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ERJPA3D1102V

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 11000ohm, 150V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP

器件类别:无源元件    电阻器   

厂商名称:Panasonic(松下)

厂商官网:http://www.panasonic.co.jp/semicon/e-index.html

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Panasonic(松下)
包装说明
CHIP
Reach Compliance Code
compli
ECCN代码
EAR99
其他特性
IEC60115-8
构造
RECTANGULAR PACKAGE
JESD-609代码
e3
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
155 °C
最低工作温度
-55 °C
封装高度
0.45 mm
封装长度
1.6 mm
封装形状
RECTANGULAR PACKAGE
封装形式
SMT
封装宽度
0.8 mm
包装方法
TR, PUNCHED, 7 INCH
额定功率耗散 (P)
0.25 W
额定温度
105 °C
参考标准
AEC-Q200
电阻
11000 Ω
电阻器类型
FIXED RESISTOR
尺寸代码
0603
表面贴装
YES
技术
METAL GLAZE/THICK FILM
温度系数
100 ppm/°C
端子面层
Tin (Sn)
端子形状
WRAPAROUND
容差
0.5%
工作电压
150 V
文档预览
Anti-Surge Thick Film Chip Resistors
Anti-Surge Thick Film Chip Resistors
Type:
ERJ PA2, P03, PA3, P06, P08, P14
Features
ESD
surge characteristics superior to standard metal film resistors
High reliability
Metal glaze thick film resistive element and three layers of electrodes
Suitable for both reflow and flow soldering
High power … 0.20 W : 0402 inch / 1005 mm size (ERJPA2), 0603 inch / 1608 mm size (ERJP03)
0.25 W : 0603 inch / 1608 mm size (ERJPA3)
0.50 W : 0805 inch / 2012 mm size (ERJP06), 1210 inch / 3225 mm size (ERJP14)
0.66 W : 1206 inch / 3216 mm size (ERJP08)
Reference Standards… IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B
AEC-Q200 qualified
RoHS compliant
As for Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions,
Please see Data Files
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
R
J
P
Resistance Tolerance
0
6
D
1
0
0
2
V
Size, Power Rating
Product Code
Thick Film
Code Inch Power R.
Chip Resistors PA2 0402 0.20 W
P03 0603 0.20 W
PA3 0603 0.25 W
P06 0805 0.50 W
P08 1206 0.66 W
P14 1210 0.50 W
Resistance Value
The first two or three digits are significant figures
of resistance and the third or 4th one denotes
number of zeros following.
Three digit type (±5 %),
four digit type (±1 %, ±0.5 %)
Example: 222→2.2k
Ω,
1002→10k
Ω
Code
X
Packaging Methods
Packaging
Punched Carrier Taping
2 mm pitch, 10,000 pcs.
Punched Carrier Taping
4 mm pitch, 5,000 pcs.
Part No.
ERJPA2
ERJP03
ERJPA3
ERJP06
ERJP08
Code Tolerance
D
± 0.5 %
F
±1%
J
±5%
V
U
Embossed Carrier Taping
ERJP14
4 mm pitch, 5,000 pcs.
Construction
Dimensions in mm (not to scale)
L
a
Protective coating
Electrode (Inner)
W
Alumina substrate
t
b
Electrode
(Between)
Dimensions (mm)
L
W
a
b
t
1.00
±0.05
0.50
±0.05
0.20
±0.15
0.25
±0.05
0.35
±0.05
1.60
±0.15
0.80
+0.15
0.15
+0.15
0.30
±0.15
0.45
±0.10
–0.10
–0.05
1.60
±0.15
0.80
+0.15
0.15
+0.15
0.25
±0.10
0.45
±0.10
–0.10
–0.05
2.00
±0.20
1.25
±0.10
0.25
±0.20
0.40
±0.20
0.60
±0.10
3.20
+0.05
–0.20
Part No.
ERJPA2
ERJP03
ERJPA3
Mass (Weight)
[g/1000 pcs.]
