60
±0.10
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
13 May. 2019
Anti-Surge Thick Film Chip Resistors
Ratings
Part No.
(inch size)
ERJPA2
(0402)
ERJP03
(0603)
ERJPA3
(0603)
ERJP06
(0805)
ERJP08
(1206)
ERJP14
(1210)
Power
(3)
Rating
at 70 °C
(W)
0.20
Limiting
Element
(1)
Voltage
(V)
50
Maximum
Overload
(2)
Voltage
(V)
100
Resistance
Tolerance
(%)
±0.5, ±1
±5
±0.5
0.20
150
200
±1
±5
0.25
(105 °C)
150
200
±0.5, ±1
±5
±0.5, ±1
0.50
400
600
±5
±0.5, ±1
0.66
500
1000
±5
±0.5, ±1
0.50
200
400
±5
1 to 3.3M (E24)
10 to 1M (E24, E96)
1 to 10M (E24)
10 to 1M (E24, E96)
1 to 1M (E24)
Resistance
Range
(Ω)
10 to 1M (E24, E96)
10 to 1M (E24)
10 to 1M (E24, E96)
10 to 1M (E24, E96)
1 to 1M (E24)
10 to 1M (E24, E96)
1 to 1.5M (E24)
10 to 1M (E24, E96)
T.C.R.
–6
(×10 /°C)
±100
±200
±150
±200
–55 to +155
R < 10
Ω
: –150 to +400
10
Ω
≤ R
: ±200
±100
–55 to +155
±200
R < 33
Ω
: ±300
33
Ω
≤ R
: ±100
R < 10
Ω
: –100 to +600 –55 to +155
10
Ω
≤ R < 33
Ω
: ±300
33
Ω
≤ R
: ±200
±100
R < 10
Ω
: –100 to +600 –55 to +155
10
Ω
≤ R
: ±200
±100
R < 10
Ω
: –100 to +600 –55 to +155
10
Ω
≤ R
: ±200
Grade 0
Category
AEC-Q200
Temperature
Grade
Range (°C)
–55 to +155
Grade 0
Grade 0
Grade 0
Grade 0
Grade 0
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=
Power Rating
×
Resistance Values, or Limiting Element Voltage listed above, whichever less.
(2) Overload Test Voltage (OTV) shall be determined from OTV=Specified Magnification (refer to performance)
×
RCWV or Maximum Overload Voltage listed above, whichever less.
(3) Use it on the condition that the case temperature is below the upper category temperature.
Power Derating Curve
For resistors operated in rated temperatures above 70 °C
or 105 °C, power rating shall be derated in accordance
with the figure on the right.
½
When the temperature of ERJP14 is 155 °C or less, the
derating start temperature can be changed to 125 °C. (See
the dotted line)
–55 °C
100
Rated Load (%)
80
60
40
20
0
–60 –40 –20
70 °C 105 °C
125 °C
ERJ PA3
ERJ P06,
P08
ERJ PA2, P03,
P14
155 °C
0 20 40 60 80 100 120 140 160 180
Ambient Temperature (°C)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
13 May. 2019
Anti-Surge Thick Film Chip Resistors
ESD Characteristic
R=0
Ω(≤
1.5 kΩ)/150
Ω(>
1.5 kΩ)
E
C=15 pF
Sample
0402 inch size
: E=±1 kV
0603, 0805, 1206, 1210 inch size : E=±3 kV
Anti-Surge Thick Film Chip Resistors(ERJP Series)
Thick Film Chip Resistors(ERJ Series)
ERJP03, PA3 (0603 inch /1608 mm size)
ERJPA3
ERJP03
Change Ratio of
Resistance Value (%)
0
-5
-10
-15
-20
-25
-30
ERJPA2
ERJ2G
Change Ratio of
Resistance Value (%)
5
ERJPA2 (0402 inch /1005 mm size)
5
0
-5
-10
-15
-20
-25
-30
ERJ3G
10
Ω
100
Ω
1 kΩ
10 kΩ 100 kΩ
1 MΩ
10
Ω
100
Ω
1 kΩ
10 kΩ 100 kΩ
1 MΩ
Change Ratio of
Resistance Value (%)
Change Ratio of
Resistance Value (%)
5
0
-5
-10
-15
-20
-25
-30
ERJP06 (0805 inch / 2012 mm size)
ERJP06
ERJ6G
5
0
-5
-10
-15
-20
-25
-30
ERJP08 (1206 inch / 3216 mm size)
ERJP08
ERJ8G
10
Ω
100
Ω
1 kΩ
10 kΩ 100 kΩ
1 MΩ
10
Ω
100
Ω
1 kΩ
10 kΩ 100 kΩ
1 MΩ
Change Ratio of
Resistance Value (%)
5
0
-5
-10
-15
-20
-25
-30
ERJP14 (1210 inch / 3225 mm size)
