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FTX710-AM2 S R1ZQ

Ethernet ICs DEVICE CON

器件类别:热门应用    无线/射频/通信   

厂商名称:Intel(英特尔)

厂商官网:http://www.intel.com/

器件标准:

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器件参数
参数名称
属性值
Product Attribute
Attribute Value
制造商
Manufacturer
Intel(英特尔)
产品种类
Product Category
Ethernet ICs
RoHS
Details
产品
Product
Ethernet Controllers
接口类型
Interface Type
SFI, SGMII, PCIe
工作电源电压
Operating Supply Voltage
3.3 V
最小工作温度
Minimum Operating Temperature
- 10 C
最大工作温度
Maximum Operating Temperature
+ 55 C
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
FCBGA-576
系列
Packaging
Tray
工厂包装数量
Factory Pack Quantity
1
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Intel
®
Ethernet Controller X710/
XXV710/XL710 Datasheet
Ethernet Networking Division (ND)
Order No.: 332464-014
Revision: 3.5
February 2018
Legal Lines and Disclaimers
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a
particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in
trade.
This document contains information on products, services and/or processes in development. All information provided here is subject
to change without notice. Contact your Intel representative to obtain the latest forecast, schedule, specifications and roadmaps.
The products and services described may contain defects or errors which may cause deviations from published specifications.
Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-4725
or by visiting
www.intel.com/design/literature.htm.
Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
© 2018 Intel Corporation.
2
Front Matter — Ethernet Controller X710/XXV710/XL710
Revision History
Revision
3.5
3.4
3.3
3.2
3.1
Date
February 2018
January 2018
September 2017
September 2017
June 2017
Removed references to 802.1BR.
Notes
Changing branding string from 710 Series to X710/XXV710/XL710.
Updated Table 14-5 (Proposed Flash Device; Winbond Flash device part number).
Initial Release (Intel Public).
Sections revised:
13.5.2 (VCCD connectivity).
Tables revised:
2-14 (Integrated SVR pins).
2-16 (Pull-up and pull-down resistors).
B-16 (Integrated SVR pins).
Sections revised:
• 2.2.3 (NC-SI interface pins).
• 2.2.11 (Power supply pins).
• 13.2.2 (Recommended Operating Conditions).
Table revised:
• B-20 (0.86V External AVDD power supply specification).
Sections revised:
• 2.2.11 (Power supply pins).
• 13.2.1 (Absolute Maximum Ratings).
• 13.2.2 (Recommended Operating Conditions).
• 13.5.2 (VCCD connectivity).
• B.3.6 (Mechanical package).
• B.10 (Power Supplies).
• B.10.1 (Power Supply Sequencing; updated figure).
• B.10.2 (Power Supply Filtering).
Figure removed:
• Figure B.2 (AVDD power noise mask).
Table revised:
• 13-4 (External VCCD Power Supply Specification).
• B-20 (0.86V External AVDD power supply specification).
• B-20 (1.00V External AVDD power supply specification).
• B-28 (Minimum Number of Bypass Capacitors Per Power Rail).
Removed Section 6.3.16. Duplication of Section 6.3.15.
Added Intel
®
Ethernet Controller XXV710-specific information.
Added 25 Gb/s functionality.
3.0
April 2017
2.9
March 2017
2.8
2.7
2.6
January 2017
December 2016
December 2016
3
Ethernet Controller X710/XXV710/XL710 — Front Matter
Revision
2.5
Date
March 2016
Notes
• Reflects the latest X710/XXV710/XL710 firmware release (FVL5).
• Removed all references to FCoE. X710/XXV710/XL710 does not support FCoE.
• Removed all references to Storm Control.
• Added GLPRT_ERRBC and GLPRT_MSPDC register information.
Sections added:
• 14.12.3 (POR without power cycle for NVM update).
Sections revised:
• 5.2.2 (PCIe link power management; removed ASPM statements).
• 7.7.1.2.2 (Normal Partitioning of Rx Packet Buffer; setting a null low watermark is not
allowed).
• 7.11.3 (Statistics Consistency Rules; added debug register description).
• 8.4.3.1.2 (Transmit Queue Disable Flow; updated cross reference).
• 10.2.2.2.44 (PCIe PM Support - GLPCI_PMSUP (0x000BE4B0; RO); changed bit
settings to reserved).
• 10.2.2.16.32 (Port Unicast Packets Received Count High; updated description for bits
15:0).
• 11.3.5.7 (Link Capabilities Register (0xAC; RO); updated description for bits 11:10).
• 15.10 (Common application schematic; changed pin Y19 to Y17).
Table revised:
13-16 (t
CSS
value).
13-22 (Duty cycle value).
Sections revised:
• 6.3.12.5 and 6.3.12.6 (added Combo Image Version offset information).
• 6.3.16.12.3 (changed Length default value to 0x10).
• 14.5 (SVR Board Connectivity Guidelines).
• 14.6.5.2 (Clock Generator Specification description and note).
Table revised:
• 16-1 (TDP specification).
Fourth Release (Intel Public).
Third Release (Intel Public).
Second Release (Intel Public).
Initial Release (Intel Public).
2.4
October 2015
2.3
2.2
2.1
2.0
July 2015
May 2015
December 2014
July 2014
4
Introduction — Ethernet Controller X710/XXV710/XL710
