F-219
FW–20–05–F–D–610–065
FW–12–05–G–D–530–101
(1.27 mm) .050"
FW-SM SERIES
SMT MICRO BOARD STACKER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?FW-SM
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over 50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
RoHS Compliant:
Yes
Board Mates:
CLP, FLE
Cable Mates:
FFSD
Low-profile or
skyscraper styles
APPLICATIONS
Variable
board spacing
MATED
HEIGHT
FW
CLP
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-30)
(0.15 mm) .006" max (31-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
MATED
CLP HEIGHT*
(8.13)
FW-XX-03-X-X-233-065
.320
–02
(9.91)
FW-XX-03-X-X-303-065
.390
*Processing conditions will affect mated height.
LEAD STYLE
FW
(1.27 mm x 1.27 mm)
.050" x .050" micro pitch
Surface
mount
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
FW
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
D
STACKER
HEIGHT
POST
HEIGHT
OPTION
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Smaller stack heights
02 thru 50
= Gold flash on post,
Matte Tin on tail
–F
–L
–“XXX”
= Stacker
Height
(in inches)
= Post Height
(in inches)
(1.65 mm)
.065"
minimum
Example:
–065
= (1.65 mm)
.065"
–“XXX”
LEAD STACKER
STYLE HEIGHT
–03
–05
STACKER
HEIGHT
(5.46) (8.51) (7.11) (10.16)
.215 to .335
.280 to .400
(8.64) (15.49) (10.29) (17.15)
.340 to .610
.405 to .675
= 10 µ" (0.25 µm)
Gold on post,
Matte Tin on tail
Example:
–250
= (6.35 mm)
.250"
= End Shroud
(–075 post height only.
Mate only with CLP)
(5.46 mm) .215" to
(15.49 mm) .610"
stacker height only
9 pins/row min.
= End Shroud
with Guide Post
(–075 post height only.
Mate only with CLP.)
(5.46 mm) .215"
to (15.49 mm) .610"
stacker height only)
9 pins/row min.
= Alignment Pin
(3 positions min.)
(5.46 mm) .215" to
(15.75 mm) .620"
stacker height only
= Pick & Place Pad
(5 positions min.)
= Tape & Reel
(Max overall height =
Post+Stacker Height+
Pad+Alignment Pin =
.700 (17.78))
–ES
02
No. of positions x
(1.27) .050
= 10 µ" (0.25 µm)
Gold on post,
Gold flash on tail
100
–G
–EP
(3.42)
.135
(1.27)
.050
01
(1.19)
.047
(1.27) .050
(0.41) .016 SQ
99
(4.76)
.188
POST HEIGHT
(1.65) .065
MIN
(4.27)
.168
(0.76)
.030
(3.45)
.136
x
(5.08)
.200
(4.06)
.160
–A
–ES
(3.05)
.120
(1.91)
.075
DIA
–P
(0.86)
.034
Notes:
For added mechanical stability,
Samtec recommends
mechanical board spacers be
used in applications with gold or
selective gold plated connectors.
Contact ipg@samtec.com for
more information.
This Series is non-standard,
non-returnable.
–P
STACKER
HEIGHT
(2.51)
.099
(2.92)
.115
–TR
–EP
Due to technical progress, all designs, specifications and components are subject to change without notice.
(0.89)
.035
DIA
–A
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
GD32 MCU
