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GUQ06CG0R9C250NT

Ceramic Capacitor, Multilayer, Ceramic, 250V, 27.78% +Tol, 27.78% -Tol, C0G, 30ppm/Cel TC, 0.0000009uF, Surface Mount, 0603, CHIP, LEAD FREE

器件类别:无源元件    电容器   

厂商名称:Cal-Chip Electronics

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器件参数
参数名称
属性值
Objectid
1079005544
包装说明
, 0603
Reach Compliance Code
unknown
ECCN代码
EAR99
YTEOL
8.08
电容
9e-7 µF
电容器类型
CERAMIC CAPACITOR
介电材料
CERAMIC
JESD-609代码
e3
制造商序列号
GUQ
安装特点
SURFACE MOUNT
多层
Yes
负容差
27.78%
端子数量
2
最高工作温度
125 °C
最低工作温度
-55 °C
封装形状
RECTANGULAR PACKAGE
包装方法
TR, PAPER, 7 INCH
正容差
27.78%
额定(直流)电压(URdc)
250 V
尺寸代码
0603
表面贴装
YES
温度特性代码
C0G
温度系数
30ppm/Cel ppm/°C
端子面层
MATTE TIN OVER NICKEL
端子形状
WRAPAROUND
文档预览
MULTILAYER CERAMIC CAPACITORS
Ultra High Q & Low ESR Series (GUQ)
1. INTRODUCTION
MLCC Consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization,
high density and high efficiency, ceramic condensers are used.
Calchip GUQ series MLCC is used at high frequencies and generally have a small temperature coefficient of capacitance,
typical within the +/-30ppm/C required for NPO (COG) classification and have excellent conductivity internal electrode. Thus,
Calchip GUQ
series MLCC will be with the feature of low EST and high Q characteristics.
2. FEATURES
a.
b.
c.
d.
High Q and low ESR performance at high frequency.
Ultra low capacitance to 0.1pF.
Can offer high precision tolerance to ±0.05pF.
Quality improvement of telephone calls for low
power loss and better performance.
3. APPLICATIONS
a.
b.
c.
Telecommunication
products & equipments: Mobile
phone, WLAN, Base station.
RF module: Power amplifier, VCO.
Tuners.
HOW TO ORDER
GUQ
SERIES
GUQ=Ultra
High Q &
Low ESR
06
SIZE
02=0201
(0603)
04=0402
(1005)
06=0603
(1608)
CG
DIELECTRIC
101
CAPACITANCE
Two significant
digits followed
b no. of zeros.
An R is in place
of decimal point.
eg.:
0R5=0.5pF
1R0=1.0pF
100=10pF
J
TOLERANCE
250
VOLTAGE
Two significant
digits followed by
no. of zeros. And
R is in place of
decimal point.
25=25 VDC
50=50 VDC
100=100 VDC
250=250 VDC
N
TERMINATION
N=Cu/Ni/Sn
T
PACKAGING
T=7” reeled
CG = NP0
(C0G)
A=±0.05pF
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
Calchip Electronics, INC.
59 Steamwhistle Drive, Ivyland, PA. 18974
www.calchipelectronics.com
ph 215-942-8900 fx 215-942-6400
MULTILAYER CERAMIC CAPACITORS
Ultra High Q & Low ESR Series (GUQ)
5. EXTERNAL DIMENSIONS
Size
Inch (mm)
L (mm)
W (mm)
T (mm)/Symbol
M
B
(mm)
L
0201 (0603)
0.60±0.03
0.30±0.03
0.30±0.03
L
0.15±0.05
W
T
0402 (1005)
1.00±0.05
0.50±0.05
0.50±0.05
N
0.25+0.05/-0.10
M
B
M
B
0603 (1608)
1.60±0.10
0.80±0.10
0.80±0.07
S
0.40±0.15
Fig. 1 The outline of MLCC
6. GENERAL ELECTRICAL DATA
Dielectric
NP0
Size
0201, 0402, 0603
Capacitance*
0201: 0.1pF to 18pF
0402: 0.1pF to 22pF
0603: 0.4pF to 47pF
Capacitance tolerance
Cap≤5pF: A (±0.05pF ), B (±0.1pF), C (±0.25pF)
5pF<Cap<10pF: B (±0.1pF), C (±0.25pF), D (±0.5pF)
Cap≥10pF: F (±1%), G (±2%), J (±5%)
Rated voltage (WVDC)
25V, 50V, 100V, 250V
Q*
0201 & 0402 sizes: Q≥400+20C
0603 size: Cap<30pF, Q≥800+20C; Cap≥30pF, Q≥1400
Insulation resistance at Ur
≥10G
Operating temperature
-55 to +125°C
Capacitance change
±30ppm/°C
Termination
Ni/Sn (lead-free termination)
* Measured at the conditions of 25°C ambient temperature and 30~70% related humidity.
Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap≤1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF.
Calchip Electronics, INC.
59 Steamwhistle Drive, Ivyland, PA. 18974
www.calchipelectronics.com
ph 215-942-8900 fx 215-942-6400
MULTILAYER CERAMIC CAPACITORS
Ultra High Q & Low ESR Series (GUQ)
7. CAPACITANCE RANGE
DIELECTRIC
NP0
SIZE
0201
0402
0603
RATED VOLTAGE (VDC)
25
50
50
100
250
Tolerance
0.1pF (0R1)
L
N
B
0.2pF (0R2)
L
N
A, B
0.3pF (0R3)
L
N
S
S
S
A, B
0.4pF (0R4)
L
N
S
S
S
A, B
0.5pF (0R5)
L
N
S
S
S
A, B, C
0.6pF (0R6)
L
N
S
S
S
A, B, C
0.7pF (0R7)
L
N
S
S
S
A, B, C
0.8pF (0R8)
L
N
S
S
S
A, B, C
0.9pF (0R9)
L
N
S
S
S
A, B, C
1.0pF (1R0)
L
N
S
S
S
A, B, C
1.2pF (1R2)
L
N
S
S
S
A, B, C
1.5pF (1R5)
L
N
S
S
S
A, B, C
1.8pF (1R8)
L
N
S
S
S
A, B, C
Capacitance
2.2pF (2R2)
L
N
S
S
S
A, B, C
2.7pF (2R7)
