Chip Multilayer Ceramic Capacitors for Automotive
GCM21BC72A105KE36_ (0805, X7S:EIA, 1uF, DC100V)
_: packaging code
1.Scope
This product specification is applied to Chip Multilayer Ceramic Capacitors used for Automotive Electronic equipment.
Reference Sheet
2.MURATA Part NO. System
(Ex.)
GCM
21
(1)L/W
Dimensions
B
(2)T
Dimensions
C7
(3)Temperature
Characteristics
2A
(4)Rated
Voltage
105
(5)Nominal
Capacitance
K
(6)Capacitance
Tolerance
E36
(7)Murata’s Control
Code
L
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
2.0±0.2
(1)-2 W
1.25±0.2
(2) T
1.25±0.2
e
0.2 to 0.7
(Unit:mm)
g
0.7 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X7S(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
-22 to 22 %
-55 to 125 °C
(25 °C)
DC 100 V
1 uF
±10 %
-55 to 125 °C
5.Package
mark
L
K
(8) Packaging
f180mm
Reel
EMBOSSED W8P4
f330mm
Reel
EMBOSSED W8P4
Packaging Unit
3000 pcs./Reel
10000 pcs./Reel
Product specifications in this catalog are as of May.30,2018,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GCM21BC72A105KE36-01
1
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Pre-and Post-Stress
1
Electrical Test
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
Capacitance
Change
D.F.
Insulation
Resistance
25℃
3 Temperature Cycling
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
Capacitance
Change
D.F.
0.2max
No marking defects
Within +/-7.5%
Solder the capacitor on the test substrate(glass epoxy board).
Perform the 1000 cycles test according to the four heat treatments
listed in the following table.
Set for 24+/-2h at room temperature, then measure.
0.2max
Within the specified initial value.
No marking defects
Within +/-10%
・
Initial measurement
Perform a heat treatment at 150+0/-10
℃for
1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
-
Solder the capacitor on the test substrate(glass epoxy board).
Set the capacitor for 1000+/-12h at 150+/-3℃.
Set for 24+/-2h at room temperature, then measure.
2 High Temperature
Exposure (Storage)
Specification.
AEC-Q200 Test Method
Step
Temp.
(C)
Time
(min)
1
Min.Operating Temp.+0/-3
15+/-3
2
3
4
Room
Room
Temp. Max.Operating Temp. +3/-0 Temp.
1
15+/-3
1
・
Initial measurement
Insulation
Resistance
25℃
4 Destructive
Physical Analysis
5 Moisture Resistance
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Solder the capacitor on the test substrate(glass epoxy board).
Apply the 24h heat (25℃ to 65℃) and humidity (80%RH to 98%RH)
treatment shown below, 10 consecutive times.
No defects or abnormalities
Within the specified initial value.
Perform a heat treatment at 150+0/-10
℃for
1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
Per EIA-469
Temperature
Capacitance
Change
D.F.
Within +/-10%
(℃)
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-5
-10
Humidity
90½98%
Humidity
80½98%
Humidity
90½98%
Humidity
80½98% Humidity
90½98%
0.2max
Insulation
Resistance
25℃
Within the specified initial value.
+10
- 2
℃
Initial measuremt
One cycle 24hours
0
1 2
3
4 5
6
7
8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Hours
・
Initial measurement
Perform a heat treatment at 150+0/-10
℃for
1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
・Measurement
after test
Perform a heat treatment at 150+0/–10°C for 1h and then let
sit for 24+/-2h at room temperature, then measure.
6 Biased Humidity
Appearance
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Solder the capacitor on the test substrate(glass epoxy board).
Apply the rated voltage and 1.3+0.2/-0Vdc (add 6.8kΩ resister)
at 85+/-3℃ and 80%RH to 85%RH humidity for 1000+/-12h.
The charge/discharge current is less than 50mA.
Capacitance
Change
D.F.
Within +/-10%
・
Initial measurement
Perform a heat treatment at 150+0/-10
℃for
1h and then sit
for 24+/-2h at room temperature.
0.2 max
Perform the initial measurement.
・Measurement
after test
Perform a heat treatment at 150+0/–10°C for 1h and then let
Insulation
Resistance
25℃
More than 200MΩ or 5Ω・F
(Whichever is smaller)
sit for 24+/-2h at room temperature, then measure.
