-
A
B
C
D
E
Initial Release
Revised numbering scheme, separated electrical and
mechanical, editorial changes throughout
Corrected typographical errors in PIN table, added
flag note 1.
Added 1712/25V, 0805/50V, 0805/100V, deleted
errant para. 4.6.6, clarified paragraph 1.2.1 testing
Added Table I values, added low inductance reverse
geometry styles, reduced 25V dielectric thickness,
editorial changes throughout
RN A177. Revised Table I, added new termination,
increased voltages, editorial corrections, removed
paragraph 6.4 restriction.
07/08/2008
07/14/2009
JS
JS
JS
JS
08/06/2009
01/13/2010
08/02/2010
JS
07/10/2012
JS
1.
SCOPE
1.1
Purpose. This specification defines the general requirements for high reliability, ceramic
dielectric, multilayer, fixed value chip capacitors for space, missile and other high reliability
applications. It defines the test and qualification parameters for extended range capacitors
required by the very low power, low voltage assemblies used for flight.
1.2
Part or Identifying Number (PIN). The complete PIN for the Multilayer Chip Capacitors
supplied to this specification shall be specified as follows. Allowable combinations of voltage,
capacitance, dielectric type, and package size shall be described in Table I herein.
GSFC
Identifier
Ultrasonic
Examination
(replaces dash
character)
A = 100%
Size Code
Dielectric
Type
Capacitance
Tolerance 1/
Voltage
(Vdc)
Termination
Packaging/Marking
G311P829
A = 0402
N = NPO
B = Sample
B = 0403
C = 0504
X = X7R
D = 0603
E = 0805
F = 1206
G = 1209
H = 1725
J = 2225
K = 1712
L = 0502
M = 0306
N = 0508
P = 0612
Q = 0912
R = 1812
XXX
B = +/- 0.10pF
Capacitance in
picofarads
where third
C = +/- 0.25pF
digit is
number of
D = +/- 0.50pF
zeros
e.g. 103 equals
10000pF
F = +/- 1%
G =+/- 2%
J = +/- 5%
K =+/- 10%
L = +20% /
-10%
1 = 25V
P = PdAg
2 = 50V
3 = 100V
N = Sn/Pb
Solder
G= Au
1 = 7” T/R,
unmarked
capacitors
2 = 7” T/R, marked
capacitors
3 = Waffle Pack,
unmarked
capacitors
4 = Waffle Pack,
marked capacitors
4 = 5V
5 = 10V
6 = 16V
7 = 6.3V
1/ Tolerances B, C, D, F, G, and J are valid for NPO dielectric only. Tolerances B, C, and D are
valid for capacitance values < 10pF only.
S-311-P-829
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REV E
1.2.1 Ultrasonic examination. Devices supplied to this specification shall be subjected to
ultrasonic examination in accordance with the manufacturer’s standard procedures and
MIL-PRF-123, except as modified herein. 100% inspection complies with the MIL-PRF-123
sample requirements. Ultrasonic examination may be performed prior to capacitor termination
(in accordance with MIL-PRF-123 requirements) or after capacitor termination, at the
manufacturer’s option.
1.2.2 Dielectric Type. The voltage temperature characteristic shall be referenced to the +25°C
value, and shall be applicable over the entire temperature range of -55°C to +125°C. Dielectric
type NPO (“N”) shall be 0 ±30 ppm/°C, and dielectric type X7R (“X”) shall be +15, -15 percent.
1.2.3 Termination. Devices supplied to this specification shall have a termination coating of
palladium silver alloy (MIL-PRF-123, type M), or base metal barrier tin-lead solder
(MIL-PRF-123, type Z) plated, or base metal barrier gold (MIL-PRF-123, type G) plated. Tin
lead solder plating shall contain a minimum of 4% lead, by mass. Note that the palladium silver
alloy termination coating is not recommended for applications using eutectic solder attach
methods; PdAg termination coating is appropriate for conductive epoxy mounting techniques
only.
1.2.4 Package/Marking. Capacitors supplied to this specification may be supplied as unmarked
or marked, as designed by the marking identifier code in the GSFC PIN. Capacitors shall be
unmarked, and packaged on 7” tape and reel (identifier code 1), or in waffle packs (identifier
code 3). Capacitors shall be marked per the manufacturer’s standard marking procedure and
nomenclature (or MIL-PRF-123 nomenclature), and packaged on 7” tape and reel (identifier
code 2), or in waffle packs (identifier code 4).
