ESDALC6V1-5T6
Low capacitance Transil™ arrays for ESD protection
Features
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■
■
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5 unidirectional Transil diodes
Breakdown voltage V
BR
= 6.1 V min.
Low diode capacitance: 7 pF typ.
Low leakage current < 100 nA
Very small PCB area: 1.0 mm²
350 µm pitch micro-package
Lead-free and RoHS package
Figure 1.
Micro DFN package
1.0 x 1.0-6L
Complies with the following standards
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Functional diagram (top view)
IEC 61000-4-2:
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883G- Method 3015-7: class3B:
– >8 kV (human body model)
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Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
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Cellular phone handsets and accessories
Computers
Printers
Communication systems
Video equipment
Set top boxes
Description
The ESDALC6V1-5T6 is monolithic arrays
designed to protect up to 5 lines against ESD
transients.
The device is ideal for applications where both
reduced print circuit board space and high ESD
protection level are required.
TM:
Transil is a trademark of STMicroelectronics
March 2011
Doc ID 16741 Rev 2
1/11
www.st.com
11
Characteristics
ESDALC6V1-5T6
1
Characteristics
Table 1.
Symbol
V
PP
P
PP
I
pp
T
j
T
stg
T
L
Absolute maximum ratings (T
amb
= 25 °C)
Parameter
ESD IEC 61000-4-2, air discharge
ESD IEC 61000-4-2, contact discharge
Peak pulse power dissipation (8/20 µs)
(1)
T
j
initial = T
amb
Value
15
8
25
2
125
-55 + 150
260
Unit
kV
W
A
°C
°C
°C
Repetitive peak pulse current typical value (8/20 µs)
Junction temperature
Storage temperature range
Maximum lead temperature for soldering during 10 s
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Figure 2.
Electrical characteristics (definitions)
I
I
F
Symbol
V
BR
=
I
RM
=
V
RM
=
Parameter
Breakdown voltage
Leakage current @ V
RM
Stand-off voltage
V
F
V
CL
V
BR
V
RM
I
RM
V
Slope: 1/R
d
I
PP
Table 2.
Symbol
V
BR
I
RM
C
Electrical characteristics (values, T
amb
= 25 °C)
Test conditions
I
R
= 1 mA
V
RM
= 3 V
V
R
= 3 V DC, F
osc
= 1 MHz, V
osc
= 30 mV rms
7
Min.
6.1
Typ.
Max.
7.2
100
9
Unit
V
nA
pF
2/11
Doc ID 16741 Rev 2
ESDALC6V1-5T6
Characteristics
Figure 3.
Relative variation of peak pulse
power versus initial junction
temperature
Figure 4.
Peak pulse power versus
exponential pulse duration
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
P
PP
[T
j
initial]/P
PP
[T
j
initial = 25 °C]
1000
P
PP
(W)
T
j
initial = 25 °C
100
10
Tj(°C)
0
25
50
75
100
125
150
1
t
p
(µs)
1
10
100
1000
Figure 5.
Clamping voltage versus peak
pulse current (typical values,
exponential waveform)
Figure 6.
Forward voltage drop versus peak
forward current (typical values)
10.0
I
PP
(A)
Wave 8/20 µs T= 25 °C
10.00
I
FM
(A)
1.00
1.0
0.10
0.01
0.1
5
6
7
8
9
10
11
V
CL
(V)
12
13
0.00
0.00
V
FM
(V)
0.50
1.00
1.50
2.00
2.50
3.00
Figure 7.
Junction capacitance versus
reverse voltage applied
(typical values)
Figure 8.
Relative variation of leakage
current versus junction
temperature (typical values)
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
C (pF)
F = 1 MHz
V
OSC
= 30 mV
RMS
T
J
= 25 °C
100
I
R
[T
j
] / I
R
[T
j
= 25 °C]
V
R
= 3 V
IO/GND
IO/IO
10
V
0
1
2
3
4
5
1
25
50
75
100
T
j
(°C)
125
Doc ID 16741 Rev 2
3/11
Ordering information scheme
ESDALC6V1-5T6
Figure 9.
dB
S21 attenuation measurement
results of each channel
Figure 10. Analog crosstalk measurements
between channels
0.00
-20.00
-40.00
0.00
dB
-5.00
-10.00
-60.00
-15.00
-80.00
-20.00
-100.00
-25.00
-120.00
-30.00
100.0K
1.0M
10.0M
100.0M
1.0G
F/Hz
-140.00
100.0K
1.0M
10.0M
100.0M
1.0G
F/Hz
Figure 11. ESD response to IEC 61000-4-2
(+15 kV air discharge) on each
channel
10 V/Div
Figure 12. ESD response to IEC 61000-4-2
(-15 kV air discharge) on each
channel
5 V/Div
C2
C2
100 ns/Div
100 ns/Div
2
Ordering information scheme
Figure 13. Ordering information scheme
ESDA LC
ESD array
Low capacitance
Breakdown voltage
6V1 = 6.1 Volts min
Package
5 = 5 lines
T = Micro DFN, pitch 0.35 mm
6 = 6 pads
6V1
5T6
4/11
Doc ID 16741 Rev 2
ESDALC6V1-5T6
Package information
3
Package information
●
●
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
Table 3.
Micro DFN
1.0 x 1.0-6L
dimensions
Dimensions
Ref.
D
Index area
(D/2xE/2)
Millimeters
Min.
Typ.
-
0.02
0.15
1.00
1.00
0.32
0.35
Max.
0.40
0.05
0.20
1.05
1.05
0.42
-
Min.
0.012
0.00
Inches
Typ.
-
Max.
0.016
e
b
0.56
E
Index area
(D/2xE/2)
L=0.36
±0.10
A
A1
b
BOTTOM VIEW
0.31
0.00
0.10
0.95
0.95
0.22
-
PIN#1 ID
0.0008 0.002
L1
TOP VIEW
0.06
0.004 0.006 0.008
0.037 0.039 0.041
0.037 0.039 0.041
0.009 0.012 0.016
-
0.014
-
D
A1
SEATING
PLANE
A
SIDE VIEW
E
L1
e
Figure 14. Footprint dimensions (in mm) Figure 15. Marking
0.175
0.150
0.175
0.520
0.240
K
1.280
0.560
0.375 0.200
0.900
Note:
Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no
case should this product marking be used to orient the component for its placement on a
PCB. Only pin 1 mark is to be used for this purpose.
0.520
Pin 1
Doc ID 16741 Rev 2
5/11
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