This device is intended to be configured as a load switch and
is particularly suited for compact computer peripheral
switching applications where 3V to 20V input and 0.6A output
current capability are needed. This device features a small
N-Channel MOSFET (Q1) together with a large P-Channel
Power MOSFET (Q2) in a single SC70-6 package.
Features
V
DROP
=0.2V @ V
IN
=12V, I
L
=0.36A. R
(ON)
= 0.55
Ω.
V
DROP
=0.2V @
V
IN
=5V, I
L
=0.27A. R
(ON)
= 0.75
Ω.
Very small package outline (SC70-6).
Control MOSFET (Q1) includes Zener protection for ESD
ruggedness
(>6KV Human Body Model)
.
High density cell design for extremely low on-resistance.
SC70-6
SOT-23
SuperSOT
TM
-6
SuperSOT
TM
-8
SO-8
SOT-223
V
IN
, R
1
4
.2
V
ON/OFF
4
Q2
3
V
OUT
, C
1
EQUIVALENT APPLICATION
5
Q1
2
V
OUT
, C
1
IN
V
+
DROP
-
OUT
pin
1
R
1
, C
1
6
See Application Circuit
1
R
2
ON/OFF
SC70-6
Absolute Maximum Ratings
Symbol
V
IN
V
ON/OFF
I
L
T
A
= 25°C unless otherwise noted
Parameter
Input Voltage Range
On/Off Voltage Range
Load Current
- Continuous
- Pulsed
(Note 1)
(Note 1 & 3)
(Note 2)
FDG6324L
3 - 20
2.5 - 8
0.6
1.8
0.3
-55 to 150
6
Units
V
V
A
P
D
T
J
,T
STG
ESD
Maximum Power Dissipation
Operating and Storage Temperature Range
Electrostatic Discharge Rating
Human Body Model (100pf/1500Ohm)
W
°C
kV
THERMAL CHARACTERISTICS
R
θJA
Thermal Resistance, Junction-to-Ambient
(Note 2)
415
°C/W
FDG6324L Rev.D
Electrical Characteristics
(T
Symbol
Parameter
OFF CHARACTERISTICS
I
FL
Forward Leakage Current
(Note 3)
A
= 25°C unless otherwise noted)
Conditions
Min
Typ
Max
Units
V
IN
= 20 V, V
ON/OFF
= 0 V
1
µA
ON CHARACTERISTICS
V
DROP
Conduction Voltage Drop
V
IN
= 12 V, V
ON/OFF
= 3.3 V, I
L
= 0.36 A
V
IN
= 5 V, V
ON/OFF
= 3.3 V, I
L
= 0.27 A
0.14
0.16
0.37
0.58
0.36
0.27
0.2
0.2
0.55
0.75
V
R
(ON)
Q
2
- Static On-Resistance
V
GS
= -12 V, I
D
= -0.6 A
V
GS
= -5 V, I
D
= -0.5 A
Ω
A
I
L
Load Current
V
DROP
= 0.2 V, V
IN
= 12 V, V
ON/OFF
= 3.3 V
V
DROP
= 0.2 V, V
IN
= 5 V, V
ON/OFF
= 3.3 V
Notes:
1. Range of V
in
can be up to 25V, but R
1
and R
2
must be scaled such that V
GS
of Q2 does not exceed -20V.
2. R
θ
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R
θ
JC
is
guaranteed by design while R
θ
CA
is determined by the user's board design. Thermal ratings based on minimum mounting pad.
