ES52C5C30N-26.000M
Series
RoHS Compliant (Pb-free) 3.0V 3.2mm x 5mm Ceramic
SMD Clipped Sinewave TC(VC)XO
Operating Temperature Range
-20°C to +70°C
Frequency Stability
±3.0ppm Maximum
RoHS
Pb
ES52C5 C 30 N -26.000M
Nominal Frequency
26.000MHz
Control Voltage
None (No Connect on Pin 1)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Stability vs. Frequency
Tolerance
Frequency Stability
Frequency Stability vs. Input Voltage
Frequency Stability vs. Aging
Frequency Stability vs. Load
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage
Load Drive Capability
Output Logic Type
Control Voltage
Phase Noise
Start Up Time
Storage Temperature Range
26.000MHz
±1.0ppm Maximum (at 25°C ±2°C, at Vdd=3.0Vdc, and Vc=1.5Vdc)
±3.0ppm Maximum (Inclusive of Operating Temperature Range, at Vdd=3.0Vdc and Vc=1.5Vdc)
±0.3ppm Maximum (±5%)
±1ppm/year Maximum (at 25°C)
±0.2ppm Maximum (±1kOhm//±1pF)
-20°C to +70°C
+3.0Vdc ±5%
2.0mA Maximum
0.7Vp-p Clipped Sinewave Minimum (External DC-Cut capacitor required, 1000pF recommended)
10kOhms//10pF
Clipped Sinewave
None (No Connect on Pin 1)
-80dBc/Hz at 10Hz Offset, -115dBc/Hz at 100Hz Offset, -135dBc/Hz at 1kHz Offset, and -148dBc/Hz at
10kHz Offset (Typical Values at 12.800MHz)
5mSec Maximum
-40°C to +85°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev G 2/16/2010 | Page 1 of 5
ES52C5C30N-26.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
2
CONNECTION
No Connect
Ground
Output
Supply Voltage
1.2 MAX
4
1
MARKING
ORIENTATION
1.60 ±0.20
3
4
LINE MARKING
5.00
±0.20
1.20
±0.20 (X4)
3
2
2.60
±0.20
1
2
E26.000
E=Ecliptek Designator
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
3.20
±0.20
0.80 ±0.20
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.1 (X4)
1.4 (X4)
2.4
Solder Land
(X4)
1.2
All Tolerances are ±0.1
OUTPUT WAVEFORM
CLOCK OUTPUT
0V
DC
V
P-P
www.ecliptek.com | Specification Subject to Change Without Notice | Rev G 2/16/2010 | Page 2 of 5
ES52C5C30N-26.000M
Test Circuit for No Connect Option
Oscilloscope
Frequency
Counter
Current
Meter
Power
Supply
Voltage
Meter
0.01µF
(Note 1)
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
1000pF
0.1µF
(Note 1)
Ground
R
L
= 10kOhms
C
L
= 10pF
(Note 3)
No Connect
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev G 2/16/2010 | Page 3 of 5
ES52C5C30N-26.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev G 2/16/2010 | Page 4 of 5
ES52C5C30N-26.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev G 2/16/2010 | Page 5 of 5
