Fast Page DRAM Module, 8MX32, 70ns, CMOS, SODIMM-72
厂商名称:Hitachi (Renesas )
厂商官网:http://www.renesas.com/eng/
下载文档型号 | HB56RW832DZJ-7L | HB56RW832DZJ-6L | HB56RW832DZJ-6LS | HB56RW832DZJ-7LS | HB56RW832DZJ-7 | HB56RW832DZJ-6 |
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描述 | Fast Page DRAM Module, 8MX32, 70ns, CMOS, SODIMM-72 | Fast Page DRAM Module, 8MX32, 60ns, CMOS, SODIMM-72 | Fast Page DRAM Module, 8MX32, 60ns, CMOS, SODIMM-72 | Fast Page DRAM Module, 8MX32, 70ns, CMOS, SODIMM-72 | Fast Page DRAM Module, 8MX32, 70ns, CMOS, SODIMM-72 | Fast Page DRAM Module, 8MX32, 60ns, CMOS, SODIMM-72 |
厂商名称 | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
零件包装代码 | SODIMM | SODIMM | SODIMM | SODIMM | SODIMM | SODIMM |
包装说明 | DIMM, DIMM72 | DIMM, DIMM72 | DIMM, DIMM72 | DIMM, DIMM72 | DIMM, DIMM72 | DIMM, DIMM72 |
针数 | 72 | 72 | 72 | 72 | 72 | 72 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
最长访问时间 | 70 ns | 60 ns | 60 ns | 70 ns | 70 ns | 60 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XZMA-N72 | R-XZMA-N72 | R-XZMA-N72 | R-XZMA-N72 | R-XZMA-N72 | R-XZMA-N72 |
内存密度 | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit |
内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 72 | 72 | 72 | 72 | 72 | 72 |
字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
封装等效代码 | DIMM72 | DIMM72 | DIMM72 | DIMM72 | DIMM72 | DIMM72 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 |
座面最大高度 | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm |
自我刷新 | NO | NO | YES | YES | NO | NO |
最大待机电流 | 0.0024 A | 0.0024 A | 0.0024 A | 0.0024 A | 0.016 A | 0.016 A |
最大压摆率 | 0.68 mA | 0.76 mA | 0.76 mA | 0.68 mA | 0.68 mA | 0.76 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |