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GBPC35-01WT0

Bridge Rectifier Diode, 1 Phase, 35A, 100V V(RRM), Silicon, ROHS COMPLIANT, PLASTIC, GBPC-W, 4 PIN

器件类别:分立半导体    二极管   

厂商名称:Taiwan Semiconductor

厂商官网:http://www.taiwansemi.com/

器件标准:

下载文档
器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Taiwan Semiconductor
包装说明
S-PUFM-W4
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
UL RECOGNIZED
最小击穿电压
100 V
配置
BRIDGE, 4 ELEMENTS
二极管元件材料
SILICON
二极管类型
BRIDGE RECTIFIER DIODE
JESD-30 代码
S-PUFM-W4
JESD-609代码
e3
最大非重复峰值正向电流
400 A
元件数量
4
相数
1
端子数量
4
最高工作温度
150 °C
最低工作温度
-55 °C
最大输出电流
35 A
封装主体材料
PLASTIC/EPOXY
封装形状
SQUARE
封装形式
FLANGE MOUNT
峰值回流温度(摄氏度)
NOT SPECIFIED
最大重复峰值反向电压
100 V
表面贴装
NO
端子面层
MATTE TIN
端子形式
WIRE
端子位置
UPPER
处于峰值回流温度下的最长时间
NOT SPECIFIED
Base Number Matches
1
文档预览
GBPC 15, 25, 35 SERIES
Taiwan Semiconductor
CREAT BY ART
FEATURES
- Glass passivated junction
- Integrally molded heatsink provide very low
thermal resistance for maximum heat dissipation
- Typical I
R
less than 0.2μA
- High surge current capability
- UL Recognized File # E-326243
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
Glass Passivated Bridge Rectifiers
GBPC
MECHANICAL DATA
Case:
GBPC
GBPC-W: Wire structure
GBPC-M: Terminal cathode parallel to anode
Molding compound, UL flammability classification rating 94V-0
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
Polarity:
Polarity as marked on the body
Mounting torque:
20 in-lbs maximum
Weight:
16.95 g (approximately)
GBPC-W
GBPC-M
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25°C unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
GBPC15
GBPC25
GBPC35
Peak forward surge current,8.3 ms
single half sine-wave superimposed
on rated load (JEDEC method)
Maximum instantaneous
forward voltage drop per
element at specified current
(Note 1)
GBPC15
GBPC25
GBPC35
SYMBOL
V
RRM
V
RMS
V
DC
005
50
35
50
01
100
70
100
02
200
140
200
04
400
280
400
15
25
35
300
I
FSM
300
400
A
06
600
420
600
08
800
560
800
10
1000
700
1000
UNIT
V
V
V
I
F(AV)
A
GBPC15 7.5A
GBPC25 12.5A
GBPC35 17.5A
@ T
J
=25°C
V
F
1.1
V
Maximum reverse current @ Rated VR
Typical thermal resistance
Operating junction temperature range
Storage temperature range
I
R
R
θJC
T
J
T
STG
5
1.5
- 55 to +150
- 55 to +150
μA
°C/W
°C
°C
Note 1: Pulse test with PW=300μs, 1% duty cycle
Document Number: DS_D1410091
Version: K14
GBPC 15, 25, 35 SERIES
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
GBPC*5xx
(Note 1)
PACKING CODE
PACKAGE
PACKING
T0
GBPC
Tray
Note 1: "*" defines current from 15A (GBPC15xx) to 35A (GBPC35xx),
"xx" defines voltage from 50V (GBPC*5005) to 1000V (GBPC*510)
EXAMPLE
PREFERRED P/N
GBPC1510 T0
PART NO.
GBPC1510
PACKING CODE
T0
DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES
(T
A
=25°C unless otherwise noted)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
100
INSTANTANEOUS REVERSE CURRENT (μA)
FIG.1 FORWARD CURRENT DERATING CURVE
40
AVERAGE FORWARD CURRENT(A)
35
30
25
20
15
10
5
0
20
40
60
80
100
120
(
o
C)
140
160
180
CASE TEMPERATURE
GBPC15
GBPC25
GBPC35
T
J
=125°C
10
1
T
J
=25°C
0.1
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
400
INSTANTANEOUS FORWARD CURRENT (A)
PEAK FORWARD SURGE CURRENT(A)
350
300
250
200
150
100
50
0
1
10
NUMBER OF CYCLES AT 60 Hz
100
GBPC15
GBPC25
GBPC35
1000
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
GBPC35
100
GBPC25
10
GBPC15
1
0.1
0.6
0.8
1
1.2
1.4
1.6
FORWARD VOLTAGE (V)
1.8
2
Document Number: DS_D1410091
Version: K14
GBPC 15, 25, 35 SERIES
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
700
J UNCTION CAPACITANCE (pF)
A
600
500
400
300
200
100
0
0.1
1
10
100
REVERSE VOLTAGE (V)
f=1.0MHz
Vsig=50mVp-p
PACKAGE OUTLINE DIMENSIONS
GBPC
DIM.
A
B
C
D
E
F
G
H
I
J
Unit (mm)
Min
28.50
15.50
5.08
28.50
15.50
13.30
17.10
10.97
21.50
Max
29.00
17.60
5.59
29.00
17.60
15.30
19.10
11.23
24.50
Unit (inch)
Min
1.122
0.610
0.200
1.122
0.610
0.524
0.673
0.432
0.846
Max
1.142
0.693
0.220
1.142
0.693
0.602
0.752
0.442
0.965
6.35 (TYP)
0.25 (TYP)
GBPC-W
DIM.
A
B
C
D
E
F
G
H
I
J
K
Unit (mm)
Min
28.50
17.10
5.08
28.50
17.10
4.40
10.40
0.97
10.97
30.50
4.40
Max
29.00
19.10
5.59
29.00
19.10
6.20
12.40
1.07
11.23
-
6.20
Unit (inch)
Min
1.122
0.673
0.200
1.122
0.673
0.173
0.409
0.038
0.432
1.201
0.173
Max
1.142
0.752
0.220
1.142
0.752
0.244
0.488
0.042
0.442
-
0.244
Document Number: DS_D1410091
Version: K14
GBPC 15, 25, 35 SERIES
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
GBPC-M
DIM.
A
B
C
D
E
F
G
H
I
J
K
Unit (mm)
Min
28.50
15.50
5.08
28.50
15.50
15.50
15.50
0.76
10.97
21.26
Max
29.00
17.60
5.59
29.00
17.60
17.60
17.60
0.86
11.23
24.57
Unit (inch)
Min
1.122
0.610
0.200
1.122
0.610
0.610
0.610
0.030
0.432
0.837
Max
1.142
0.693
0.220
1.142
0.693
0.693
0.693
0.034
0.442
0.967
6.6 (TYP)
0.26 (TYP)
MARKING DIAGRAM
P/N
YWW
F
= Specific Device Code
= Date Code
= Factory Code
Document Number: DS_D1410091
Version: K14
GBPC 15, 25, 35 SERIES
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1410091
Version: K14
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