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F1T7GHR0

Rectifiers 1A, 1000V, G.P. FAST REC. PLASTIC RECTIFIER

器件类别:分立半导体    二极管   

厂商名称:Taiwan Semiconductor

厂商官网:http://www.taiwansemi.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Taiwan Semiconductor
包装说明
O-PALF-W2
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
HIGH RELIABILITY, LOW POWER LOSS
外壳连接
ISOLATED
配置
SINGLE
二极管元件材料
SILICON
二极管类型
RECTIFIER DIODE
JESD-30 代码
O-PALF-W2
JESD-609代码
e3
元件数量
1
端子数量
2
最高工作温度
150 °C
最低工作温度
-55 °C
最大输出电流
1 A
封装主体材料
PLASTIC/EPOXY
封装形状
ROUND
封装形式
LONG FORM
参考标准
AEC-Q101
最大重复峰值反向电压
1000 V
最大反向恢复时间
0.5 µs
表面贴装
NO
端子面层
Matte Tin (Sn)
端子形式
WIRE
端子位置
AXIAL
Base Number Matches
1
文档预览
F1T1G thru F1T7G
Taiwan Semiconductor
CREAT BY ART
FEATURES
- Glass passivated chip junction
- High efficiency, Low VF
- High current capability
- High reliability
- High surge current capability
- Low power loss
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
Glass Passivated Fast Recovery Rectifiers
MECHANICAL DATA
Case:
TS-1
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Weight:
0.2g (approximately)
TS-1
MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS
(T
A
=25℃ unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage (Note 1)
@1A
Maximum reverse current @ rated VR
T
J
=25
T
J
=125
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
Trr
Cj
R
θJA
T
J
T
STG
150
15
90
- 55 to +150
- 55 to +150
O
F1T
1G
50
35
50
F1T
2G
100
70
100
F1T
3G
200
140
200
F1T
4G
400
280
400
1
30
1.3
5
150
F1T
5G
600
420
600
F1T
6G
800
560
800
F1T
7G
1000
700
1000
UNIT
V
V
V
A
A
V
μA
Maximum reverse recovery time (Note 2)
Typical junction capacitance (Note 3)
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
250
500
ns
pF
C/W
O
O
C
C
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Document Number: DS_D1505007
Version: G14
F1T1G thru F1T7G
Taiwan Semiconductor
CREAT BY ART
ORDERING INFORMATION
PART NO.
AEC-Q101
QUALIFIED
A0
F1TxG
(Note 1)
Prefix "H"
A1
R0
B0
Note 1: "x" defines voltage from 50V (F1T1G) to 1000V (F1T7G)
Suffix "G"
PACKING CODE
GREEN COMPOUND
CODE
TS-1
TS-1
TS-1
TS-1
3,000 / Ammo box (52mm taping)
3,000 / Ammo box (26mm taping)
5,000 / 13" Paper reel
1,000 / Bulk packing
PACKAGE
PACKING
EXAMPLE
PREFERRED P/N
F1T1G A0
F1T1G A0G
F1T1GHA0
PART NO.
F1T1G
F1T1G
F1T1G
H
AEC-Q101
QUALIFIED
PACKING CODE
A0
A0
A0
G
Green compound
AEC-Q101 qualified
GREEN COMPOUND
CODE
DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
FIG.1- MAXIMUM FORWARD CURRENT DERATING
CURVE
AVERAGE FORWARD CURRENT (A)
RESISTIVE OR
INDUCTIVE LOAD
INSTANTANEOUS REVERSE CURRENT (μA)
FIG. 2- TYPICAL REVERSE CHARACTERISTICS
1000
1.5
1.25
1
0.75
0.5
0.25
0
0
25
50
75
100
125
(
o
C)
150
175
AMBIENT TEMPERATURE
100
TJ=125℃
10
TJ=75℃
1
TJ=25℃
0.1
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
PEAK FORWARD SURGE CURRENT (A)
FIG. 3- MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
INSTANTANEOUS FORWARD CURRENT
(A)
50
40
30
20
10
0
1
10
NUMBER OF CYCLES AT 60 Hz
100
FIG. 4- TYPICAL FORWARD CHARACTERISTICS
10
1
0.1
8.3ms Single Half Sine Wave
Pulse Width=300μs
1% Duty Cycle
0.01
0.4
0.6
0.8
1
1.2
1.4
1.6
FORWARD VOLTAGE (V)
Document Number: DS_D1505007
Version: G14
F1T1G thru F1T7G
Taiwan Semiconductor
CREAT BY ART
FIG. 5- TYPICAL JUNCTION CAPACITANCE
100
JUNCTION CAPACITANCE (pF)
10
f=1.0MHz
Vslg=50mVp-p
1
1
10
REVERSE VOLTAGE (V)
100
PACKAGE OUTLINE DIMENSIONS
Unit (mm)
Min
2.00
0.53
25.40
3.00
25.40
Max
2.70
0.64
-
3.30
-
Unit (inch)
Min
0.079
0.021
1.000
0.118
1.000
Max
0.106
0.025
-
0.130
-
DIM.
A
B
C
D
E
MARKING DIAGRAM
P/N =
G=
YW =
F=
Specific Device Code
Green Compound
Date Code
Factory Code
Document Number: DS_D1505007
Version: G14
F1T1G thru F1T7G
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1505007
Version: G14
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