FQB3P20 / FQI3P20
April 2000
QFET
FQB3P20 / FQI3P20
200V P-Channel MOSFET
General Description
These P-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switching DC/DC converters.
TM
Features
•
•
•
•
•
•
-2.8A, -200V, R
DS(on)
= 2.7Ω @V
GS
= -10 V
Low gate charge ( typical 6.0 nC)
Low Crss ( typical 7.5 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
D
S
!
G
!
G
S
D
2
-PAK
FQB Series
G D S
I
2
-PAK
FQI Series
!
D
Absolute Maximum Ratings
Symbol
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt
P
D
T
C
= 25°C unless otherwise noted
Parameter
Drain-Source Voltage
- Continuous (T
C
= 25°C)
Drain Current
- Continuous (T
C
= 100°C)
Drain Current
- Pulsed
(Note 1)
FQB3P20 / FQI3P20
-200
-2.8
-1.77
-11.2
±30
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
W
W/°C
°C
°C
Gate-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T
A
= 25°C) *
150
-2.8
5.2
-5.5
3.13
52
0.42
-55 to +150
300
T
J
, T
STG
T
L
Power Dissipation (T
C
= 25°C)
- Derate above 25°C
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8 from case for 5 seconds
Thermal Characteristics
Symbol
R
θJC
R
θJA
R
θJA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient *
Thermal Resistance, Junction-to-Ambient
Typ
--
--
--
Max
2.4
40
62.5
Units
°CW
°CW
°CW
* When mounted on the minimum pad size recommended (PCB Mount)
©2000 Fairchild Semiconductor International
Rev. A, April 2000
FQB3P20 / FQI3P20
Electrical Characteristics
T
Symbol
Parameter
C
= 25°C unless otherwise noted
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV
DSS
∆BV
DSS
/
∆T
J
I
DSS
I
GSSF
I
GSSR
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
V
GS
= 0 V, I
D
= -250
µA
I
D
= -250
µA,
Referenced to 25°C
V
DS
= -200 V, V
GS
= 0 V
V
DS
= -160 V, T
C
= 125°C
V
GS
= -30 V, V
DS
= 0 V
V
GS
= 30 V, V
DS
= 0 V
-200
--
--
--
--
--
--
-0.18
--
--
--
--
--
--
-1
-10
-100
100
V
V/°C
µA
µA
nA
nA
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Gate Threshold Voltage
Static Drain-Source
On-Resistance
Forward Transconductance
V
DS
= V
GS
, I
D
= -250
µA
V
GS
= -10 V, I
D
= -1.4 A
V
DS
= -40 V, I
D
= -1.4 A
(Note 4)
-3.0
--
--
--
2.06
1.23
-5.0
2.7
--
V
Ω
S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V
DS
= -25 V, V
GS
= 0 V,
f = 1.0 MHz
--
--
--
190
45
7.5
250
60
10
pF
pF
pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DD
= -100 V, I
D
= -2.8 A,
R
G
= 25
Ω
(Note 4, 5)
--
--
--
--
--
--
--
8.5
35
12
25
6.0
1.7
2.9
25
80
35
60
8.0
--
--
ns
ns
ns
ns
nC
nC
nC
V
DS
= -160 V, I
D
= -2.8 A,
V
GS
= -10 V
(Note 4, 5)
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Maximum Continuous Drain-Source Diode Forward Current
Maximum Pulsed Drain-Source Diode Forward Current
V
GS
= 0 V, I
S
= -2.8 A
Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
V
GS
= 0 V, I
S
= -2.8 A,
dI
F
/ dt = 100 A/µs
(Note 4)
--
--
--
--
--
--
--
--
100
0.34
-2.8
-11.2
-5.0
--
--
A
A
V
ns
µC
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 29mH, I
AS
= -2.8A, V
DD
= -50V, R
G
= 25
Ω,
Starting T
J
= 25°C
3. I
SD
-2.8A, di/dt
300A/µs, V
DD
BV
DSS,
Starting T
J
= 25°C
4. Pulse Test : Pulse width
300µs, Duty cycle
2%
5. Essentially independent of operating temperature
©2000 Fairchild Semiconductor International
Rev. A, April 2000
FQB3P20 / FQI3P20
Typical Characteristics
10
1
-I
D
, Drain Current [A]
10
0
-I
D
, Drain Current [A]
V
GS
-15.0 V
-10.0 V
-8.0 V
-7.0 V
-6.5 V
-6.0 V
Bottom : -5.5 V
Top :
10
1
10
0
150
25
-55
Notes :
1. V
DS
= -40V
2. 250 Pulse Test
s
10
-1
Notes :
1. 250 Pulse Test
s
2. T
C
= 25
10
-1
10
0
10
1
10
-1
2
4
6
8
10
-V
DS
, Drain-Source Voltage [V]
-V
GS
, Gate-Source Voltage [V]
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
10
10
1
V
GS
= - 10V
6
V
GS
= - 20V
4
-I
DR
, Reverse Drain Current [A]
R
DS(on)
[
Ω
],
Drain-Source On-Resistance
8
10
0
150
25
2
Note : T
J
= 25
Notes :
1. V
GS
= 0V
2. 250 Pulse Test
s
-1
0
0
2
4
6
8
10
-I
D
, Drain Current [A]
0.4
0.8
1.2
1.6
2.0
2.4
2.8
-V
SD
, Source-Drain Voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
400
C
iss
= C
gs
+ C
gd
(C
ds
= shorted)
C
oss
= C
ds
+ C
gd
C
rss
= C
gd
12
10
V
DS
= -40V
V
DS
= -100V
-V
GS
, Gate-Source Voltage [V]
300
C
iss
C
oss
8
V
DS
= -160V
Capacitance [pF]
6
200
Notes :
1. V
GS
= 0 V
2. f = 1 MHz
4
C
rss
100
2
Note : I
D
= -2.8 A
0
-1
10
0
10
0
10
1
0
1
2
3
4
5
6
7
-V
DS
, Drain-Source Voltage [V]
Q
G
, Total Gate Charge [nC]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
©2000 Fairchild Semiconductor International
Rev. A, April 2000
FQB3P20 / FQI3P20
Typical Characteristics
(Continued)
1.2
2.5
-BV
DSS
, (Norm
alized)
Drain-Source Breakdown Voltage
2.0
R
DS(ON)
, (Normalized)
Drain-Source On-Resistance
1.1
1.5
1.0
1.0
0.9
Notes :
1. V
GS
= 0 V
2. I
D
= -250
A
0.5
Notes :
1. V
GS
= -10 V
2. I
D
= -1.4 A
0.8
-100
-50
0
50
100
o
150
200
0.0
-100
-50
0
50
100
o
150
200
T
J
, Junction Temperature [ C]
T
J
, Junction Temperature [ C]
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
10
2
3.0
Operation in This Area
is Limited by R
DS(on)
2.5
10
1
-I
D
, Drain Current [A]
10 ms
10
0
DC
-I
D
, Drain Current [A]
1 ms
100
µ
s
2.0
1.5
1.0
10
-1
Notes :
1. T
C
= 25 C
2. T
J
= 150 C
3. Single Pulse
o
o
0.5
10
-2
10
0
10
1
10
2
0.0
25
50
75
100
125
150
-V
DS
, Drain-Source Voltage [V]
T
C
, Case Temperature [
]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
( t) , T h e r m a l R e s p o n s e
10
0
D = 0 .5
0 .2
0 .1
0 .0 5
N o te s :
1 . Z
J C
( t) = 2 .4
/W M a x .
2 . D u ty F a c to r , D = t
1
/t
2
3 . T
J M
- T
C
= P
D M
* Z
J C
( t)
10
-1
JC
0 .0 2
0 .0 1
s i n g le p u ls e
P
DM
t
1
t
2
Z
10
-2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t
1
, S q u a r e W a v e P u ls e D u r a t io n [ s e c ]
Figure 11. Transient Thermal Response Curve
©2000 Fairchild Semiconductor International
Rev. A, April 2000
FQB3P20 / FQI3P20
Gate Charge Test Circuit & Waveform
50K
12V
200nF
300nF
Same Type
as DUT
V
DS
V
GS
Q
g
-10V
Q
gs
Q
gd
V
GS
DUT
-3mA
Charge
Resistive Switching Test Circuit & Waveforms
V
DS
V
GS
R
G
R
L
V
DD
t
d(on)
t
on
t
r
t
d(off)
t
off
t
f
V
GS
10%
-10V
DUT
V
DS
90%
Unclamped Inductive Switching Test Circuit & Waveforms
L
V
DS
I
D
R
G
V
DD
V
DD
DUT
t
p
BV
DSS
1
---- L I
AS2
--------------------
E
AS
=
2
BV
DSS
- V
DD
t
p
Time
V
DS
(t)
I
D
(t)
I
AS
BV
DSS
-10V
©2000 Fairchild Semiconductor International
Rev. A, April 2000
stm32/stm8
