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EVAL6229PD

8-bit Microcontrollers - MCU

器件类别:开发板/开发套件/开发工具   

厂商名称:ST(意法半导体)

厂商官网:http://www.st.com/

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器件参数
参数名称
属性值
产品种类
Product Category
Power Management IC Development Tools
制造商
Manufacturer
ST(意法半导体)
RoHS
Details
产品
Product
Evaluation Boards
类型
Type
Motor / Motion Controllers & Drivers
工具用于评估
Tool Is For Evaluation Of
L6235
Input Voltage
8 V to 52 V
系列
Packaging
Bulk
Output Current
2.8 A
工厂包装数量
Factory Pack Quantity
1
单位重量
Unit Weight
2.205 lbs
文档预览
L6229
DMOS driver for 3-phase brushless DC motor
Datasheet
-
production data
Thermal shutdown
Undervoltage lockout
Integrated fast freewheeling diodes
Description
The L6229 is a DMOS fully integrated 3-phase
motor driver with overcurrent protection.
Realized in BCD technology, the device combines
isolated DMOS power transistors with CMOS and
bipolar circuits on the same chip.
The device includes all the circuitry needed to
drive a 3-phase BLDC motor including: a 3-phase
DMOS bridge, a constant off time PWM current
controller and the decoding logic for single ended
hall sensors that generates the required
sequence for the power stage.
Available in PowerSO36 and SO24 (20 + 2 + 2)
packages, the L6229 features a non-dissipative
overcurrent protection on the high-side power
MOSFETs and thermal shutdown.
Features
Operating supply voltage from 8 to 52 V
2.8 A output peak current (1.4 A DC)
R
DS(ON)
0.73
typ. value at T
j
= 25 °C
Operating frequency up to 100 KHz
Non-dissipative overcurrent detection and
protection
Diagnostic output
Constant t
OFF
PWM current controller
Slow decay synchr. rectification
60° and 120° hall effect decoding logic
Brake function
Tachometer output for speed loop
Cross conduction protection
Table 1. Order codes
Part number
L6229DP
L6229D
Package
PowerSO36
SO24
October 2018
This is information on a product in full production.
DocID9455 Rev 5
1/33
www.st.com
Contents
L6229
Contents
1
2
3
4
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Circuit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1
5.2
Power stages and charge pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Logic inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6
7
8
9
10
11
PWM current control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Slow decay mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Decoding logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Tachometer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Non-dissipative overcurrent detection and protection . . . . . . . . . . . . 22
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
11.1
11.2
Output current capability and IC power dissipation . . . . . . . . . . . . . . . . . 26
Thermal management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
12
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
12.1
12.2
PowerSO36 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
SO24 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
2/33
DocID9455 Rev 5
L6229
Block diagram
1
Block diagram
Figure 1. Block diagram
DocID9455 Rev 5
3/33
33
Maximum ratings
L6229
2
Maximum ratings
Table 2. Absolute maximum ratings
Symbol
V
S
V
OD
V
BOOT
V
IN
, V
EN
V
REF
V
RCOFF
V
SENSE
I
S(peak)
I
S
T
stg
, T
OP
Supply voltage
Parameter
Test conditions
V
SA
= V
SB
= V
S
V
SA
= V
SB
= V
S
= 60 V;
V
SENSEA
= V
SENSEB
= GND
V
SA
= V
SB
= V
S
-
-
-
-
-
V
SA
= V
SB
= V
S
; T
PULSE
< 1 ms
V
SA
= V
SB
= V
S
-
Value
60
60
V
S
+ 10
-0.3 to 7
-0.3 to 7
-0.3 to 7
-0.3 to 7
-1 to 4
3.55
1.4
-40 to 150
Unit
V
V
V
V
V
V
V
V
A
A
°C
Differential voltage between:
VS
A
, OUT
1
, OUT
2
, SENSE
A
and VS
B
, OUT
3
,
SENSE
B
Bootstrap peak voltage
Logic inputs voltage range
Voltage range at pin VREF
Voltage range at pin RCOFF
V
RCPULSE
Voltage range at pin RCPULSE
Voltage range at pins SENSE
A
and SENSE
B
Pulsed supply current (for each VS
A
and VS
B
pin)
DC supply current (for each VS
A
and VS
B
pin)
Storage and operating temperature range
Table 3. Recommended operating condition
Symbol
V
S
V
OD
V
REF
V
SENSE
I
OUT
f
SW
Supply voltage
Differential voltage between:
VS
A
, OUT
1
, OUT
2
, SENSE
A
and VS
B
, OUT
3
,
SENSE
B
Voltage range at pin VREF
Voltage range at pins SENSE
A
and SENSE
B
DC output current
Switching frequency
Parameter
Test conditions
V
SA
= V
SB
= V
S
V
SA
= V
SB
= V
S
;
V
SENSEA
= V
SENSEB
-
(pulsed t
W
< t
rr
)
(DC)
V
SA
= V
SB
= V
S
-
Min. Max. Unit
12
-
-0.1
-6
-1
-
-
52
52
5
6
1
1.4
100
V
V
V
V
V
A
KHz
4/33
DocID9455 Rev 5
L6229
Table 4. Thermal data
Symbol
R
th(j-pins)
R
th(j-case)
R
th(j-amb)1
R
th(j-amb)1
R
th(j-amb)1
R
th(j-amb)2
Description
Maximum thermal resistance junction pins
Maximum thermal resistance junction case
Maximum thermal resistance junction ambient
(1)
Maximum thermal resistance junction ambient
(2)
Maximum thermal resistance junction ambient
(3)
Maximum thermal resistance junction ambient
(4)
SO24
15
-
55
-
-
78
Maximum ratings
PowerSO36
-
2
-
36
16
63
Unit
C/W
C/W
C/W
C/W
C/W
C/W
1. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the bottom side of 6 cm
2
(with a thickness of
35 µm).
2. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm
2
(with a thickness of 35 µm).
3. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm
2
(with a thickness of 35 µm),
16 via holes and a ground layer.
4. Mounted on a multilayer FR4 PCB without any heat-sinking surface on the board.
DocID9455 Rev 5
5/33
33
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