1.0
Introduction
This document describes the external architecture (including device operation, pin descriptions, register
definitions, etc.) for the Intel
®
Ethernet Controller X710/XXV710/XL710 (X710/XXV710/XL710), a
dual-port 40 Gigabit Ethernet (GbE), dual-port 25 GbE
1
, or quad-port 10 GbE Network Interface
Controller. It reflects the silicon device capability while the
Intel
®
Ethernet Controller X710/XXV710/
XL710 Feature Support Matrix
reflects the features and interfaces actually supported in the NVM and
software (http://www.intel.com/content/www/us/en/embedded/products/networking/xl710-ethernet-
controller-feature-matrix.html).
This document is intended as a reference for architects, logic designers, firmware and software device
driver developers, board designers, test engineers, or anyone else who might need specific technical or
programming information about the X710/XXV710/XL710.
The X710/XXV710/XL710 combines standard Ethernet stateless Network Interface Card (NIC) and
Internet Small Computer System Interface (iSCSI) block storage acceleration functionality into a single
silicon device. It is designed to address the target markets listed in
Table 1-1.
Note:
The X710/XXV710/XL710 does NOT support Fibre Channel over Ethernet (FCoE).
Table 1-1.
X710/XXV710/XL710 target markets
Description
Cloud networking — In the emerging cloud networking market, where computing infrastructure and software are
sold as services, and where the large data centers of Internet portal companies such as Google*, Microsoft* and
Amazon* drive unique requirements, the X710/XXV710/XL710 has these strengths: networking performance,
energy efficiency, automation (including resource provisioning and monitoring, and workload balancing),
sophisticated packet header parsing, and quality open source drivers.
As shown in
Figure 1-1,
the X710/XXV710/XL710 is targeted for use in rack mounted or pedestal
servers, where it can be deployed as an add-in NIC or LAN on Motherboard (LOM). Some types of
Ethernet cables, such as SFP+ direct attach, can be driven directly by the X710/XXV710/XL710, while
other types, such as 10GBASE-T, require the external Physical Layer (PHY) component(s) shown. The
X710/XXV710/XL710 can connect up to four Ethernet ports or it can be configured to connect two 40
GbE ports. The X710/XXV710/XL710 is also targeted for use in blade servers, where it can be deployed
as a mezzanine card or LOM. The X710/XXV710/XL710 supports direct connection to backplanes that
support the following signaling standards: 40GBASE-KR4 (up to two ports) or 1000BASE-KX (up to four
ports supported).
Blade backplanes typically connect Ethernet controllers in a dual-redundant star to two separate
Ethernet switches. In this configuration, the X710/XXV710/XL710 can be connected with up to 2 x 10
GbE ports per switch or 1 x 40 GbE port per switch.
1.
Pinout and mechanical specifications for the Intel
®
Ethernet Controller XXV710 (XXV710) are described in
Appendix B.
5
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参数对比
与FTX710-AM2 S R1ZQ相近的元器件有:FTXL710-BM2-S-LLK7、FTXL710-BM1-S-LLK9、FTXL710-AM1-Q-GEK、FTXL710-BM2 S LLK8、FTX710-AM2 S R1ZP、FTXL710-AM2 S R1ZL、FTX710-BM2 S LLKC、FTXL710-AM2-Q-GEJ。描述及对比如下:
型号 FTX710-AM2 S R1ZQ FTXL710-BM2-S-LLK7 FTXL710-BM1-S-LLK9 FTXL710-AM1-Q-GEK FTXL710-BM2 S LLK8 FTX710-AM2 S R1ZP FTXL710-AM2 S R1ZL FTX710-BM2 S LLKC FTXL710-AM2-Q-GEJ
描述 Ethernet ICs DEVICE CON Ethernet ICs DEVICE CON Ethernet ICs DEVICE CON Ethernet ICs Ethernet ICs DEVICE CON Ethernet ICs DEVICE CON Ethernet ICs DEVICE CON Ethernet ICs DEVICE CON Ethernet ICs
Product Attribute Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value
制造商
Manufacturer
Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔)
产品种类
Product Category
Ethernet ICs Ethernet ICs Ethernet ICs Ethernet ICs Ethernet ICs Ethernet ICs Ethernet ICs Ethernet ICs Ethernet ICs
RoHS Details Details Details - Details Details - Details -
产品
Product
Ethernet Controllers Ethernet Controllers Ethernet Controllers - Ethernet Controllers Ethernet Controllers - Ethernet Controllers -
接口类型
Interface Type
SFI, SGMII, PCIe SFI, SGMII, PCIe SFI, SGMII, PCIe - SFI, SGMII, PCIe SFI, SGMII, PCIe - SFI, SGMII, PCIe -
工作电源电压
Operating Supply Voltage
3.3 V 3.3 V 3.3 V - 3.3 V 3.3 V - 3.3 V -
最小工作温度
Minimum Operating Temperature
- 10 C - 10 C - 10 C - - 10 C - 10 C - - 10 C -
最大工作温度
Maximum Operating Temperature
+ 55 C + 50 C + 55 C - + 50 C + 55 C - + 55 C -
安装风格
Mounting Style
SMD/SMT SMD/SMT SMD/SMT - SMD/SMT SMD/SMT - SMD/SMT -
封装 / 箱体
Package / Case
FCBGA-576 FCBGA-576 FCBGA-576 - FCBGA-576 FCBGA-576 - FCBGA-576 -
系列
Packaging
Tray Tray Tray - Reel Reel - Reel -
工厂包装数量
Factory Pack Quantity
1 1 1 - 480 480 - 480 -
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