HCPL-T250
1.5 Amp Output Current IGBT Gate Drive Optocoupler
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
The HCPL‑T250 contains GaAs LED. The LED is optically
coupled to an integrated circuit with a power output stage.
This optocoupler is ideally suited for driving power IGBTs
and MOSFETs used in motor control inverter applications.
The high operating voltage range of the output stage
provides the drive voltages required by gate controlled
devices. The voltage and current supplied by this optocou‑
pler makes it ideally suited for directly driving IGBTs with
ratings up to 1200 V/25 A. For IGBTs with higher ratings,
the HCPL‑T250 can be used to drive a discrete power stage
which drives the IGBT gate.
Features
•
•
•
•
•
•
•
•
•
Input threshold current (I
FLH
): 5 mA (max.)
Supply current (I
CC
): 11 mA (max.)
Supply voltage (V
CC
): 15‑35 V
Output current (I
O
): ±0.5 A (min.)
Switching time (t
PLH
/t
PHL
): 0.5 µs (max.)
Isolation voltage (V
ISO
): 3750 Vrms (min.)
UL 1577 recognized: File No. E55361
CSA approved
IEC/EN/DIN EN 60747‑5‑2 approved with V
IORM
= 630
V
peak
•
5 kV/µs Minimum Common Mode Rejection (CMR) at
Vcm = 1500 V
•
Creepage distance: 7.4 mm
Clearance: 7.1 mm
Functional Diagram
N/C
ANODE
CATHODE
N/C
1
2
3
Q2
4
SHIELD
5
V
EE
Q1
8
7
6
V
CC
V
O
V
O
Applications
•
•
•
•
IGBT/MOSFET gate drive
AC/brushless DC motor drives
Industrial inverters
Switch mode power supplies
Truth Table
LED
ON
OFF
V
out
HIGH
LOW
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
CAUTION:
It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Ordering Information
HCPL‑T250 is UL Recognized with 3750 Vrms for 1 minute per UL1577.
Option
Part
Number
RoHS
Compliant
‑000E
‑300E
HCPL‑T250
‑500E
‑060E
‑360E
‑560E
Non RoHS
Compliant
No option
#300
#500
#060
#360
#560
300 mil
DIP‑8
X
X
X
X
X
X
X
X
X
X
X
X
X
Package
Surface
Mount
Gull
Wing
Tape
& Reel
IEC/EN/DIN
EN 60747-5-2
Quantity
50 per tube
50 per tube
1000 per reel
50 per tube
50 per tube
1000 per reel
To order, choose a part number from the part number column and combine with the desired option from the op‑
tion column to form an order entry.
Example 1:
HCPL‑T250‑560E to order product of 300 mil DIP Gull Wing Surface Mount package in Tape and Reel packaging
with IEC/EN/DIN EN 60747‑5‑2 Safety Approval in RoHS compliant.
Example 2:
HCPL‑T250 to order product of 300 mil DIP package in tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15
th
July 2001 and
RoHS compliant option will use ‘‑XXXE’.
2
Package Outline Drawings
Standard DIP Package
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
DATE CODE
A T250
YYWW
PIN ONE
1.19 (0.047) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
PIN ONE
1
2
3
4
1.78 (0.070) MAX.
4.70 (0.185) MAX.
5° TYP.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
+ 0.076
- 0.051
+ 0.003)
(0.010
- 0.002)
0.254
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Gull Wing Surface Mount Option 300
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
2.0 (0.080)
1.19
(0.047)
MAX.
3.56 ± 0.13
(0.140 ± 0.005)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
TEMPERATURE (°C)
200
160°C
150°C
140°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
30
SEC.
3°C + 1°C/–0.5°C
30
SEC.
SOLDERING
TIME
200°C
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
t
p
T
p
T
L
TEMPERATURE
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
T
smax
T
smin
RAMP-DOWN
6 °C/SEC. MAX.
t
s
PREHEAT
60 to 180 SEC.
25
t
L
60 to 150 SEC.
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
Note: Non-halide flux should be used.
4
Regulatory Information
The HCPL‑T250 has been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747‑5‑2:1997 + A1:2002
EN 60747‑5‑2:2001 + A1:2002
DIN EN 60747‑5‑2 (VDE 0884 Teil 2):2003‑01.
(Option 060 only)
Insulation and Safety Related
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
Symbol
L(101)
Value
7.1
Units
mm
Conditions
Measured from input terminals to
output terminals, shortest distance through
air.
Measured from input terminals to
output terminals, shortest distance path
along body.
Insulation thickness between emitter
and detector; also known as distance
through insulation
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
L(102)
7.4
mm
0.08
mm
≥175
IIIa
Volts
Absolute Maximum Ratings
(Compared with HCPL‑3120)
Parameter
Operating Temperature
“High” Peak Output Current
“High” Peak Output Current
Storage Temperature
Average Input Current
Peak Transient Input Current
(<1 µs Pulse Width, 300 pps)
Reverse Input Voltage
Supply Voltage
Output Voltage
Output Power Dissipation
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
T
A
I
OH(PEAK)
I
OL(PEAK)
T
S
I
F(AVG)
I
F(TRAN)
V
R
(V
CC
‑ V
EE
)
V
O
P
O
Units
°C
A
A
°C
mA
A
HCPL-3120
Min.
Max.
‑ 40
100
2.5
2.5
‑55
125
25
1.0
HCPL-T250
Min.
Max.
‑20
85
1.5
1.5
‑55
125
20
1.0
Note
1
2
V
5
5
V
0
35
0
35
V
0
V
CC
0
V
CC
mW
250
250
260°C for 10 sec., 1.6 mm below seating plane
See Package Outline Drawings section
3
Notes:
1. Maximum pulse width = 10 µs, maximum duty cycle = 0.2%. See HCPL‑3120 Applications section for additional details on limiting I
OH(PEAK)
.
2. Derate linearly above 70°C free‑air temperature at a rate of 0.3 mA/°C.
3. Derate lineraly above 70°C free‑air temperature at a rate of 4.8 mW/°C.
FPGA/CPLD
