FMXMC3S2
SERIES
Microprocessor Crystals
Surface Mount Ceramic Pkg.
Micro 5 x 3.2, 2-Pad / Ultra Thin
High Reliability
Tight Stability
Actual Size
CERAMIC SMD 5x3.2
SPECIFICATIONS
Issue 3 - 08212015
Parameter
Frequency Range
Operation Mode
Load Capacitance (CL)
Frequency Tolerance
Temperature Tolerance
Operating Temperature
Storage Temperature
Equivalent Series Resistance (ESR)
Shunt Capacitance (C0)
Drive Level
Aging @ 25°C
Insulation Resistance
Reflow Conditions
All specifications subject to change without notice.
Specification
8.00 - 150.00 MHz
See Operation Mode and ESR Table
18 pF Std., 6 - 60 pF and Series available
±30 ppm @ 25°C Std. (See Cal. Tol. for Options)
±50 ppm Std. (See Temp. Tol. for Options)
0 to +70°C Std. (See Temp. Range for Options)
-40 to +85°C / -55 to +125°C
See Operation Mode and ESR Table
7 pF max.
10 µW typical, 300 µW max
±5 ppm per year max.
500MΩ min. at 100V
DC
±15V
260°C ±10°C for 10sec max., 2 reflows max.
5 x 3.2 CERAMIC SMD
OPERATION MODE AND ESR TABLE
Frequency (MHz)
8.00 - 10.00
10.01 - 12.00
12.01 - 20.00
20.01 - 50.00
40.00 - 150.00
Mode
Fundamental
Fundamental
Fundamental
Fundamental
3rd Overtone
Max. ESR (Ohms)
100
80
60
40
80
STANDARD MARKING
XXX.XXXM
FMI YYWW
XXX.XXXM FREQUENCY in MHz
FMI, Date Code
Recommended Solder Pad Layout
NOTE: Standard Specifications for product indicated in
color
Dimensions: millimeters
PART DESCRIPTION SYSTEM
FMXM C3S2 1 18 H J A
-
XX.XXXXXXM
-
CM
Product Family
MicroP Crystal
Package
Ceramic SMD
3.2x5 mm, 2 Pad
Mode
1 - Fundamental
3 - 3rd Overtone
Load Cap. (CL)
18 - Standard (pF)
00 - Series
XX - Custom (pF)
Cal. Tol. @ 25°C
D ±10 ppm
E ±15 ppm
F ±20 ppm
H ±30 ppm
J ±50 ppm
K ±100 ppm
X Custom
Temp. Tol.
D ±10 ppm
E ±15 ppm
F ±20 ppm
H ±30 ppm
J ±50 ppm
K ±100 ppm
X Custom
Frequency (MHz)
Temp. Range
A 0 to 70 °C
B -20 to 70 °C
C -40 to 85 °C
D -10 to 50 °C
E -10 to 60 °C
F -30 to 60 °C
J 0 to 50 °C
X Custom
Options
TR - Tape & Reel
PD - Parameter Data
TD - Temp. Data
CM- Custom Mark
BLANK - None Req’d.
1-800-800-XTAL
[9825]
www.fmi-inc.com
16
嵌入式系统