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器件参数

参数名称

属性值

厂商名称

Hughes Aircraft

包装说明

Reach Compliance Code

unknown

ECCN代码

EAR99

最长访问时间

1375 ns

JESD-30 代码

R-GDIP-T24

内存密度

32768 bit

内存集成电路类型

MASK ROM

内存宽度

功能数量

端子数量

字数

4096 words

字数代码

4000

工作模式

ASYNCHRONOUS

最高工作温度

125 °C

最低工作温度

-55 °C

组织

4KX8

封装主体材料

CERAMIC, GLASS-SEALED

封装形状

RECTANGULAR

封装形式

IN-LINE

并行/串行

PARALLEL

认证状态

Not Qualified

最大供电电压 (Vsup)

6.5 V

最小供电电压 (Vsup)

4 V

标称供电电压 (Vsup)

5 V

表面贴装

技术

CMOS

温度等级

MILITARY

端子形式

THROUGH-HOLE

端子位置

DUAL

Base Number Matches

参数对比

与HB1837C-Y-000相近的元器件有：HI1837C-L-000、HB1837C-D-000、HI1837C-D-000、HI1837C-H-000、HI1837C-P-000、HB1837C-L-000、HI1837C-Y-000、HB1837C-H-000。描述及对比如下：

型号	HB1837C-Y-000	HI1837C-L-000	HB1837C-D-000	HI1837C-D-000	HI1837C-H-000	HI1837C-P-000	HB1837C-L-000	HI1837C-Y-000	HB1837C-H-000
描述	MASK ROM, 4KX8, 1375ns, CMOS, CDIP24	MASK ROM, 4KX8, 1375ns, CMOS, CQCC24	MASK ROM, 4KX8, 1375ns, CMOS, CDIP24	MASK ROM, 4KX8, 1375ns, CMOS, CDIP24	MASK ROM, 4KX8, 1375ns, CMOS	MASK ROM, 4KX8, 1375ns, CMOS, PDIP24	MASK ROM, 4KX8, 1375ns, CMOS, CQCC24	MASK ROM, 4KX8, 1375ns, CMOS, CDIP24	MASK ROM, 4KX8, 1375ns, CMOS
厂商名称	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	1375 ns	1375 ns	1375 ns	1375 ns	1375 ns	1375 ns	1375 ns	1375 ns	1375 ns
JESD-30 代码	R-GDIP-T24	S-CQCC-N24	R-CDIP-T24	R-CDIP-T24	X-XUUC-N24	R-PDIP-T24	S-CQCC-N24	R-GDIP-T24	X-XUUC-N24
内存密度	32768 bit	32768 bit	32768 bit	32768 bit	32768 bit	32768 bit	32768 bit	32768 bit	32768 bi
内存集成电路类型	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
内存宽度	8	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1	1
端子数量	24	24	24	24	24	24	24	24	24
字数	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words
字数代码	4000	4000	4000	4000	4000	4000	4000	4000	4000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	85 °C	125 °C	85 °C	85 °C	85 °C	125 °C	85 °C	125 °C
最低工作温度	-55 °C	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C	-55 °C	-40 °C	-55 °C
组织	4KX8	4KX8	4KX8	4KX8	4KX8	4KX8	4KX8	4KX8	4KX8
封装主体材料	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	UNSPECIFIED
封装形状	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	UNSPECIFIED	RECTANGULAR	SQUARE	RECTANGULAR	UNSPECIFIED
封装形式	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	UNCASED CHIP	IN-LINE	CHIP CARRIER	IN-LINE	UNCASED CHIP
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V
最小供电电压 (Vsup)	4 V	4 V	4 V	4 V	4 V	4 V	4 V	4 V	4 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	YES	NO	NO	YES	NO	YES	NO	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL	MILITARY
端子形式	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD
端子位置	DUAL	QUAD	DUAL	DUAL	UPPER	DUAL	QUAD	DUAL	UPPER