型号
- 型号
- 关键词
RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA196, MINI, PLASTIC, BGA-196
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：Intel(英特尔)
厂商官网：http://www.intel.com/
下载文档| 型号 | GD80960JC-33 | GD80960JS-33 | NG80960JC-40 | NG80960JC-33 | GD80960JC-50 | GD80960JS-16 |
|---|---|---|---|---|---|---|
| 描述 | RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA196, MINI, PLASTIC, BGA-196 | RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA196, PLASTIC, BGA-196 | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PQFP132, PLASTIC, QFP-132 | RISC Microprocessor, 32-Bit, 33MHz, CMOS, PQFP132, PLASTIC, QFP-132 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA196, MINI, PLASTIC, BGA-196 | RISC Microprocessor, 32-Bit, 16MHz, CMOS, PBGA196, MINI, PLASTIC, BGA-196 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | BGA | BGA | QFP | QFP | BGA | BGA |
| 包装说明 | BGA, BGA196(UNSPEC) | BGA, BGA196(UNSPEC) | BQFP, SPQFP132,1.1SQ | BQFP, SPQFP132,1.1SQ | BGA, BGA196(UNSPEC) | BGA, BGA196(UNSPEC) |
| 针数 | 196 | 196 | 132 | 132 | 196 | 196 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| 其他特性 | OPERATING CASE TEMPERATURE 0 TO 100 C | OPERATING CASE TEMPERATURE 0 TO 100 C | OPERATING CASE TEMPERATURE 0 TO 100 C | OPERATING CASE TEMPERATURE 0 TO 100 C | OPERATING CASE TEMPERATURE 0 TO 100 C | OPERATING CASE TEMPERATURE 0 TO 100 C |
| 地址总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 |
| 边界扫描 | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 16.67 MHz | 33.3 MHz | 20 MHz | 16.67 MHz | 25 MHz | 16 MHz |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 集成缓存 | NO | YES | NO | NO | NO | NO |
| JESD-30 代码 | S-PBGA-B196 | S-PBGA-B196 | S-PQFP-G132 | S-PQFP-G132 | S-PBGA-B196 | S-PBGA-B196 |
| 低功率模式 | YES | YES | YES | YES | YES | YES |
| 端子数量 | 196 | 196 | 132 | 132 | 196 | 196 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BQFP | BQFP | BGA | BGA |
| 封装等效代码 | BGA196(UNSPEC) | BGA196(UNSPEC) | SPQFP132,1.1SQ | SPQFP132,1.1SQ | BGA196(UNSPEC) | BGA196(UNSPEC) |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | FLATPACK, BUMPER | FLATPACK, BUMPER | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | 225 | 225 | NOT SPECIFIED | NOT SPECIFIED | 225 | 225 |
| 电源 | 3.3,3.3/5 V | 3.3,3.3/5 V | 3.3,3.3/5 V | 3.3,3.3/5 V | 3.3,3.3/5 V | 3.3,3.3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 速度 | 33 MHz | 33 MHz | 40 MHz | 33 MHz | 50 MHz | 16 MHz |
| 最大压摆率 | 225 mA | 250 mA | 267 mA | 225 mA | 330 mA | 120 mA |
| 最大供电电压 | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V |
| 最小供电电压 | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | BALL | BALL | GULL WING | GULL WING | BALL | BALL |
| 端子位置 | BOTTOM | BOTTOM | QUAD | QUAD | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
| 厂商名称 | Intel(英特尔) | Intel(英特尔) | - | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) |
| 湿度敏感等级 | 1 | 1 | - | - | 1 | 1 |