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GDS012-005

Interconnection Device

器件类别:连接器    连接器   

厂商名称:Delphi Connection Systems

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器件参数
参数名称
属性值
Reach Compliance Code
unknown
其他特性
GOLD DOT, NO.OF CONTACTS: 250, 25 GROUND CONTACTS AVAILABLE
连接器类型
INTERCONNECTION DEVICE
Base Number Matches
1
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Connection
Systems
Gold Dot
TM
Mezzanine
Connectors
Description:
Z-axis connectors for high line count, board-stacking applications.
Connectors with I/O counts from 52 to 300 are available for production.
Benefits:
Speed
Superior impedance control – digital frequency rates up to 2.5 GHz
Reliability
Highly proven performance in harsh environments
Ruggedness
With no pins to bend and sturdy connector bodies, these systems
provide a rugged and highly reliable interface
Scalability
Lengths available for PCB separations from 6 to 25 mm
Typical Applications:
High bandwidth digital electronics
Mainframes
High-speed modems
Test equipment
Switching
Cellular base stations
Workstations
Mezzanine Test Characteristics:
The Gold Dot connection system shown above is tested to the following specifications:
Parameter
Total Contact Resistance
Current Carrying
Capacity
Contact Force
Insulation Resistance
Mating Durability
Temperature Range
Temperature Shock
Temp. Humidity Cycle
Humidity
Vibration
Vibration Random
Mechanical Shock
Conditions and Performance
Less than 10 mΩ change from initial measurement on immersion gold and hard gold PCB finishes
1 amp max per contact on a 5 mil (127 microns) trace width
40 to 50 grams per contact
Per EIA 364-21 and BellCore GR 1217 1000 MΩ, 100 VDC, duration 120 seconds
80 cycles mate and unmate on immersion gold finishes, over 200 cycles mate and unmate on hard gold finishes
-40ºC to +125ºC for environment test procedure, at 1,000 hours
Per EIA 364-32, Test Condition II, except -40ºC to +125ºC for 8 cycles total, 1 hour cycle time, 1/2 hour each extreme
Per EIA 364-31, Test Condition III, 25ºC to 85ºC, 2.5 hours at 90% RH, total of 24 cycles
Per EIA 364-31,Test Condition II, at 85ºC with 90% RH for 96 hours
Per EIA 364-28, Test Condition II, frequency range 10 to 500 Hz, peak level 10 Gs
Per EIA 364-28, Test Condition V(C) RMS 9.26 Gs
Per EIA 364-27 Test Condition H, peak acceleration 294 m/s
2
at 30 Gs, 11 ms duration
,
Gold Dot connection systems have been subjected to more rigorous conditions than those described above.
Please see our website for details on the Gold Dot commercial test plan.
Mezzanine
Connectors
Hardware
Electrical Performance
Parameter
Characteristic Impedance
Data Rate
Attenuation
Propagation Delay
Backward Cross Talk*
Capacitance
Dielectric Strength
Conditions and Performance
50
±10% single-ended
100
±10% differential
10 Gbps
< .5 dB/inch at 5 GHz
< 175 ps/inch
< 5% at 62.5 ps Tr within differential pair
< .5% at 62.5 ps Tr pair-to-pair
< 3 pF/inch
500 to 700 VAC
*In body of circuit
Standard Sizes
Mezzanine
Part Number
GDS012-001
GDS012-002
GDS012-003
GDS012-004
GDS012-005
Signals/Grounds*/
Total Contacts
52 / 13 / 65
100 / 25 / 125
150 / 25 / 175
200 / 25 / 225
250 / 25 / 275
300 / 30 / 330
Rows/
Columns
5 / 13
5 / 25
7 / 25
9 / 25
11 / 25
11 / 30
Density
Row/Column Pitch
0.65 / 1.25
0.70 / 1.25
0.75 / 1.75
0.80 / 2.25
0.85 / 2.75
0.90 / 2.75
Hole
Pitch
15.00
30.00
42.00
54.00
66.00
79.75
Board
Separation
7
.00
7
.00
10.00
10.00
15.00
15.00
Flex Circuit
GDS012-006
Hardware
Part Number
GDS012-001
GDS012-002
GDS012-003
GDS012-004
GDS012-005
GDS012-006
A
33.10
48.10
60.30
73.30
86.30
100.05
B
25.70
40.70
52.90
65.90
78.90
92.65
C
7
.20
7
.20
7
.20
8.94
11.04
13.34
D
7
.00
7
.00
10.00
10.00
15.00
15.00
E
4.46
4.46
4.46
4.75
6.30
7
.93
PCB
1.59
1.59
1.59
1.59
1.59
1.59
PCB Layout
Flex/PCB
Part Number
GDS012-001
GDS012-002
GDS012-003
GDS012-004
GDS012-005
GDS012-006
A
34.36
49.36
61.56
74.56
87
.56
101.31
B
25.70
40.70
52.90
65.90
78.90
92.65
C
15.00
30.00
42.00
54.00
66.00
79.75
D
26.23
26.23
29.23
31.25
40.45
43.00
E
17
.57
17
.57
20.57
22.31
29.41
31.00
F
2.60
2.80
4.50
6.40
8.50
9.00
G
1.30
1.40
2.25
3.20
4.25
4.50
H
5.35
5.35
5.45
5.95
6.45
6.45
J
0.53
0.58
0.63
0.68
0.73
0.78
* The ground row is located closest to the edge of the Flex/PCB. All dimensions are in millimeters.
For additional information, please contact us or visit our website.
www.delphi.com/connect
Printed on Recycled Paper.
© 1999-2003, Delphi. All rights reserved.
Printed in the U.S.A.
DP-03-E-011
602/5mGBS • 203/2mGBS • U803/3W
Connection Systems
17150 Von Karman Ave.
Irvine, CA 92614
U.S.A.
Tel: [1] 949.660.5701
Fax: [1] 949.660.5825
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参数对比
与GDS012-005相近的元器件有:GDS012-003、GDS012-006、GDS012-001、GDS012-004。描述及对比如下:
型号 GDS012-005 GDS012-003 GDS012-006 GDS012-001 GDS012-004
描述 Interconnection Device Interconnection Device Interconnection Device Interconnection Device Interconnection Device
Reach Compliance Code unknown unknown unknown unknown unknown
其他特性 GOLD DOT, NO.OF CONTACTS: 250, 25 GROUND CONTACTS AVAILABLE GOLD DOT, NO.OF CONTACTS: 150, 25 GROUND CONTACTS AVAILABLE GOLD DOT, NO.OF CONTACTS: 300, 30 GROUND CONTACTS AVAILABLE GOLD DOT, NO.OF CONTACTS: 52, 13 GROUND CONTACTS AVAILABLE GOLD DOT, NO.OF CONTACTS: 200, 25 GROUND CONTACTS AVAILABLE
连接器类型 INTERCONNECTION DEVICE INTERCONNECTION DEVICE INTERCONNECTION DEVICE INTERCONNECTION DEVICE INTERCONNECTION DEVICE
厂商名称 - Delphi Connection Systems Delphi Connection Systems Delphi Connection Systems Delphi Connection Systems
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