JEMCGS-0735J
2
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specification.
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
Capacitance
Change
D.F.
0.2max
No marking defects
Within +/-12.5%
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board).
Apply 150% of the rated voltage for 1000+/-12h at 125+/-3℃.
The charge/discharge current is less than 50mA.
・
Initial measurement
Perform a heat treatment at 150+0/-10
℃for
1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
・Measurement
after test
Perform a heat treatment at 150+0/–10°C for 1h and then let
Insulation
Resistance
25℃
8 External Visual
No defects or abnormalities
Visual inspection
More than 200MΩ or 5Ω・F
(Whichever is smaller)
sit for 24+/-2h at room temperature, then measure.
7 Operational Life
9 Physical Dimension
Within the specified dimensions
Using Measuring instrument of dimension.
10 Resistance to
Solvents
Appearance
No marking defects
Per MIL-STD-202 Method 215
Solvent 1 : 1 part (by volume) of isopropyl alcohol
Capacitance
Within the specified initial value.
3 parts (by volume) of mineral spirits
Solvent 2 : Terpene defluxer
D.F.
Within the specified initial value.
Solvent 3 : 42 parts (by volume) of water
1part (by volume) of propylene glycol monomethyl ether
Insulation
Resistance
25℃
11 Mechanical
Shock
Capacitance
Appearance
Within the specified initial value.
1 part (by volume) of monoethanolamine
No marking defects
Solder the capacitor on the test substrate(glass epoxy board).
Three shocks in each direction should be applied along 3 mutually
Within the specified initial value.
perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
D.F.
Within the specified initial value.
duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
Insulation
Resistance
25℃
12 Vibration
Appearance
Within the specified initial value.
No defects or abnormalities
Solder the capacitor on the test substrate(glass epoxy board).
The capacitor should be subjected to a simple harmonic motion having
Capacitance
Within the specified initial value.
a total amplitude of 1.5mm, the frequency being varied uniformly
between the approximate limits of 10 and 2000Hz.
D.F.
Within the specified initial value.
The frequency range, from 10 to 2000Hz and return to 10Hz,
should be traversed in approximately 20 minutes.
Insulation
Resistance
25℃
13 Resistance to
Soldering Heat
Appearance
Capacitance
D.F.
Within the specified initial value.
This motion should be applied for 12 items in each 3 mutually
perpendicular directions (total of 36 times).
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within the specified initial value.
Within the specified initial value.
Immerse the capacitor in Sn-3.0Ag-0.5Cu solder solution or an eutectic
solder solution at 260+/-5℃ for 10+/-1s.
Set at room temperature for 24+/-2h, then measure.
・
Initial measurement
Perform a heat treatment at 150+0/-10
℃for
1h and then sit
for 24+/-2h at room temperature.
Perform the initial measurement.
Insulation
Resistance
25℃
Within the specified initial value.
JEMCGS-0735J
3
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specification.
The measured and observed characteristics shall satisfy the
specifications in the following table.
Appearance
Capacitance
Change
D.F.
Within the specified initial value.
Time
(min）
15+/-3
15+/-3
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board).
Perform the 300 cycles according to the two heat treatments listed
in the following table(Maximum transfer time is 20s).
Set for 24+/-2h at room temperature, then measure.
14 Thermal Shock
No marking defects
Within +/-10.0%
Step
Temp.(℃）
1
Min.Operating Temp.
+0/-3
2
Max.Operating Temp.
+3/-0
Insulation
Resistance
25℃
15 ESD
Appearance
Capacitance
D.F.
Insulation
Resistance
25℃
16 Solderability
Within the specified initial value.
・
Initial measurement
Perform a heat treatment at 150+0/-10
℃for
1h and then sit
for 24+/-2h at room temperature.
No marking defects
Within the specified initial value.
Within the specified initial value.
Within the specified initial value.
Per AEC-Q200-002
95% of the terminations is to be soldered evenly and continuously.
(a) Preheat at 155℃ for 4h. After preheating, immerse the capacitor
in a solution of rosin ethanol 25(mass)%.
Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃ or
an eutectic solder solution at 235+/-5℃ for 5+0/-0.5s.
(b) should be placed into steam aging for 8h+/-15min.
After preheating, immerse the capacitor in a solution of rosin
ethanol
25(mass)%.
Immerse
in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃
or
an eutectic solder solution at 235+/-5℃ for 5+0/-0.5s.
(c) should be placed into steam aging for 8h+/-15min.
After
preheating, immerse the capacitor in a solution of rosin
ethanol
25(mass)%.
Immerse
in Sn-3.0Ag-0.5Cu solder solution or
an eutectic solder solution for 120+/-5s at 260+/-5℃.
17 Electrical
Chatacteri-
zation
Appearance
Capacitance
No defects or abnormalities
Shown in Rated value.
Visual inspection.
The capacitance/D.F. should be measured at 25℃ at the frequency
and voltage shown in the table.
Char
C
≦10F
6.3V max.
1.0+/-0.1kHz
0.5+/-0.1Vrms
10V min.
1.0+/-0.1kHz
1.0+/-0.2Vrms
120+/-24Hz
0.5+/-0.1Vrms
D.F.
0.1 max
Item.
Frequency
Voltage
10F < C
Insulation
Resistance
25
℃
Insulation
Resistance
125℃
Dielectric
Strength
More than 2,000MΩ or 50Ω・F (Whichever is smaller)
The insulation resistance should be measured with a DC voltage not
exceeding the rated voltage at 25℃ and 125℃ within 1min of charging.
More than 200MΩ or 5Ω・F (Whichever is smaller)
No failure
No failure should be observed when 250% of the rated voltage is
applied between the terminations for 1 to 5s,
provided the charge/ discharge current is less than 50mA.
JEMCGS-0735J
4
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Appearance
No marking defects
Specification.
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig1.
Then apply a force in the direction shown in Fig 2 for 60s.
Capacitance
Change
D.F.
Within the specified initial value.
Type
45
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
a
0.3
45
0.5
0.6
0.8
2.0
2.0
b
0.9
支持台
1.5
2.2
3.0
4.4
4.4
c
0.3
0.6
0.9
1.3
1.7
2.6
(in mm)
18 Board Flex
Within +/-10.0%
The soldering should be done by the reflow method and should be
½ﾝﾃﾞﾝ½
conducted with care so that the soldering is uniform and free of defects
such as heat shock.
Insulation
Resistance
25℃
Within the specified initial value.
Land
b
f4.5
20
50 min.
Pressurizing
speed:1.0mm/s
Pressurize
a
100
40
c
c
R4
Capacitance meter
Flexure：2
(High Dielectric Type)
t : 1.6mm
Fig.
19 Terminal
Strength
Capacitance
D.F.
Within the specified initial value.
Within the specified initial value.
Appearance
No marking defects
45
Fig.2
45
(GCM03/15:0.8mm
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig3.
Then apply 18N* force in parallel with the test jig for 60s.
The soldering should be done either with an iron or using the reflow
method and should be conducted with care so that the soldering is
uniform and free of defects such as heat shock
Insulation
Resistance
25℃
Within the specified initial value.
*2N(GCM03/15)
Type
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
a
0.3
0.4
1.0
1.2
2.2
2.2
b
0.9
1.5
3.0
4.0
5.0
5.0
c
0.3
0.5
1.2
1.65
2.0
2.9
(in mm)
c
b
a
ﾗﾝﾄﾞ
b
f4.5
T:1.6mm
(GCM03/15:0.8mm)
Solder resist
Baked electrode or
Copper foil
c
a
20 Beam Load Test
Destruction value should be exceed following one.
< Chip L dimension : 2.5mm max. >
Chip thickness > 0.5mm rank : 20N
Chip thickness = 0.5mm rank : 8N
Chip thickness = 0.3mm rank : 5N
Chip thickness < 0.3mm rank : 2.5N
Fig.3
Place the capacitor in the beam load fixture as Fig 4.
Apply a force.
< Chip Length : 2.5mm max. >
Iron Board
< Chip L dimension : 3.2mm max. >
Chip thickness < 1.25mm rank : 15N
Chip
thickness
≧1.25mm
rank : 54.5N
< Chip Length : 3.2mm min. >
L
0.6L
Fig.4
Speed supplied the Stress Load : *0.5mm/s
*GCM03: 0.1mm/s
JEMCGS-0735J
5