ERJP14
ERJ14
10
Ω
100
Ω
1 kΩ
10 kΩ 100 kΩ
1 MΩ
Performance
Test Item
Resistance
T. C. R.
Overload
Resistance to
Soldering Heat
Rapid Change of
Temperature
High Temperature
Exposure
Damp Heat, Steady State
Load Life in Humidity
Endurance at 70 °C
(ERJPA3 : 105 °C)
Performance Requirements
Within Specified Tolerance
Within Specified T. C. R.
Test Conditions
20 °C
+25 °C/+155 °C (ERJPA2 : +125 °C)
ERJP06
: Rated Voltag×1.77, 5 s
±2 %
ERJPA2, ERJPA3, ERJP08 : Rated Voltag×2.0, 5 s
Only when it is ERJP03 (D), P14 (D) : ±0.5 %
ERJP03, ERJP14
: Rated Voltag×2.5, 5 s
D : ±0.5 %, F, J : ±1 %
±1 %
±1 %
±1 %
270 °C, 10 s
–55 °C (30min.) / +155 °C (30min.) , 100 cycles
+155 °C, 1000 h
60 °C, 90 % to 95 %RH, 1000 h
60 °C, 90 % to 95 %RH,
±3 %
Only when it is ERJP03 (D), P14 (D) : ±1 % Rated Voltage, 1.5 h ON / 0.5 h OFF cycle, 1000 h
70 °C (ERJPA3 : 105 °C), Rated Voltage,
±3 %
Only when it is ERJP03 (D), P14 (D) : ±1 % 1.5 h ON / 0.5 h OFF cycle, 1000 h
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
13 May. 2019
Fixed Resistors
Safety Precautions (Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject to
change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products under the actual conditions for use.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as
damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment,
electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention
equipment.
½ Systems equipped with a protection circuit and a protection device.
½ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single
fault.
½ Systems equipped with an arresting the spread of fire or preventing glitch.
• These products are designed and manufactured for general and standard use in general elec tron ic equipment.
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
For applications in which special quality and reliability are required, or if the failure or malfunction of the
products may directly jeopardize life or cause threat of personal injury (such as for aircraft and aerospace
equipment, traffic and transport equipment, combustion equipment, medical equipment, accident prevention
and anti-theft devices, and safety equipment), please be sure to consult with our sales representative in
advance and to exchange product specifications which conform to such applications.
• These products are not intended for use in the following special conditions. Before using the products, carefully
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent.
2. In direct sunlight, outdoors, or in dust.
3. In salty air or air with a high concentration of corrosive gas, such as Cl
2
,H
2
S,NH
3
,SO
2
,or NO
X
.
4. Electric Static Discharge (ESD) Environment.
These components are sensitive to static electricity and can be damaged under static shock (ESD).
  
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic and Radioactive Environment.
Avoid any environment where strong electromagnetic waves and radiation exist.
6. In an environment where these products cause dew condensation.
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials.
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range
due to the effects of neighboring heat-generating components. Do not mount or place heat-generating
components or inflammables, such as vinyl-coated wires, near these products.
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to
leave water residues. Otherwise, the insulation performance may be deteriorated.
• Do not apply flux to these products after soldering. The activity of flux may be a cause of failures in these
products.
• Refer to the recommended soldering conditions and set the soldering condition. High peak temperature or
long heating time may impair the performance or the reliability of these products.
• Recommended soldering condition is for the guideline for ensuring the basic characteristics of the products,
not for the stable soldering conditions. Conditions for proper soldering should be set up according to individual
conditions.
01. Oct. 2019
(1) Precautions for use
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