ES54K2G30V-19.200M
Series
RoHS Compliant (Pb-free) 2.5V 2mm x 2.5mm Ceramic
SMD Clipped Sinewave TC(VC)XO
Operating Temperature Range
-40°C to +85°C
Frequency Stability vs. Temperature
±3.0ppm Maximum
RoHS
Pb
ES54K2 G 30 V -19.200M
Nominal Frequency
19.200MHz
Control Voltage
1.4Vdc ±1.0Vdc
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Stability vs. Frequency
Tolerance
Frequency Stability vs. Temperature
Frequency Stability vs. Input Voltage
Frequency Stability vs. Aging
Frequency Stability vs. Load
Frequency Stability vs. Reflow
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage
Load Drive Capability
Output Logic Type
Control Voltage
Frequency Deviation
Linearity
Transfer Function
Input Impedance
Phase Noise
Start Up Time
Storage Temperature Range
19.200MHz
±1.0ppm Maximum (at 25°C ±2°C, at Vdd=2.5Vdc)
±3.0ppm Maximum (Inclusive of Operating Temperature Range, at Vdd=2.5Vdc)
±0.2ppm Maximum (±5%)
±1ppm/year Maximum (at 25°C)
±0.2ppm Maximum (±1kOhm//±1pF)
±1.0ppm Maximum (at 25°C, 1 hour after reflow, 2 times)
-40°C to +85°C
+2.5Vdc ±5%
2.0mA Maximum
0.8Vp-p Clipped Sinewave Minimum, 0.9Vp-p Typical (External DC-Cut capacitor required, 150pF NPO
recommended)
10kOhms//10pF
Clipped Sinewave
1.4Vdc ±1.0Vdc
±5ppm Minimum
±10% Maximum
Positive Transfer Characteristic
500kOhms Minimum
-115dBc/Hz at 100Hz Offset, -135dBc/Hz at 1kHz Offset, and -148dBc/Hz at 10kHz Offset
2mSec Maximum
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014 Condition A
MIL-STD-883, Method 1014 Condition C
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 1 of 5
ES54K2G30V-19.200M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
2
3
0.9 MAX
4
1
1.45
±0.15
3
2
0.70 ±0.15
(X4)
MARKING
ORIENTATION
0.60 ±0.15
4
CONNECTION
Voltage Control
Case/Ground
Output
Supply Voltage
LINE MARKING
1
E19.200
E=Ecliptek Designator
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
2.50
±0.15
0.50
±0.15 (X4)
2
2.00
±0.15
Suggested Solder Pad Layout
All Dimensions in Millimeters
0.9 (X4)
0.8 (X4)
1.25
Solder Land
(X4)
0.55
All Tolerances are ±0.1
OUTPUT WAVEFORM
CLOCK OUTPUT
0V
DC
V
P-P
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 2 of 5
ES54K2G30V-19.200M
Test Circuit for Voltage Control Option
Oscilloscope
Frequency
Counter
Current
Meter
Power
Supply
Voltage
Meter
0.01µF
(Note 1)
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
150pF
0.1µF
(Note 1)
Ground
R
L
= 10kOhms
C
L
= 10pF
(Note 3)
Voltage
Control
Power
Supply
Voltage
Meter
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency
ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 3 of 5
ES54K2G30V-19.200M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 4 of 5
ES54K2G30V-19.200M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 5 of 5
