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HCPL-050L#060

Logic IC Output Optocoupler, 1-Element, 3750V Isolation, 1MBps, SO-8

器件类别:光电子/LED    光电   

厂商名称:HP(Keysight)

厂商官网:http://www.semiconductor.agilent.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
HP(Keysight)
包装说明
SO-8
Reach Compliance Code
unknown
其他特性
UL RECOGNIZED, VDE APPROVED, OPEN COLLECTOR
配置
SINGLE
当前传输比率-最小值
15%
标称数据速率
1 MBps
最大正向电流
0.02 A
最大正向电压
1.7 V
最大绝缘电压
3750 V
JESD-609代码
e0
安装特点
SURFACE MOUNT
元件数量
1
最大通态电流
0.008 A
最高工作温度
85 °C
最低工作温度
光电设备类型
LOGIC IC OUTPUT OPTOCOUPLER
最大功率耗散
0.1 W
最小供电电压
2.7 V
表面贴装
YES
端子面层
Tin/Lead (Sn/Pb)
文档预览
AgilentHCPL-250L/050L/253L/053L
LVTTL/LVCMOS Compatible 3.3 V
Optocouplers (1 Mb/s)
Data Sheet
Features
• Low power consumption
• High speed: 1 Mb/s
• LVTTL/LVCMOS compatible
Description
These diode-transistor optocouplers
use an insulating layer between a
LED and an integrated
photodetector to provide electrical
insulation between input and
output. Separate connections for
the photodiode bias and output-
transistor collector increase the
speed up to a hundred times that of
a conventional phototransistor
coupler by reducing the base-
collector capacitance.
These optocouplers are available
in an 8-pin DIP and in an industry
standard SO-8 package. The
following is a cross reference
table listing the 8-pin DIP part
number and the electrically
equivalent SO-8 part number.
The SO-8 does not require
"through holes" in a PCB. This
package occupies approximately
one-third the footprint area of the
• Available in 8-pin DIP, SO-8
• Open collector output
• Guaranteed performance from
temperature: 0˚C to +70˚C
• Safety approval, UL, CSA, IEC/EN/DIN
EN 60747-5-2
Applications
• High voltage insulation
• Video signal isolation
• Power translator isolation in motor
drives
• Line receivers
Functional Diagram
HCPL–250L/HCPL–050L
NC 1
ANODE 2
CATHODE 3
NC 4
8 V
CC
7 V
B
6 V
O
5 GND
HCPL–253L/HCPL–053L
ANODE
1
1
CATHODE
1
2
CATHODE
2
3
ANODE
2
4
8 V
CC
7 V
O1
6 V
O2
5 GND
• Feedback element in switched mode
power supplies
• High speed logic ground isolation –
LVTTL/LVCMOS
• Replaces pulse transformers
• Replaces slow phototransistor
isolators
• Analog signal ground isolation
TRUTH TABLE
(POSITIVE LOGIC)
LED
V
O
LOW
ON
HIGH
OFF
A 0.1
µF
bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent
damage and/or degradation which may be induced by ESD.
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
These optocouplers can be used
in LVTTL/LVCMOS or wide
bandwidth analog applications.
The common mode transient
immunity of 1000 V/µs minimum
to typical at V
CM
= 10 V
guaranteed for these
optocouplers.
8-Pin DIP
HCPL-250L
HCPL-253L
SO-8 Package
HCPL-050L
HCPL-053L
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-250L #XXXX
060 = IEC/EN/DIN EN 60747-5-2 V
IORM
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
Option data sheets available. Contact Agilent sales representative or
authorized distributor for information.
Remarks: The notation “#” is used for existing products, while (new)
products launched since 15th July 2001 and lead free option will use “-”
Schematic
HCPL-250L/HCPL-050L
I
CC
8
HCPL-253L/HCPL-053L
1
V
CC
I
F1
I
CC
8
+
V
F1
V
CC
2
ANODE
+
V
F
CATHODE
3
I
F
I
O1
7
V
O1
I
O
6
2
V
O
SHIELD
I
B
7 *
V
B
5
3
GND
I
F2
I
O2
6
V
O2
V
F2
+
4
GND
5
SHIELD
2
Package Outline Drawings
8-Pin DIP Package
7.62 ± 0.25
(0.300 ± 0.010)
5
6.35 ± 0.25
(0.250 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
OPTION CODE*
DATE CODE
A XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Small Outline SO-8 Package
LAND PATTERN RECOMMENDATION
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXXV
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
7.49 (0.295)
PIN ONE
1
0.406 ± 0.076
(0.016 ± 0.003)
2
3
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
*
5.080 ± 0.127
(0.200 ± 0.005)
45° X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
0.305 MIN.
(0.012)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
3
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
Regulatory Information
The devices contained in this
data sheet have been approved by
the following organizations:
UL
TEMPERATURE (°C)
200
Approval under UL 1577,
Component Recognition
Program, File E55361.
CSA
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
Approval under CSA Component
Acceptance
Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
t
p
T
p
T
L
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
TEMPERATURE
T
smax
T
smin
RAMP-DOWN
6 °C/SEC. MAX.
t
s
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
t
L
60 to 150 SEC.
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
4
Insulation and Safety Related Specifications
8-Pin DIP
(300 Mil)
Value
7.1
7.4
0.08
SO-8
Value
4.9
4.8
0.08
Parameter
Minimum External Air
Gap (External Clearance)
Minimum External Tracking
(External Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Symbol
L (101)
L (102)
Units
mm
mm
mm
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
CTI
200
200
Volts
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
IEC/EN/DIN EN 60747-5-2Insulation Related Characteristics
Description
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
150 V rms
for rated mains voltage
300 V rms
for rated mains voltage
600 V rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
V
IORM
x 1.875 = V
PR
, 100% Production Test
with t
m
= 1 sec, Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5 = V
PR
, Type and Sample Test,
t
m
= 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, t
ini
= 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 16, Thermal Derating curve.)
Case Temperature
Input Current
Output Power
Insulation Resistance at T
S
, V
IO
= 500 V
Symbol
PDIP Option 060
SO-8 Option 60
I-IV
I-III
I-II
55/85/21
2
566
1063
Units
V
IORM
V
PR
I-IV
I-III
55/85/21
2
630
1181
V
peak
V
peak
V
PR
V
IOTM
945
6000
849
4000
V
peak
V
peak
T
S
I
S,INPUT
P
S,OUTPUT
R
S
175
230
600
10
9
150
150
600
10
9
˚C
mA
mW
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a
detailed description.
Note:
Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
5
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