L
N
S
S
S
A, B, C
3.3pF (3R3)
L
N
S
S
S
A, B, C
3.9pF (3R9)
L
N
S
S
S
A, B, C
4.7pF (4R7)
L
N
S
S
S
A, B, C
5.6pF (5R6)
L
N
S
S
S
B, C, D
6.8pF (6R8)
L
N
S
S
S
B, C, D
8.2pF (8R2)
L
N
S
S
S
B, C, D
10pF (100)
L
N
S
S
S
F, G, J
12pF (120)
L
N
S
S
S
F, G, J
15pF (150)
L
N
S
S
S
F, G, J
18pF (180)
L
N
S
S
S
F, G, J
22pF (220)
N
S
S
S
F, G, J
27pF (270)
S
S
S
F, G, J
33pF (330)
S
S
S
F, G, J
39pF (390)
S
S
S
F, G, J
47pF (470)
S
S
S
F, G, J
1. The letter in cell is expressed the symbol of product thickness.
2. For more information about products with special capacitance or other data, please contact WTC local representative.
8. PACKAGING DIMENSION AND QUANTITY
Size
Thickness (mm)/Symbol
Paper tape
7” reel
13” reel
0201 (0603)
0.30±0.03
L
15k
-
0402 (1005)
0.50±0.05
N
10k
50k
0603 (1608)
0.80±0.07
S
4K
10K
Unit: pieces
Calchip Electronics, INC.
59 Steamwhistle Drive, Ivyland, PA. 18974
www.calchipelectronics.com
ph 215-942-8900 fx 215-942-6400
MULTILAYER CERAMIC CAPACITORS
Ultra High Q & Low ESR Series (GUQ)
9. ELECTRICAL CHARACTERISTICS
0402, NPO, 50V
1
1pF
1.5pF
RF15, NP0, 50V
ESR ( )
3.3pF
0.1
6.8pF
0.01
100
1,000
Frequency (MHz)
10,000
Fig. 2 ESR vs. Frequency
0402, NPO, 50V
10000
RF15, NP0, 50V
1000
1pF
100
Q
1.5pF
6.8pF
10
1
100
1,000
Frequency (MHz)
10,000
Fig. 3 Q vs. Frequency
0402, NPO, 50V
100000
RF15, NP0, 50V
10000
1000
IZI ( )
1pF
100
1.5pF
3.3pF
10
6.8pF
1
1
10
100
Frequency (MHz)
1,000
10,000
Fig. 4 Impedance vs. Frequency
Calchip Electronics, INC.
59 Steamwhistle Drive, Ivyland, PA. 18974
www.calchipelectronics.com
ph 215-942-8900 fx 215-942-6400
MULTILAYER CERAMIC CAPACITORS
Ultra High Q & Low ESR Series (GUQ)
10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item
Visual and
Mechanical
---
Test Conditions
* No remarkable defect.
Requirements
* Dimensions to conform to individual specification sheet.
1.
2.
3.
Capacitance
1.0±0.2Vrms, 1MHz±10%
At 25°C ambient temperature.
* Shall not exceed the limits given in the detailed spec.
Q/ D.F.
(Dissipation
Factor)
* 0201 & 0402 sizes: Q≥400+20C
* 0603 size: Cap<30pF, Q≥800+20C; Cap≥30pF, Q≥1400
4.
Dielectric
Strength
* To apply voltage:
≤100V, ≥250% of rated voltage.
200V, ≥200% of rated voltage.
* Duration: 1 to 5 sec.
* Charge and discharge current less than 50mA.
* No evidence of damage or flash over during test.
5.
Insulation
Resistance
To apply rated voltage for max. 120 sec.
≥10G
6.
Temperature
Coefficient
With no electrical load.
Operating temperature: -55~125°C at 25°C
* Capacitance change: within ±30ppm/°C
7.
Adhesive
Strength of
Termination
* Pressurizing force:
0201: 2N
0402 & 0603: 5N
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8.
Vibration
Resistance
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
Solderability
* Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
95% min. coverage of all metalized area.
10.
Bending Test
* The middle part of substrate shall be pressurized by means * No remarkable damage.
of the pressurizing rod at a rate of about 1 mm per second
until the deflection becomes 1 mm and then the pressure
shall be maintained for 5±1 sec.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured
before the test.)
11.
Resistance to
* Solder temperature: 270±5°C
* No remarkable damage.
* Cap change: within ±2.5% or ±0.25pF whichever is larger.
Soldering Heat
* Dipping time: 10±1 sec
capacitor in a eutectic solder.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* Preheating: 120 to 150°C for 1 minute before immerse the * Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
12.
Temperature
Cycle
* Conduct the five cycles according to the temperatures and
*
No remarkable damage.
time.
*
Cap change:within ±2.5% or ±0.25pF whichever is larger.
Temp. (°C)
Step
Time (min.)
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
1
Min. operating temp. +0/-3
30±3
2
Room temp.
2~3
3
Max. operating temp. +3/-0
30±3
4
Room temp.
2~3
* Measurement to be made after keeping at room temp. for
24±2 hrs.
Calchip Electronics, INC.
59 Steamwhistle Drive, Ivyland, PA. 18974
www.calchipelectronics.com
ph 215-942-8900 fx 215-942-6400
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