0.8
2
2
4
10
16
Thick film
resistive element
Electrode (Outer)
ERJP06
ERJP08
ERJP14
1.60
+0.05
–0.15
0.40
±0.20
0.50
±0.20
0.60
±0.10
3.20
±0.20
2.50
±0.20
0.35
±0.20
0.50
±0.20
0.60
±0.10
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
11 Nov. 2017
Anti-Surge Thick Film Chip Resistors
Ratings
Part No.
(inch size)
ERJPA2
(0402)
ERJP03
(0603)
ERJPA3
(0603)
ERJP06
(0805)
ERJP08
(1206)
ERJP14
(1210)
Power
(3)
Rating
at 70 °C
(W)
0.20
Limiting
Element
(1)
Voltage
(V)
50
Maximum
Overload
(2)
Voltage
(V)
100
Resistance
Tolerance
(%)
±0.5, ±1
±5
±0.5
0.20
150
200
±1
±5
0.25
150
200
±0.5, ±1
±5
±0.5, ±1
0.50
400
600
±5
±0.5, ±1
0.66
500
1000
±5
±0.5, ±1
0.50
200
400
±5
1 to 3.3M (E24)
10 to 1M (E24, E96)
1 to 10M (E24)
10 to 1M (E24, E96)
1 to 1M (E24)
Resistance
Range
(Ω)
10 to 1M (E24, E96)
10 to 1M (E24)
10 to 1M (E24, E96)
10 to 1M (E24, E96)
1 to 1M (E24)
10 to 1M (E24, E96)
1 to 1.5M (E24)
10 to 1M (E24, E96)
T.C.R.
–6
(×10 /°C)
±100
±200
±150
±200
–55 to +155
R < 10
Ω
: –150 to +400
10
Ω
≤ R
: ±200
±100
–55 to +155
±200
R < 33
Ω
: ±300
33
Ω
≤ R
: ±100
R < 10
Ω
: –100 to +600 –55 to +155
10
Ω
≤ R < 33
Ω
: ±300
33
Ω
≤ R
: ±200
±100
R < 10
Ω
: –100 to +600 –55 to +155
10
Ω
≤ R
: ±200
±100
R < 10
Ω
: –100 to +600 –55 to +155
10
Ω
≤ R
: ±200
Grade 0
Category
AEC-Q200
Temperature
Grade
Range (°C)
–55 to +155
Grade 0
Grade 0
Grade 0
Grade 0
Grade 0
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=
Power Rating
×
Resistance Values, or Limiting Element Voltage listed above, whichever less.
(2) Overload Test Voltage (OTV) shall be determined from OTV=Specified Magnification (refer to performance)
×
RCWV or Maximum Overload Voltage listed above, whichever less.
(3) Use it on the condition that the case temperature is below the upper category temperature.
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance with
the figure on the right.
½
When the temperature of ERJP14 is 155 °C or less, the
derating start temperature can be changed to 125 °C. (See
the dotted line)
–55 °C
100
Rated Load (%)
80
60
40
20
0
–60 –40 –20
70 °C
125 °C
ERJ P06,
P08
ERJ PA2, P03,
PA3, P14
155 °C
0 20 40 60 80 100 120 140 160 180
Ambient Temperature (°C)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
11 Nov. 2017
Anti-Surge Thick Film Chip Resistors
ESD Characteristic
R=0
Ω(≤
1.5k
Ω)/150 Ω(>
1.5k
Ω)
E
C=150p F
Sample
0402 inch size
: E=±1k V
0603, 0805, 1206, 1210 inch size : E=±3k V
Anti-Surge Thick Film Chip Resistors(ERJP Type)
Thick Film Chip Resistors(ERJ Type)
ERJP03, PA3 (0603 inch /1608 mm size)
ERJPA3
ERJP03
5%
Change Ratio of
Resistance Value
0%
-5%
-10%
-15%
-20%
-25%
-30%
ERJPA2 (0402 inch /1005 mm size)
ERJPA2
Change Ratio of
Resistance Value
ERJ2G
5%
0%
-5%
-10%
-15%
-20%
-25%
-30%
ERJ3G
10
Ω
100
Ω
1k
Ω
10k
Ω
100k
Ω
1M
Ω
10
Ω
100
Ω
1k
Ω
10k
Ω
100k
Ω
1M
Ω
5%
Change Ratio of
Resistance Value
0%
-5%
-10%
-15%
-20%
-25%
-30%
ERJP06 (0805 inch / 2012 mm size)
ERJP06
ERJ6G
Change Ratio of
Resistance Value
5%
0%
-5%
-10%
-15%
-20%
-25%
-30%
ERJP08 (1206 inch / 3216 mm size)
ERJP08
ERJ8G
10
Ω
100
Ω
1k
Ω
10k
Ω
100k
Ω
1M
Ω
10
Ω
100
Ω
1k
Ω
10k
Ω
100k
Ω
1M
Ω
5%
Change Ratio of
Resistance Value
0%
-5%
-10%
-15%
-20%
-25%
-30%
ERJP14 (1210 inch / 3225 mm size)