S-311-P-829
Page 3 of 14
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Table I. Allowable Capacitance/Voltage Combinations
NPO Dielectric
Maximum Working
Minimum
Maximum
Voltage (Vdc)
Dielectric
Capacitance
Thickness 2/
10 V
NA
NA
16 V
NA
NA
25 V
120 pF
0.6 mils
50 V
100 pF
0.8 mils
100 V
39 pF
1.0 mils
16 V
NA
NA
25 V
390 pF
0.6 mils
50 V
330 pF
0.8 mils
100 V
68 pF
1.0 mils
6.3 V
NA
NA
16 V
NA
NA
25 V
1500 pF
0.6 mils
50 V
1200 pF
0.8 mils
100 V
180 pF
1.0 mils
5V
NA
NA
16V
NA
NA
25V
NA
NA
16 V
NA
NA
25 V
680 pF
0.6 mils
50 V
560 pF
0.8 mils
100 V
100 pF
1.0 mils
10V
NA
NA
16V
NA
NA
25V
NA
NA
10 V
NA
NA
16 V
NA
NA
25 V
2700 pF
0.6 mils
50 V
0.8 mils
>680 pF to 2200 pF
100 V
1.0 mils
>470pF to 560 pF
16V
NA
NA
25V
NA
NA
10 V
NA
NA
16 V
NA
NA
25 V
6800 pF
0.6 mils
50 V
>2200 to 5600 pF
0.8 mils
100 V
>1000 to 1500 pF
1.0 mils
16V
NA
NA
25V
NA
NA
X7R Dielectric
Minimum
Maximum
Dielectric
Capacitance
Thickness 2/
0.01 µF /6
0.4 mils
6800 pF
0.4 mils
4700 pF
0.8 mils
3900 pF
0.8 mils
1200 pF
1.0 mils
0.022 µF
0.4 mils
0.015 µF
0.8 mils
0.012 µF
0.8 mils
2200 pF
1.0 mils
0.1 µF
0.4 mils
0.082 µF
0.4 mils
0.047 µF
0.8 mils
0.039 µF
0.8 mils
6800 pF
1.0 mils
0.1 µF
0.4 mils
.039 µF
0.4 mils
.022 µF
0.8 mils
0.1 µF 6/
0.4 mils
0.027 µF
0.8 mils
0.022 µF
0.8 mils
3300 pF
1.0 mils
0.12 µF
0.4 mils
0.1 µF
0.4 mils
0.047 µF
0.8 mils
1.0 µF /5 /6
0.25 mils
0.22 µF
0.4 mils
0.10 µF
0.8 mils
0.8 mils
>0.018 µF to 0.10 µF
1.0 mils
>4700pF to 0.022 µF
0.27 µF
0.4 mils
0.22 µF
0.8 mils
1.8 µF /5 /6
0.25 mils
0.39 µF
0.4 mils
0.27 µF
0.8 mils
>0.039 to 0.22 µF
0.8 mils
>0.015 to 0.068 µF
1.0 mils
.68 µF
0.4 mils
.47 µF
0.8 mils
Case
Size
0402
0402
0402
0402
0402
0403
0403
0403
0403
0502
0504
0504
0504
0504
0306 4/
0306 4/
0306 4/
0603
0603
0603
0603
0508 4/
0508 4/
0508 4/
0805
0805
0805
0805 3/
0805 3/
0612 4/
0612 4/
1206
1206
1206
1206 3/
1206 3/
0912 4/
0912 4/
S-311-P-829
Page 4 of 14
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Table I. Allowable Capacitance/Voltage Combinations
NPO Dielectric
Maximum Working
Minimum
Maximum
Voltage (Vdc)
Dielectric
Capacitance
Thickness 2/
10 V
NA
NA
16 V
NA
NA
25 V
0.010 µF
0.6 mils
50 V
>3300 to 8200 pF
0.8 mils
100 V
>2200 to 3900 pF
1.0 mils
16 V
NA
NA
25 V
0.022µF
0.6 mils
50 V
>0.01 to 0.015 µF
0.8 mils
100 V
>4700 to 6800pF
1.0 mils
10V
NA
NA
16 V
NA
NA
25 V
0.056 µF
0.6 mils
50 V
>0.022 to 0.039 µF
0.8 mils
100 V
>0.010 to 0.018 µF
1.0 mils
16 V
NA
NA
25 V
.068 µF
0.6 mils
50 V
>0.010 to0.056 µF
0.8 mils
100 V
>0.027 µF
1.0 mils
X7R Dielectric
Minimum
Maximum
Dielectric
Capacitance
Thickness 2/
2.7 µF /5 /6
0.25 mils
0.68 µF
0.4 mils
0.47 µF
0.8 mils
>0.1 to 0.39 µF
0.8 mils
>0.027 to 0.15 µF
1.0 mils
1.2 µF
0.4 mils
1.0 µF
0.8 mils
>0.056 to 0.68 µF
0.8 mils
>0.18 to 0.27 µF
1.0 mils
4.7 µF /5 /6
0.25 mils
3.3 µF
0.4 mils
2.2 µF
0.8 mils
>0.47 to 1.8 µF
0.8 mils
>0.15 to 0.68 µF
1.0 mils
3.9 µF
0.4 mils
3.3 µF
0.8 mils
>1.0 - 2.2 µF
0.8 mils
>1.0 µF
1.0 mil
Case
Size
1209
1209
1209
1209 3/
1209 3/
1712
1712
1712 3/
1712 3/
1812
1725
1725
1725 3/
1725 3/
2225
2225
2225 3/
2225 3/
Notes:
1/ NA indicates “Not Available”
2/ Thickness measured after firing.
3/ This category is valid for values not covered by MIL-PRF-123.
4/ Values shown here are reverse geometry, low inductance style capacitors.
5/ Reserved.
6/ Maximum capacitance value may have DF values up to 7.5%.
S-311-P-829
Page 5 of 14
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