2 Lead Metal Package Quartz Crystal, 4.7 mm x 11 mm
Product Features:
Low Cost Package
RoHs Compliant
Compatible with Leadfree Processing
HC49US Series
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
H Max.
12 Min.
Frequency
3.2 MHz to 100.000 MHz
4.88
±0.2
ESR (Equivalent Series Resistance)
3.2 MHz – 3.49 MHz
3.5 MHz – 3.99 MHz
4.0 MHz – 4.99 MHz
5.0 MHz – 5.99 MHz
6.0 MHz – 6.99 MHz
7.0 MHz – 8.9 MHz
9.0 MHz – 12.9 MHz
13 MHz – 19.9 MHz
20 MHz – 36 MHz
rd
27 MHz – 100 MHz (3 O.T.)
Shunt Capacitance (C0)
Frequency Tolerance @ 25
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
Storage
0 C to +70 C Standard (see Part Number Guide for more
options)
-40 C to +85 C Standard
300
200
150
120
100
80
60
40
30
100
Max.
Max.
Max.
Max.
Max.
Max.
Max.
Max.
Max.
Max.
11.1 Max.
7 pF Max.
4.7 Max.
30 ppm Standard (see Part Number Guide for more options)
50 ppm Standard (see Part Number Guide for more options)
AT Cut Standard
18 pF Standard (see Part Number Guide for more options)
1 mW Max.
5 ppm Max. / Year Standard
HC49US, H Max. = 3.5
HC49US2, H Max. = 2.5
HC49US3, H Max. = 2.0
Dimension Units: mm
0.43
±0.03
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
HC49US - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
Load Capacitance
(pF)
Frequency
HC49US -
(3.5 mm H)
HC49US2 -
(2.5 mm H)
18 pF Standard
Or Specify
- 20.000 MHz
HC49US3 -
(2.0 mm H)
* Not available at all frequencies. ** Not available for all temperature ranges.
e-mail@ilsiamerica.com
•
www.ilsiamerica.com
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 1
2 Lead Metal Package Quartz Crystal, 4.7 mm x 11 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
HC49US Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1 ILSI, Frequency, Date Code (yww)
e-mail@ilsiamerica.com
•
www.ilsiamerica.com
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 2
MSPM0 MCU
