FMXMC2S
SERIES
Microprocessor Crystals
Surface Mount Ceramic Pkg.
Micro 3.2 x 2.5 / Ultra Thin
High Reliability
Tight Stability
Actual Size
CERAMIC SMD 3.2x2.5
SPECIFICATIONS
Issue 6 - 07252012
Parameter
Frequency Range
Operation Mode
Load Capacitance (CL)
Frequency Tolerance
Temperature Tolerance
Operating Temperature
Storage Temperature
Equivalent Series Resistance (ESR)
Shunt Capacitance (C0)
Drive Level
Aging @ 25°C
Insulation Resistance
Reflow Conditions
All specifications subject to change without notice.
Specification
12 - 50 MHz
See Operation Mode and ESR Table
18 pF Std, 8 - 60 pF and Series available
±30 ppm @ 25°C Std (See Cal. Tol. for Options)
±50 ppm Std (See Temp. Tol. for Options)
-10 to +60°C Std (See Temp. Range for Options)
-40 to +85°C
See Operation Mode and ESR Table
5 pF max
10 µW typical, 200 µW max
±5 ppm per year max
500MΩ min at 100V
DC
±15V
+260ºC ±10ºC for 10 sec max 2 reflows max
3.2 x 2.5 CERAMIC SMD
PIN FUNCTION TABLE
Pin
1
2
3
4
Function
Crystal
Ground
Crystal
Ground
OPERATION MODE AND ESR TABLE
Frequency (MHz)
12
16
20
24
-
-
-
-
15.99
19.99
23.99
50.00
Mode
Fundamental
Fundamental
Fundamental
Fundamental
Max. ESR (Ohms)
100
80
60
40
STANDARD MARKING
FMI XX.XXX
XX.XXX FREQUENCY in MHz
NOTE: Standard Specifications for product indicated in
color
Dimensions: millimeters
PART DESCRIPTION SYSTEM
MARKING: See Page 52, Format A
FMXM C2S 1 18 H J A - XX.XXXXXXM - CM
Product Family
MicroP Crystal
Package
Ceramic SMD
2.5 x 3.2mm
Mode
1 - Fundamental
Load Cap. (CL)
18 - Standard (pF)
00 - Series
XX - Custom (pF)
Cal. Tol. @ 25°C
D
F
H
J
K
X
±10 ppm
±20 ppm
±30 ppm
±50 ppm
±100 ppm
Custom
Temp. Tol.
D ±10 ppm
F ±20 ppm
H ±30 ppm
J ±50 ppm
K ±100 ppm
X Custom
Frequency (MHz)
Temp. Range
A 0 to 70 °C
B -20 to 70 °C
C *-40 to 85 °C
D -10 to 50 °C
E -10 to 60 °C
F *-30 to 60 °C
J 0 to 50 °C
X Custom
Options
TR - Tape & Reel
PD - Parameter Data
TD - Temp. Data
TG - Temp. Grading
CM - Custom Mark
BLANK - None Req’d.
1-800-800-XTAL
[9825]
www.fmi-inc.com
16
FPGA/CPLD