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Surface Mount QSOP

Resistor Networks

QSOP Series

•

Reliable, no internal cavity

•

High resistor density - .025” lead spacing

•

Standard JEDEC 16, 20, and 24 pin packages

•

Ultra-stable TaNSil

resistors on silicon substrates

•

Standard Sn/Pb and Pb-free terminations available

IRC Advanced Film Division

IRC’s TaNSil

QSOP resistor networks are the perfect solution for high volume applications that demand a

small wiring board footprint. The .025” lead spacing provides higher lead density, increased component count,

lower resistor cost, and high reliability.

The tantalum nitride ﬁlm system on silicon provides precision tolerance, exceptional TCR tracking, low cost

and miniature package. Excellent performance in harsh, humid environments is a trademark of IRC’s self-pas-

sivating TaNSil

resistor ﬁlm.

The QSOP series is ideally suited for the latest surface mount assembly techniques and each lead can be

100% visually inspected. The compliant gull wing leads relieve thermal expansion and contraction stresses

created by soldering and temperature excursions.

For applications requiring high performance resistor networks in a low cost, surface mount package, specify

IRC QSOP resistor networks.

Electrical Data

Resistance Range

Absolute Tolerance

Ratio Tolerance to R1

Absolute TCR

Tracking TCR

Element Power Rating @ 70°C

Isolated Schematic

Bussed Schematic

Package Power Rating @ 70°C

−

250KΩ

To ±0.1%

To ±0.05%

To ±25ppm/°C

To ±5ppm/°C

100mW

50mW

16-Pin

20-Pin

24-Pin

750mW

1.0W

Environmental Data

Test Per

MIL-PRF-83401

Thermal Shock

Power

Conditioning

High Temperature

Exposure

Short-time

Overload

Low Temperature

Storage

Life

Typical

Delta R

±0.02%

±0.03%

±0.02%

±0.03%

±0.05%

Max

Delta R

±0.1%

±0.05%

±0.1%

Rated Operating Voltage

________________

Operating Temperature

Noise

(not to exceed

√

Power X Resistance)

100 Volts

-55°C to +125°C

<-30dB

General Note

IRC reserves the right to make changes in product specification without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

• Corpus Christi Texas 78411 USA

A subsidiary of

TT electronics plc

QSOP Series Issue February 2005

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com

Surface Mount QSOP

Resistor Networks

Manufacturing Capability Data

ISOLATED SCHEMATIC A

Absolute

TCR

(ppm/°C)

Ohmic

Range

(Ω)

Ω

10 - 25

26 - 50

51 - 200

250

201 - 250K

BCDFGJ

ABCDFG

101 - 200

201 - 500

501 - 100K

26 - 50

51 - 200

100

201 - 250K

DFGJ

CDFGJ

BCDFGJ

CDFG

ABFG

26 - 50

51 - 100

101 - 200

201 - 500

501 - 100K

26 - 50

51 - 200

201 - 250K

BCDFGJ

ABFG

201 - 500

501 - 100K

51 - 200

201 - 250K

BCDFGJ

ABFG

501 - 100K

CDFGJ

CDFG

201 - 500

DFGJ

CDFGJ

CDFG

51 - 100

101 - 200

Available

Ratio

Tolerances

CDFG

Best TCR

Tracking

(±ppm/°C)

Ohmic

Range

(Ω)

Ω

10 - 25

26 - 50

51 - 100

IRC Advanced Film Division

BUSSED SCHEMATIC B

Available

Ratio

Tolerances

DFG

CDFG

BCDFG

ABCDFG

DFG

CDFG

BCDFG

ABCDFG

CDFG

BCDFG

ABCDFG

BCDFG

ABCDFG

Best TCR

Tracking

(ppm/°C)

200

100

Available

Tolerances

FGJ

DFGJ

CDFGJ

Available

Tolerances

FGJ

DFGJ

BCDFGJ

FGJ

DFGJ

BCDFGJ

DFGJ

BCDFGJ

• Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com

QSOP Series Issue February 2005

Surface Mount QSOP

Resistor Networks

Physical Data

IRC Advanced Film Division

0.154" ±.003"

0.236" ±.008"

Schematic A

Isolated

0.025" Typ

Schematic B

Bussed

0.064" ±.003"

0.010" ±.002"

0.006" ±.002"

Note: N = number of pins (16, 20, 24)

# OF PINS

DIMENSION "L"

0.193" ±0.004"

0.341" ±0.004"

Note: All dimesions exclude mold ﬂash and

end ﬂash which shall not exceed 0.006” per side.

Power Derating Data

100

Ordering Data

Preﬁx

Style

QS8 = 16-pin Network

QS0 = 20-pin Network

QSC = 24-pin Network

GUS - QS8

A - 01 - 1002 - F

% Of Rated Power

Schematic and Termination

A = Isolated network w/ standard Sn/Pb terminations

ALF= Isolated network w/ Pb-free terminations

B = Bussed network w/ standard Sn/Pb terminations

BLF= Bussed network w/ Pb-free terminations

Absolute TCR Code

25°

70°

125°

00 = ±250ppm/°C; 01 = ±100ppm/°C

02 = ±50ppm/°C; 03 = ±25ppm/°C

Resistance Code

4-Digit Resistance Code

Ex: 1002 = 10KΩ, 50R1 = 50.1Ω

Temperature in °C

Absolute Tolerance Code

J = ±5%; G = ±2%; F = ±1%; D = ±0.5%

C = ±0.25%; B = ±0.1%

Ratio Tolerance Code (optional)

G = ±2%; F = ±1%; D = ±0.5%;

C = ±0.25%; B = ±0.1%; A = ±0.05%

Packaging

Specify tubes or tape & reel.