ERJP14
ERJ14
10
Ω
100
Ω
1k
Ω
10k
Ω
100k
Ω
1M
Ω
Performance
Test Item
Resistance
T. C. R.
Overload
Resistance to
Soldering Heat
Rapid Change of
Temperature
High Temperature
Exposure
Damp Heat, Steady State
Load Life in Humidity
Endurance at 70 °C
Performance Requirements
Within Specified Tolerance
Within Specified T. C. R.
Test Conditions
20 °C
+25 °C/+155 °C (ERJPA2 : +125 °C)
ERJP06
: Rated Voltag×1.77, 5 s
±2%
ERJPA2, ERJPA3, ERJP08 : Rated Voltag×2.0, 5 s
Only when it is ERJP03 (D), P14 (D) : ±0.5%
ERJP03, ERJP14
: Rated Voltag×2.5, 5 s
D : ±0.5%, F, J : ±1%
±1%
±1%
±1%
270 °C, 10 s
–55 °C (30 min.) / +155 °C (30 min.) , 100 cycles
+155 °C, 1000 h
60 °C, 90% to 95%RH, 1000 h
60 °C, 90% to 95%RH,
±3%
Only when it is ERJP03 (D), P14 (D) : ±1% Rated Voltage, 1.5 h ON / 0.5 h OFF cycle, 1000 h
70 °C, Rated Voltage,
±3%
Only when it is ERJP03 (D), P14 (D) : ±1% 1.5 h ON / 0.5 h OFF cycle, 1000 h
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
11 Nov. 2017
Surface Mount Resistors Safety precautions
Safety Precautions (Common precautions for Surface Mount Resistors)
The following are precautions for individual products. Please also refer to the common precautions for Fixed Resistors
in this catalog.
1. Take measures against mechanical stress during and after mounting of Surface Mount Resistors (hereafter called the
resistors) so as not to damage their electrodes and protective coatings.
Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur.
2. Keep the rated power and ambient temperature within the specified derating curve.
Some circuit boards, wiring patterns, temperatures of heat generated by adjacent components, or ambient
temperatures can become factors in the rise of the temperature of the resistors, regardless of the level of power
applied. Therefore, check the conditions before use and optimize them so as not to damage the boards and peripheral
components.
Make sure to contact us before using the resistors under special conditions.
3. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the
operations of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
4. Before using halogen-based or other high-activity flux, check the possible effects of the flux residues on the
performance and reliability of the resistors.
5. When soldering with a soldering iron, never touch the resistors'bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).
6. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
7. When the resistors' protective coatings are chipped, flawed, or removed, the characteristics of the resistors may be
impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during
handling of the boards with the resistors mounted.
8. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'
protective coatings and bodies may be chipped, affecting their performance.
9. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
10. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of immersion.
11. Transient voltage
If there is a possibility that the transient phenomenon (significantly high voltage applied in a short time) may
occur or that a high voltage pulse may be applied, make sure to evaluate and check the characteristics of
Fixed Metal (Oxide) Film Resistors mounted on your product rather than only depending on the calculated
power limit or steady-state conditions to complete the design or decide to use the resistors.
12. Do not apply excessive tension to the terminals.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Sep. 2014
Safety Precautions (Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
½
Systems equipped with a protection circuit and a protection device
½
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl
2
, H
2
S, NH
3
, SO
2
, or NO
2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products.
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl
2
, H
2
S, NH
3
, SO
2
, or NO
2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
01 Sep. 2014
查看更多>
参数对比
与ERJPA3D1102V相近的元器件有:ERJPA3F7322V、ERJPA3F24R9V、ERJ-P08J364V、ERJ-P08J111V、ERJ-P14J113U、ERJPA3F1242V、ERJPA3F2492V、ERJPA3F4641V。描述及对比如下:
型号 ERJPA3D1102V ERJPA3F7322V ERJPA3F24R9V ERJ-P08J364V ERJ-P08J111V ERJ-P14J113U ERJPA3F1242V ERJPA3F2492V ERJPA3F4641V
描述 Fixed Resistor, Metal Glaze/thick Film, 0.25W, 11000ohm, 150V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP Fixed Resistor, Metal Glaze/thick Film, 0.25W, 73200ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP Fixed Resistor, Metal Glaze/thick Film, 0.25W, 24.9ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP RES SMD 360K OHM 5% 2/3W 1206 RES SMD 110 OHM 5% 2/3W 1206 RES SMD 11K OHM 5% 1/2W 1210 Fixed Resistor, Metal Glaze/thick Film, 0.25W, 12400ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP Fixed Resistor, Metal Glaze/thick Film, 0.25W, 24900ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP Fixed Resistor, Metal Glaze/thick Film, 0.25W, 4640ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP
温度系数 100 ppm/°C 100 ppm/°C 100 ppm/°C ±200ppm/°C ±200ppm/°C ±200ppm/°C 100 ppm/°C 100 ppm/°C 100 ppm/°C
容差 0.5% 1% 1% ±5% ±5% ±5% 1% 1% 1%
是否Rohs认证 符合 符合 符合 - - - 符合 符合 符合
包装说明 CHIP SMT, 0603 SMT, 0603 - - - SMT, 0603 SMT, 0603 SMT, 0603
Reach Compliance Code compli compliant compliant - - - compliant compliant compliant
其他特性 IEC60115-8 IEC60115-8 IEC60115-8 - - - IEC60115-8 IEC60115-8 IEC60115-8
构造 RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE - - - RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE
JESD-609代码 e3 e3 e3 - - - e3 e3 e3
安装特点 SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT - - - SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT
端子数量 2 2 2 - - - 2 2 2
最高工作温度 155 °C 155 °C 155 °C - - - 155 °C 155 °C 155 °C
最低工作温度 -55 °C -55 °C -55 °C - - - -55 °C -55 °C -55 °C
封装高度 0.45 mm 0.45 mm 0.45 mm - - - 0.45 mm 0.45 mm 0.45 mm
封装长度 1.6 mm 1.6 mm 1.6 mm - - - 1.6 mm 1.6 mm 1.6 mm
封装形状 RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE - - - RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE
封装形式 SMT SMT SMT - - - SMT SMT SMT
封装宽度 0.8 mm 0.8 mm 0.8 mm - - - 0.8 mm 0.8 mm 0.8 mm
包装方法 TR, PUNCHED, 7 INCH TR, PUNCHED, 7 INCH TR, PUNCHED, 7 INCH - - - TR, PUNCHED, 7 INCH TR, PUNCHED, 7 INCH TR, PUNCHED, 7 INCH
额定功率耗散 (P) 0.25 W 0.25 W 0.25 W - - - 0.25 W 0.25 W 0.25 W
额定温度 105 °C 105 °C 105 °C - - - 105 °C 105 °C 105 °C
参考标准 AEC-Q200 AEC-Q200 AEC-Q200 - - - AEC-Q200 AEC-Q200 AEC-Q200
电阻 11000 Ω 73200 Ω 24.9 Ω - - - 12400 Ω 24900 Ω 4640 Ω
电阻器类型 FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR - - - FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR
尺寸代码 0603 0603 0603 - - - 0603 0603 0603
表面贴装 YES YES YES - - - YES YES YES
技术 METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM - - - METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
端子面层 Tin (Sn) Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier - - - Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状 WRAPAROUND WRAPAROUND WRAPAROUND - - - WRAPAROUND WRAPAROUND WRAPAROUND
工作电压 150 V 150 V 150 V - - - 150 V 150 V 150 V
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#准备工作 ## 硬件 - ESP32-S3 TFT Feather开发板一块 ! (http...
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器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
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