Agilent HCPL-3180 2 Amp Output
Current, High Speed IGBT/MOSFET Gate
Drive Optocoupler
Data Sheet
Features
•
2 A minimum peak output current
•
250 KHz maximum switching
speed
•
High speed response: 200 ns max
Propagation delay over
temperature range
•
10 KV/us minimum common mode
rejection (CMR) at V
CM
=1500 V
•
Under voltage lockout protection
(UVLO) with hysteresis
•
Wide operating temperature
range: -40 °C to +100
°
C
•
Wide V
CC
operating range:
10 V to 20 V
•
20 ns typ pulse width distortion
•
Safety Approvals:
UL approval pending
3750 V
RMS
for 1 minute.
CSA approval
DIN EN 60747-5-2 approval
pending
Applications
•
Plasma Display Panel (PDP)
•
Distributed power architecture
(DPA)
•
Switch mode rectifier (SMR)
•
High performance DC/DC
convertor
•
High performance switch mode
power supply (SMPS)
•
High performance uninterruptible
power supply (UPS)
•
Isolated IGBT/Power MOSFET
gate drive
Description
This family of devices consists of
a GaAsP LED. The LED is
optically coupled to an
integrated circuit with a power
stage. These optocouplers are
ideally suited for high frequency
driving of power IGBT and
MOSFETs used in Plasma
Display Panels, high
performance DC/DC convertors
and motor control invertor
applications.
Ordering Information
Specify part number followed by
option number (if desired):
Example : HCPL-3180-XXX
N/C
ANODE
CATHODE
N/C
1
2
3
4
8
7
6
V
CC
V
O
V
O
5 V
EE
Functional Diagram
No option = Standard DIP
package, 50 per tube.
300 = Gull Wing Surface Mount
Option, 50 per tube.
500 = Tape and Reel Packaging
Option.
060 = DIN EN 60747-5-2 Option,
VIORM=630 Vpeak (pending
approval)
A 0.1 uF bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/
or degradation which may be induced by ESD.
HCPL-3180 Standard DIP Package
HCPL-3180 Gull Wing Surface Mount Option 300
2
Solder Reflow Temperature Profile
300
PREHEATING RATE 3˚C + 1˚C/–0.5˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.
PEAK
TEMP.
245˚C
PEAK
TEMP.
240˚C
200
PEAK
TEMP.
230˚C
TEMPERATURE (˚C)
2.5˚C ± 0.5˚C/SEC.
160˚C
150˚C
140˚C
3˚C + 1˚C/–0.5˚C
30
SEC.
30
SEC.
SOLDERING
TIME
200˚C
100
PREHEATING TIME
150˚C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
TIME (SECONDS)
150
200
250
Regulatory Information
The HCPL-3180 is pending
approval by the following
organizations:
DIN EN 60747-5-2
Pending approval under DIN
EN-60747-5-2 with V
IORM
= 630
V
PEAK
UL
Approval under UL 1577,
component recognition program
up to V
ISO
= 2500 V
RMS.
Pending
3750 V
RMS.
CSA
Approval under CSA
Component.
3
DIN EN 60747-5-2 Insulation Characteristics (HCPL-3180 Option 060)
Description
Installation classification per DIN EN 0110 1997-04
for rated mains voltage 150 Vrms
for rated mains voltage 300 Vrms
for rated mains voltage 600 Vrms
Climatic Classification
Pollution Degree (DIN EN 0110 1997 -04)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
VIORM x 1.875=VPR, 100% Production Test withtm=1 sec, Partial discharge < 5 pC
Input to Output Test Voltage, Method a*
VIORM x 1.5=VPR, Type and Sample Test, tm=60 sec,Partial discharge < 5 pC
Highest Allowable Overvoltage (Transient Overvoltage tini = 10 sec)
Safety-limiting values - maximum values allowed in the event of a failure.
Case Temperature
Input Current**
Output Power**
Insulation Resistance at TS, VIO = 500 V
T
S
I
S, INPUT
P
S, OUTPUT
R
S
175
230
600
>10
9
°C
mA
mW
W
V
IORM
V
PR
V
PR
V
IOTM
I - IV
I - III
I - II
55/100/21
2
630
1181
Vpeak
Vpeak
Symbol
HCPL-3180
Unit
945
Vpeak
6000
Vpeak
*
Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section, (DIN) for a
detailed description of Method A and Method B partial discharge test profiles.
** Refer to the following figure for dependence of P
S
and I
S
on ambient temperature.
S
S,
INPUT CURRENT – I
800
700
600
500
400
300
200
100
0
0
25
50
75 100 125 150 175 200
P
S
(mW)
IS (mA)
OUTPUT POWER – P
T
S
– CASE TEMPERATURE – ˚C
4
Insulation and Safety Related Specifications
Parameter
Minimum External Air Gap (Clearance)
Symbol
L(101)
HCPL-3180 Units
7.1
mm
Conditions
Measured from input terminals to output terminals, shortest
distance through air.
Measured from input terminals to output terminals, shortest
distance path along body.
Through insulation distance conductor to conductor, usually
the straight line distance thickness between the emitter and
detector.
DIN IEC 112/VDE 0303 Part 1
Minimum External Tracking (Creepage)
L(102)
7.4
mm
Minimum Internal Plastic Gap
(Internal Clearance)
0.08
mm
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
>175
V
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Absolute Maximum Ratings
Parameter
Storage Temperature
Junction Temperature
Average Input Current
Peak Transient Input Current (<1s pulse width, 300 pps)
Reverse Input Voltage
"High" Peak Output Current
"Low" Peak Output Current
Supply Voltage
Output Voltage
Output Power Dissipation
Total Power Dissipation
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
T
S
Tj
I
F(AVG)
I
F(TRAN)
V
R
I
OH(PEAK)
I
OL(PEAK)
V
CC
- V
EE
V
O(PEAK)
P
O
P
T
Min
-55
-40
Max
+125
+125
25
1.0
5
2.5
2.5
Units
°C
°C
mA
A
V
A
A
V
V
mW
mW
Note
1
2
2
-0.5
0
25
V
CC
250
295
3
4
+260 °C for 10 sec., 1.6 mm below seating plane
See Package Outline Drawings section
Recommended Operating Conditions
Parameter
Power Supply
Input Current (ON)
Input Voltage (OFF)
Operating Temperature
Symbol
V
CC
- V
EE
I
F(ON)
V
F(OFF)
T
A
Min
10
10
- 3.0
- 40
Max
20
16
0.8
100
Units
V
mA
V
°C
Note
5
