ISOLATION AMPLIFIER, 3750V ISOLATION-MIN, 200kHz BAND WIDTH, PDSO8
厂商名称:Hewlett Packard Co
下载文档型号 | HCPL-7825300 | HCPL-7820300 | HCPL-7820500 | HCPL-7825500 |
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描述 | ISOLATION AMPLIFIER, 3750V ISOLATION-MIN, 200kHz BAND WIDTH, PDSO8 | ISOLATION AMPLIFIER, 3750V ISOLATION-MIN, 200kHz BAND WIDTH, PDSO8 | ISOLATION AMPLIFIER, 3750V ISOLATION-MIN, 200kHz BAND WIDTH, PDSO8 | ISOLATION AMPLIFIER, 3750V ISOLATION-MIN, 200kHz BAND WIDTH, PDSO8 |
厂商名称 | Hewlett Packard Co | Hewlett Packard Co | Hewlett Packard Co | Hewlett Packard Co |
零件包装代码 | SOIC | SOIC | SOIC | SOIC |
包装说明 | SOP, | SOP, | SOP, | SOP, |
针数 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
放大器类型 | ISOLATION AMPLIFIER | ISOLATION AMPLIFIER | ISOLATION AMPLIFIER | ISOLATION AMPLIFIER |
标称带宽 (3dB) | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
最大共模电压 | 3750 V | 3750 V | 3750 V | 3750 V |
最小绝缘电压 | 3750 V | 3750 V | 3750 V | 3750 V |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 |
最高工作温度 | 100 °C | 100 °C | 100 °C | 100 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
供电电压上限 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | DUAL | DUAL | DUAL | DUAL |
最大电压增益 | 8.56 | 8.4 | 8.4 | 8.56 |
最小电压增益 | 7.44 | 7.6 | 7.6 | 7.44 |