Agilent HBAT-5400, 5402,
540B, 540C, 540E, 540F
High Performance Schottky Diode
for Transient Suppression
Data Sheet
Features
• Ultra-low Series Resistance
for Higher Current Handling
• Low Capacitance
• Low Series Resistance
Description
The HBAT-5400 series of Schottky
diodes, commonly referred to as
clipping /clamping diodes, are
optimal for circuit and waveshape
preservation applications with
high speed switching. Low series
resistance, R
S
, makes them ideal
for protecting sensitive circuit
elements against high current
transients carried on data lines.
With picosecond switching, the
HBAT-540x can respond to noise
spikes with rise times as fast as
1 ns. Low capacitance minimizes
waveshape loss that causes signal
degradation.
Package Lead Code
Identification
(Top View)
SINGLE
3
SERIES
3
• Lead-free Option Available
Applications
RF and computer designs that
require circuit protection, high-
speed switching, and voltage
clamping.
2
1
0, B
2
1
2, C
COMMON
ANODE
3
COMMON
CATHODE
3
1
E
2
1
F
2
2
Absolute Maximum Ratings, T
A
= 25ºC
Symbol
I
F
I
F- peak
P
T
P
INV
T
J
T
STG
θ
JC
Parameter
DC Forward Current
Peak Surge Current (1µs pulse)
Total Power Dissipation
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance, junction to lead
Unit
mA
A
mW
V
°C
°C
°C/W
Absolute Maximum
[1]
HBAT-5400/-5402
220
1.0
250
30
150
-65 to 150
500
HBAT-540B/-540C
430
1.0
825
30
150
-65 to 150
150
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
Linear and Non-linear SPICE Model
[2]
0.08 pF
SPICE Parameters
Parameter
BV
CJO
EG
IBV
IS
N
RS
PB
PT
M
Unit
V
pF
eV
A
A
Ω
V
Value
40
3.0
0.55
10E-4
1.0E-7
1.0
2.4
0.6
2
0.5
2 nH
R
S
SPICE model
Note:
2. To effectively model the packaged HBAT-540x
product, please refer to Application Note AN1124.
HBAT-540x DC Electrical Specifications, T
A
= +25°C
[1]
Part
Package
Number Marking Lead
HBAT- Code
[2]
Code Configuration
-5400
V0
-540B
-5402
V2
-540C
-540E
-540F
V3
V4
C
E
F
Common
Anode
Common
Cathode
B
2
Series
0
Single
Maximum Minimum
Typical
Maximum
Forward Breakdown
Typical
Series
Eff. Carrier
Voltage
Voltage Capacitance Resistance Lifetime
V
F
(mV)
V
BR
(V)
C
T
(pF)
R
S
(Ω)
τ
(ps)
Package
SOT-23
SOT-323
(3-lead SC-70)
SOT-23
SOT-323
(3-lead SC-70)
SOT-323
(3-lead SC-70)
SOT-323
(3-lead SC-70)
800
[3]
30
[4]
3.0
[5]
2.4
100
[6]
Notes:
1. T
A
= +25°C, where T
A
is defined to be the temperature at the package pins where contact is made to the circuit board.
2. Package marking code is laser marked.
3. I
F
= 100 mA; 100% tested
4. I
F
= 100
µA;
100% tested
5. V
F
= 0; f =1 MHz
6. Measured with Karkauer method at 20 mA guaranteed by design.
3
Typical Performance
I
F
– FORWARD CURRENT (mA)
I
F
– FORWARD CURRENT (mA)
100
T
J
– JUNCTION TEMPERATURE (°C)
300
500
100
160
Max. safe junction temp.
140
120
100
80
60
40
20
0
0
50
100
T
A
= +75°C
T
A
= +25°C
T
A
= –25°C
150
200
250
I
F
– FORWARD CURRENT (mA)
10
10
1
1
0.1
0.01
0
0.1
0.2
0.3
T
A
= +75°C
T
A
= +25°C
T
A
= –25°C
0.4
0.5
0.6
V
F
– FORWARD VOLTAGE (V)
0.1
0.01
0
0.2
0.4
0.6
T
A
= +75°C
T
A
= +25°C
T
A
= –25°C
0.8
1.0
1.2
1.4
I
F
– FORWARD CURRENT (mA)
Figure 1. Forward Current vs.
Forward Voltage at Temperature for
HBAT-5400 and HBAT-5402.
Figure 2. Forward Current vs.
Forward Voltage at Temperature for
HBAT-540B, -540C, -540E, and -540F.
Figure 3. Junction Temperature vs.
Current as a Function of Heat Sink
Temperature for HBAT-5400 and
HBAT-5402.
Note: Data is calculated
from SPICE parameters.
T
j
– JUNCTION TEMPERATURE (°C)
160
Max. safe junction temp.
140
120
100
80
60
40
20
0
0
100
200
300
T
A
= +75°C
T
A
= +25°C
T
A
= –25°C
400
500
600
I
F
– FORWARD CURRENT (mA)
3.0
C
T
– TOTAL CAPACITANCE (pF)
2.5
2.0
1.5
1.0
0
5
10
15
20
V
R
– REVERSE VOLTAGE (V)
Figure 4. Junction Temperature vs.
Current as a Function of Heat Sink
Temperature for HBAT-540B, -540C,
-540E, and -540F.
Note: Data is calculated from SPICE
parameters.
Figure 5. Total Capacitance vs.
Reverse Voltage.
Device Orientation
For Outlines SOT-23/323
REEL
TOP VIEW
4 mm
END VIEW
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
8 mm
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
4
Package Dimensions
Outline SOT-23
e2
Recommended PCB Pad Layout
for Agilent’s SOT-23 Products
0.039
1
e1
0.039
1
E
XXX
e
E1
0.079
2.0
L
B
C
DIMENSIONS (mm)
SYMBOL
A
A1
B
C
D
E1
e
e1
e2
E
L
MIN.
0.79
0.000
0.37
0.086
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.152
3.13
1.50
1.02
2.04
0.60
2.70
0.69
D
0.035
0.9
0.031
0.8
Dimensions in inches
mm
A
A1
Notes:
XXX-package marking
Drawings are not to scale
Tape Dimensions and Product Orientation
For Outline SOT-23
P
D
P
2
E
P
0
F
W
t1
D
1
9° MAX
Ko
8° MAX
13.5° MAX
A
0
B
0
DESCRIPTION
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
SYMBOL
A
0
B
0
K
0
P
D
1
D
P
0
E
W
t1
F
P
2
SIZE (mm)
3.15
±
0.10
2.77
±
0.10
1.22
±
0.10
4.00
±
0.10
1.00 + 0.05
1.50 + 0.10
4.00
±
0.10
1.75
±
0.10
8.00 +0.30 –0.10
0.229
±
0.013
3.50
±
0.05
2.00
±
0.05
SIZE (INCHES)
0.124
±
0.004
0.109
±
0.004
0.048
±
0.004
0.157
±
0.004
0.039
±
0.002
0.059 + 0.004
0.157
±
0.004
0.069
±
0.004
0.315 +0.012 –0.004
0.009
±
0.0005
0.138
±
0.002
0.079
±
0.002
PERFORATION
CARRIER TAPE
DISTANCE
BETWEEN
CENTERLINE
5
Package Dimensions
Outline SOT-323 (SC-70 3 Lead)
e1
Recommended PCB Pad Layout
for Agilent’s SC70 3L/SOT-323
Products
0.026
E
XXX
e
E1
L
B
D
SYMBOL
A
A1
B
C
D
E1
e
e1
E
L
0.079
C
0.039
DIMENSIONS (mm)
MIN.
MAX.
0.80
1.00
0.00
0.10
0.15
0.40
0.10
0.20
1.80
2.25
1.10
1.40
0.65 typical
1.30 typical
1.80
2.40
0.425 typical
A
0.022
Dimensions in inches
A1
Notes:
XXX-package marking
Drawings are not to scale
Tape Dimensions and Product Orientation
For Outline SOT-323 (SC-70 3 Lead)
P
P
0
D
P
2
E
F
W
C
D
1
t
1
(CARRIER TAPE THICKNESS)
T
t
(COVER TAPE THICKNESS)
8° MAX.
K
0
8° MAX.
A
0
B
0
DESCRIPTION
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
WIDTH
TAPE THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
SYMBOL
A
0
B
0
K
0
P
D
1
D
P
0
E
W
t
1
C
T
t
F
P
2
SIZE (mm)
2.40
±
0.10
2.40
±
0.10
1.20
±
0.10
4.00
±
0.10
1.00 + 0.25
1.55
±
0.05
4.00
±
0.10
1.75
±
0.10
8.00
±
0.30
0.254
±
0.02
5.4
±
0.10
0.062
±
0.001
3.50
±
0.05
2.00
±
0.05
SIZE (INCHES)
0.094
±
0.004
0.094
±
0.004
0.047
±
0.004
0.157
±
0.004
0.039 + 0.010
0.061
±
0.002
0.157
±
0.004
0.069
±
0.004
0.315
±
0.012
0.0100
±
0.0008
0.205
±
0.004
0.0025
±
0.00004
0.138
±
0.002
0.079
±
0.002
PERFORATION
CARRIER TAPE
COVER TAPE
DISTANCE
微控制器 MCU
