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FST8140

RECTIFIER DIODE

器件类别:分立半导体    二极管   

厂商名称:Microsemi

厂商官网:https://www.microsemi.com

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器件参数
参数名称
属性值
厂商名称
Microsemi
包装说明
R-PSFM-T3
针数
3
Reach Compliance Code
unknow
ECCN代码
EAR99
应用
GENERAL PURPOSE
外壳连接
CATHODE
配置
COMMON CATHODE, 2 ELEMENTS
二极管元件材料
SILICON
二极管类型
RECTIFIER DIODE
最大正向电压 (VF)
0.53 V
JESD-30 代码
R-PSFM-T3
最大非重复峰值正向电流
800 A
元件数量
2
相数
1
端子数量
3
最高工作温度
150 °C
最低工作温度
-55 °C
最大输出电流
40 A
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
认证状态
Not Qualified
最大重复峰值反向电压
40 V
表面贴装
NO
技术
SCHOTTKY
端子形式
THROUGH-HOLE
端子位置
SINGLE
文档预览
FST8130 - FST8145
F
A
N 2-PLCS
P
E
L
1
2
3
A=Common Anode
G
K
C
J
H
Note: Baseplate Common with Pin 2
Microsemi
Catalog Number
FST8130*
FST8135*
FST8140*
FST8145*
Industry
Part Number
80CNQ035, A
84CNQ035
80CNQ040, A
84CNQ040
80CNQ045, A
84CNQ045
Working
Peak Reverse
Voltage
30V
35V
40V
45V
Repetitive
Peak Reverse
Voltage
30V
35V
40V
45V
Schottky Barrier Rectifier
Guard Ring Protection
Common Cathode Center Tap
2X40 Amperes avg.
150°C Junction Temperature
Reverse Energy Tested
Low Forward Voltage
ROHS Compliant
1
2
3
D=Doubler
1
2
3
Common Cathode
Dim. Inches
A
C
E
F
G
H
J
K
L
M
N
P
1.180
.027
.350
1.490
.695
.088
.240
.115
.460
.065
.151
.015
1.195
.037
.370
1.510
.715
.098
.260
.135
.480
.085
.161
.025
Millimeter
29.97
0.69
8.89
37.85
17.65
2.24
6.10
2.92
11.68
1.65
3.84
0.38
30.35
0.94
9.40
38.35
18.16
2.49
6.60
3.43
12.19
2.16
4.09
0.64
Minimum Maximum Minimum Maximum Notes
1
2
3
Schottky MiniMod
M
3 PINS eq sp at .200
Dia.
*Add the Suffix A for Common Anode, D for Doubler
Electrical Characteristics
I F(AV) 80 Amps
Average forward current per pkg
I F(AV) 40 Amps
Average forward current per leg
I FSM 800 Amps
Maximum surge current per leg
Max repetitive peak reverse current per leg I R(OV) 2 Amps
VFM 0.47 Volts
Max peak forward voltage per leg
VFM 0.53 Volts
Max peak forward voltage per leg
I RM 500 mA
Max peak reverse current per leg
I RM 3.0 mA
Max peak reverse current per leg
CJ 2100 pF
Typical junction capacitance per leg
TC = 110°C, Square wave, R0JC = 0.5°C/W
T C = 110°C, Square wave, R0JC = 1.0°C/W
8.3 ms, half sine, T J = 150°C
f = 1 KHZ, 25°C, 1µsec square wave
I FM = 40A: T J = 150°C*
I FM = 40A: T J = 25°C*
VRRM, T J = 125°C*
VRRM, T J = 25°C
VR = 5.0V, T C = 25°C
*Pulse test: Pulse width 300µsec, Duty cycle 2%
Thermal and Mechanical Characteristics
Storage temp range
Operating junction temp range
Max thermal resistance per leg
Max thermal resistance per pkg
Typical thermal resistance (greased)
Mounting Base Torque
Weight
T STG
TJ
R 0JC
R 0JC
R 0CS
-55°C to 175°C
-55°C to 150°C
1.0°C/W
Junction to case
0.5°C/W
Junction to case
0.3°C/W
Case to sink
10 inch pounds maximum
0.3 ounce (8.4 grams) typical
www.microsemi.com
October, 2012 - Rev. 5
FST8130 - FST8145
Figure 1
Typical Forward Characteristics - Per Leg
1000
800
600
Junction Capacitance - pF
400
Figure 3
Typical Junction Capacitance - Per Leg
10000
6000
4000
2000
1000
600
400
200
100
0.1
200
100
80
60
40
Instantaneous Forward Current - Amperes
0.5
1.0
5.0
10
50
100
Reverse Voltage - Volts
Figure 4
Forward Current Derating - Per Leg
150
140
130
120
110
100
90
80
0
0.5
10
15
60
20
90
25
30
120
35
180
40
45
DC
50
20
150 C
25 C
10
8.0
6.0
4.0
2.0
1.0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Instantaneous Forward Voltage - Volts
Maximum Allowable Case Temperature - C
Maximum Power Dissipation - Watts
Average Forward Current - Amperes
Figure 5
Maximum Forward Power Dissipation - Per Leg
35
30
25
20
15
10
5.0
0
0
5.0
10
15
20
25
30
35
40
45
50
Average Forward Current - Amperes
60
90
180
120
DC
Figure 2
Typical Reverse Characteristics - Per Leg
1000
Typical Reverse Current - mA
150 C
100
10
1.0
0.1
.01
0
10
20
30
40
50
Reverse Voltage - Volts
25 C
125 C
75 C
www.microsemi.com
October, 2012 - Rev. 5
DISCLAIMER
The information contained in the document (unless it is publicly available on the Web without access restrictions) is
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the
recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement
will also apply. This document and the information contained herein may not be modified, by any person other than
authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,
inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by
Microsemi in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with life-
support or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
user must conduct and complete all performance and other testing of this product as well as any user or customers final
application. User or customer shall not rely on any data and performance specifications or parameters provided by
Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi
product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all
faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims
any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product
is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.
www.microsemi.com
October, 2012
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