For additional information or to discuss your specific requirements,

please contact our Applications Team using the contact details below.

• Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com

QSOP Series Issue February 2005

International Resistive Company

Advanced Film Division

4222 South Staples Street

Corpus Christi, Texas 78411, USA

Lead Free Certification & RoHS Compliance

Rev: 10-Apr-2006

Telephone: +1(361)992-7900

Facsimile: +1(361)992-3377

Email:

ircafd@irctt.com

Website: www.irctt.com

Information Matrix by Family

LR / LRF

CURRENT

SENSE

RESISTORS

LR2512LF-

LRF2512LF-

LR2010LF-

LRF2010LF-

LR1206LF-

LRF1206LF-

SC3-LRF 3W

CURRENT

SENSE /

POWER

RESISTORS

PFC THIN

FILM CHIP

RESISTORS

PFC-W0603LF-

PFC-W0805LF-

PFC-W1206LF-

PFC-D1206LF-

PWC THICK

WCR THICK FILM PULSE

FILM CHIP

CHIP

RESISTORS

RESISTOR

WCR0402LF-

WCR0603LF-

WCR0805LF-

WCR1206LF-

WCR1210LF-

WCR2010LF-

WCR2512LF-

PWC0805LF-

PWC1206LF-

PWC2010LF-

PWC2512LF-

WCA - WCC

THICK FILM

CHIP ARRAY

PRECISION

CHIP

RESISTORS-

NICHROME

PCF-W0402LF-

PCF-W0603LF-

PCF-W0805LF-

PCF-W1206LF-

PCF-W1210LF-

SOIC SILICON

RESISTOR

NETWORKS

(SOIC)

SS4ALF- SS4BLF-

SS7ALF- SS7BLF-

SS8ALF- SS8BLF-

SL8ALF- SL8BLF-

SL0ALF- SL0BLF-

QSOP SILICON

RESISTOR

NETWORKS

TSSSOP

SILICON

RESISTOR

NETWORKS

SOT23 &

SOT143

SILICON

RESISTOR

NETWORKS

WIRE-

BONDABLE

CHIP

RESISTORS

SON CERAMIC

PRECISION

R-NETS

NS4ALB- NS4BLF-

NS7ALF- NS7BLF-

NS8ALF- NS8BLF-

N959LF- N954LF-

N989LF- N987LF-

N999LF- N998LF-

SIP-DIP-FLAT PACK

CERAMIC

R-NETS

4769LF- 4761LF- 4789LF-

4781LF- 4709LF- 4701LF-

1989LF- 1987LF- 1999LF-

1998LF- 8989LF- 8987LF-

8999LF- 8998LF-

New Part Numbers for Lead Free Components

SC3LF-

LRF3WLF-

WCA0804LF-

WCC0804LF-

QS8ALF- QS8BLF-

QS0ALF- QS0BLF-

QSCALF- QSCBLF-

TS8ALF- TS8BLF-

TS0ALF- TS0BLF-

TSCALF- TSCBLF-

SOT23LF-

SOT143LF-

R0202-

T0303-

TIMELINE

Scheduled Transition Date Code (YYWW) (Date that

manufacturing will shift to lead free.)

0501

0432

0501

TBD (Note 1)

Matte tin over

copper alloy

TBD

Yes

0501

TBD (Note 1)

Matte tin over

copper alloy

TBD

Yes

0501

TBD (Note 1)

Matte tin over

copper alloy

TBD

Yes

0501

TBD (Note 1)

Matte tin over

copper alloy

TBD

Yes

always lead

free

always lead

free

Aluminum

TBD

N/A

Yes

0501

None planned

(Note 2)

Matte tin over

nickel

260°C

Yes

NONE

PLANNED

Discontinuation Date Code For Tin-Lead Finish (YYWW) None Planned

None planned

None Planned

TBD (Note 1)

0432

0501

(Date after which no tin-lead will be manufactured.)

(Note 2)

Lead-Free finish Matte tin over Matte tin over Matte tin over Matte tin over Matte tin over Matte tin over

nickel

REFLOW CONDITIONS

Peak Reflow Temperature (°C)

MSL in accordance with J-STD 020C

COMPONENT AND PACKAGE MARKING

Component Marking (Pb Free Indicator)

Packaging Marking (Pb Free Indicator on reel, tube, etc.)

RoHS Compliance including DIRECTIVE 2002/95/EC OF

THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of

27 January 2003 and DIRECTIVE 2003/11/EC OF THE

EUROPEAN PARLIAMENT AND OF THE COUNCIL of 6

February 2003

260°C

Yes

260°C

Yes

260°C

Yes

260°C

Yes

260°C

Yes

260°C

Yes

TBD

Matte tin over

nickel

260°C

Yes

None planned (Note 2)

Gold over nickel or

HSD with SAC alloy

260°C

Yes

RESTRICTED SUBSTANCES

Reference: EIA/EICTA/GPSSI JOINT INDUSTRY GUIDE-

MATERIAL COMPOSITION DECLARATION GUIDE (DRAFT

XX-XXXX, September 19, 2003)

LEVEL-A

LEVEL-B

IMDS REPORTABLE SUBSTANCES

Reference: IMDS International list of reportable

substances

IMDS (short)

none

lead

(Note 3)

none

lead

(Note 3)

none

lead

(Note 3)

none

nickel

bismuth

nickel

antimony

nickel

bismuth

antimony

nickel

SL = Antimony

none

nickel

Note 1- If a planned phaseout of tin-lead terminations is required, a PCN will be posted providing at least 6 months of notification.

Note 2- Tin-lead terminations will not be phased out unless a suitable replacement is approved by DSCC.

Note 3- Lead is in thick film glass and permitted under RoHS Directive, exemption 5.

QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls