2 Pad Metal Package, 4.7 mm x 13.3 mm
Product Features:
Low Cost SMD Package
Low ESR
Compatible with Leadfree Processing
HC49USM Series
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
System Clock
13.3 Max.
11.4
0.2
4.73
0.1
Frequency
ESR (Equivalent Series Resistance)
3.2 MHz – 3.49 MHz
3.5 MHz – 3.99 MHz
4.0 MHz – 4.99 MHz
5.0 MHz – 5.99 MHz
6.0 MHz – 6.99 MHz
7.0 MHz – 8.9 MHz
9.0 MHz – 12.9 MHz
13 MHz – 19.9 MHz
20 MHz – 36 MHz
rd
27 MHz – 100 MHz (3 O.T.)
Shunt Capacitance (C0)
Frequency Tolerance @ 25
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
Storage
3.2 MHz to 100.000 MHz
H Max.
See Part
Number Guide
300
200
150
120
100
80
60
40
30
100
Max.
Max.
Max.
Max.
Max.
Max.
Max.
Max.
Max.
Max.
3.9 Nom.
0.5 Min.
7 pF Max.
30 ppm Standard (see Part Number Guide for more options)
50 ppm Standard (see Part Number Guide for more options)
AT Cut Standard
18 pF Standard (see Part Number Guide for more options)
1 mW Max.
5 ppm Max. / Year Standard
Recommended
Pad Layout
Insulator
0.8
0.2
5.5
1.6
0 C to +70 C Standard (see Part Number Guide for more
options)
-40 C to +85 C Standard
Dimension Units: mm
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm
HC49USM – FB1F18 - 20.000
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
18 pF Standard
or Specify
- 20.000 MHz
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Load Capacitance
(pF)
Frequency
HC49USM -
(4.5 mm H)
HC49USM2 -
(3.5 mm H)
HC49USM3 -
(3.1 mm H)
e-mail@ilsiamerica.com
•
www.ilsiamerica.com
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
04/09
Specifications subject to change without notice
Page 1
2 Pad Metal Package, 4.7 mm x 13.3 mm
Pb Free Solder Reflow Profile:
HC49USM Series
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N/A
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
24 +/-.3
12 +/-.2
11.5 +/-.2
25 +/-1.5
80/100
330
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Frequency, Date Code
e-mail@ilsiamerica.com
•
www.ilsiamerica.com
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
04/09
Specifications subject to change without notice
Page 2
微控制器 MCU
