of 40°C without core loss De-rating is necessary for AC currents.
PCB layout, trace thickness and width, air flow and proximity of other heat generating components
will affect temperature rise. It is recommended that the temperature of the part not exceed 125°C
under worst case conditions verified in the end application.
3. Peak current for approximately 30% rolloff (@20°C).
4. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 300kHz
necessary to generate a core loss equal to 10% of the total losses for a 40°C temperature rise.
5. Part number definition - HC3-xxx-R:
HC3 = Product code and size
-xxx = Inductance value R = Decimal point (if no “R” is present, last character equals number of zeros )
-R Suffix = RoHS compliant
Dimensions–mm
TOP VIEW
14.5 typ
1
22.0
RECOMMENDED
PCB PAD LAYOUT
FRONT VIEW
SCHEMATIC
30.0 max
HC3-xxx
wwllyy R
5.50
19.0
5.50
4.0 typ
HT max
2
3.0 typ
25.3 max
Part number
Height max
HC3-R50-R
18.0
17.5
17.5
17.5
17.5
17.5
17.5
Part marking: HC3-xxx (-xxx= inductance value, R= decimal point,
if no R is present then last character equals number of zeros)
wwllyy= date code, R= Revision level
HC3-1R0-R
HC3-2R2-R
HC3-3R3-R
HC3-4R7-R
HC3-5R6-R
HC3-6R0-R
2
www.eaton.com/electronics
HC3
High current power inductors
Inductance characteristics
OCL vs Isat
100
90
80
70
Technical Data
4122
Effective February 2017
% of OCL
60
50
40
30
20
10
0
0
10
20
30
40
50
60
70
80
90
100
110
120
130
% of Isat
Core loss
Irms DERATING W ITH CO RE LOSS for HC3
% Applied Volt-u Seconds
10
30
30
50
70
90
110
130
150
170
190
%of Irms specified from
zero ripple application
40
50
60
70
80
90
100
100kHz
200kHz
300kHz
400kHz
500kHz
www.eaton.com/electronics
3
Technical Data
4122
Effective February 2017
HC3
High current power inductors
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
