型号
- 型号
- 关键词
| 型号 | GD74HC137J | GD74HCT137D | GD54HC137J | GD74HCT137 | GD74HCT137J | GD54HCT137J | GD74HC137D | GD74HC137 |
|---|---|---|---|---|---|---|---|---|
| 描述 | Decoder/Driver, CMOS, CDIP16, | Decoder/Driver, CMOS, PDSO16, | Decoder/Driver, CMOS, CDIP16, | Decoder/Driver, CMOS, PDIP16, | Decoder/Driver, CMOS, CDIP16, | Decoder/Driver, CMOS, CDIP16, | Decoder/Driver, CMOS, PDSO16, | Decoder/Driver, CMOS, PDIP16, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T16 | R-PDSO-G16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDSO-G16 | R-PDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 最大I（ol） | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | DIP | DIP | DIP | DIP | SOP | DIP |
| 封装等效代码 | DIP16,.3 | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 电源 | 2/6 V | 5 V | 2/6 V | 5 V | 5 V | 5 V | 2/6 V | 2/6 V |
| Prop。Delay @ Nom-Sup | 45 ns | 50 ns | 55 ns | 50 ns | 50 ns | 61 ns | 45 ns | 45 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | NO | NO | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | LG Semicon Co Ltd | - | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd |
| 包装说明 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | - |
