1. OCL (Open Circuit Inductance) Test parameters: 300kHz, .25V
rms
, 0.0Adc & I
sat
.
2. I
rms
Amps for approximately
ΔT
of 40°C. DC current for an approximate
ΔT
of 40°C without
core loss. Derating is necessary for AC currents. It is recommended that the temperature of the part
not exceed 125°C under worst case operating conditions verified in the end application.
3. I
sat
Amps Peak for approximately 30% rolloff @ 20°C.
4. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 200kHz
necessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise.
See Core Loss Graph.
5. Part number definition - HC1-xxx-R:
HC1 = Product code and size
-xxx = Inductance value
R = Decimal point (if no “R” is present, last character equals number of zeros )
-R Suffix = RoHS compliant
Dimensions–mm
Top View
Side View
Front View
Recommended Pad Layout
(Componenet Side)
4.5
4.5
Schematic
1
13.0
Max.
4.9 Typ.
1
2
10.0
Max.
10.0
2
14.5
xxx = Inductance value
wwllyy = Date code R = Revision level
13.0
Max.
2.2
Typ.
Packaging information (mm)
Supplied in tape and reel packaging, 250 parts per reel, 13” diameter reel.
4.0
1.5 dia
+0.1/-0.0
2.0
1.5 dia
min
A
1.7
1
11.5
wwllyyR
HC1-XXX
13.4
24.0
+/-0.3
2
10.3
2.0
20.0
13.4
A
SECTION A-A
User direction of feed
2
www.eaton.com/elx
HC1
High current inductor
Core loss
Technical Data
4328
Effective October 2015
I
rms
Derating With Core Loss
0
20
40
50
60
% of Losses from I
rms
(maximum)
70
80
400
k
300
Hz
kH
z
200
kH
z
Hz
100
k
90
92
94
95
96
97
98
99
50
k
Hz
300
10
20
30
40
50
60
70
80 90
100
200
400
500
600
800
1000
% of Applied Volt- -Seconds
www.eaton.com/elx
3
Technical Data
4328
Effective October 2015
HC1
High current inductor
Inductance characteristics
HC1 Inductor (R87)
100
HC1 Inductor (R22, 7R8)
100
90
90
OCL (%)
70
OCL (%)
0
10
20
30
40
50
60
70
80
90
100
110
120
80
80
70
60
60
50
50
0
10
20
30
40
50
60
70
80
90
100
110
120
% of I
sat
% of I
sat
HC1 Inductor (R57, 2R3, 3R6, 5R1)
HC1 Inductor (1R7)
100
100
90
90
OCL (%)
70
OCL (%)
0
10
20
30
40
50
60
70
80
90
100
110
120
80
80
70
60
60
50
50
0
10
20
30
40
50
60
70
80
90
100
110
120
% of I
sat
HC1 Inductor (R30, 100)
100
% of I
sat
HC1 Inductor (1R0)
100
90
90
OCL (%)
OCL (%)
80
80
70
70
60
60
50
0
10
20
30
40
50
60
70
80
90
100
110
120
50
0
10
20
30
40
50
60
70
80
90
100
110
120
% of I
sat
% of I
sat
4
www.eaton.com/elx
HC1
High current inductor
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Technical Data
4328
Effective October 2015
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
主题：自备终端(BYOD)发展趋势;用员工自己的移动设备来控制对工作设施及设备的使用，会对信息安全产生怎样的影响;在不使公司有安全风险或不损害员工隐私的前提下，有哪些方式能安全地实现这样的设施及设备使用。 自备终端(Bring Your Own Device，简称BYOD)，即企业允许员工离职时保留自己的手机，这种做法正日益流行。如今智能手机功能也越来越多，我们不仅能用自己的手机访问电脑、网...[详细]
微控制器 MCU
