SM Crystal
Specifications
2011/65/EU
GSX-211
Parameters
Frequency range:
24.0 ~ 54.0MHz
Calibration tolerance:
±10ppm
±15ppm
±20ppm
Other values (±10.0 ~ ±100ppm)
±10ppm
±15ppm
±20ppm
Other values (±7.5 ~ ±100ppm)
Product
GSX-211
F
R
M
N
A
S
specify
1
P
2
specify
1
P
2
specify
2
3
specify
Option
Codes
Temperature stability:
1.60
±0.10
1.20
±0.10
0.45 (max)
Operating temperature range:
-20 to +70°C
-30 to +85°C
Other values
SOLDER PAD LAYOUT
0.30
0.20
Storage temperature range:
-40 to +90°C
Circuit condition:
5pF
8pF
9pF
10pF
Series resonant
Other values
5pF max
Fundamental
1
4
0.50
(typ)
2
3
0.30
(typ)
0.52
0.52
0.67
PAD
1
2
3
4
CONNECTION
Crystal
Ground & lid
Crystal
Ground
0.67
Static capacitance (C
0
):
Oscillation mode:
Equivalent series resistance:
100Ω max (24.0 ~ 37.39MHz)
80Ω max (37.4 ~ 54.0MHz)
Ageing:
±2ppm max first year
Features
Ultra-miniature for maximum space saving
Ideal for Bluetooth, NFC, Smartcard, wireless etc
Metal lid grounded to minimise EMI
Seam sealed for excellent long-term stability
Test drive level:
10μW typ, 100μW max
Soldering condition:
260°C, 10 sec x2 max
Standard.
Optional - Please specify required code(s) when ordering
Ordering Information
Part No, or product name + option codes + frequency
eg:
GSX-211/111NF 26.0MHz
10/10/10/9-F
GSX-211/1P2AF 40.0MHz
10/15/20/10-F
Option code X (eg GSX-211/X) denotes a custom specification.
±10ppm temperature stability may not be available over -30+85°C.
Check with our sales office before ordering.
Tel:
+44 1460 256 100
14 Sep 2015
Fax:
+44 1460 256 101
E-mail:
sales@golledge.com
Web:
www.golledge.com
Product Information
Construction
GSX-211
Ceramic body with gold-plated pads
Metal lid, seam sealed
Composition
This product is lead-free, and is fully compliant with
the RoHS directive 2011/65/EC
2011/65/EU
Pb
LeadFree
Packaging & Handling
Production quantities supplied on T&R, 3k pcs per reel.
Small quantities may be supplied on tape (no reel), or in bulk.
Soldering Profile
°C
10s max
Marking
FREQUENCY
S DC
Marking type: Laser
DC = Date code
260
200
Tape & Reel Specification
2.0 2.0
0.25
±0.02
0.5Ø 1.55Ø
1.75
100
5°C/s max
5°C/s max
5°
±0.05
MARK
3.5
1.85
8.0
±0.2
Preheat
140~160°C
0
60~90s max
Heat
> 200°C
50~60s max
Slow
cooldown
Time
Maximum solder resistance: 260°C x 10 secs x 2.
0.45
1.45
9.0
±0.5
FEED
2.0
120°
2.00
±0.5
21.0Ø
±0.8
13Ø
180Ø
+0.0
-3.0
60Ø
Not to scale. Dimensional tolerances ±0.1mm unless otherwise stated.
Tel:
+44 1460 256 100
04 Sep 2014
Fax:
+44 1460 256 101
E-mail:
sales@golledge.com
Web:
www.golledge.com
DSP 与 ARM 处理器
