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HD6417727

32-BIT, 160 MHz, RISC MICROCONTROLLER, PBGA240
32位, 160 MHz, 精简指令集微控制器, PBGA240

器件类别:半导体    嵌入式处理器和控制器   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

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器件参数
参数名称
属性值
外部数据总线宽度
32
输入输出总线数量
104
端子数量
240
最小工作温度
-20 Cel
最大工作温度
75 Cel
线速度
160 MHz
加工封装描述
13 X 13 MM, 0.65 MM PITCH, PLASTIC, LFBGA-240
each_compli
Yes
欧盟RoHS规范
Yes
状态
Active
microprocessor_microcontroller_peripheral_ic_type
MICROCONTROLLER, RISC
ADC通道
YES
地址总线宽度
26
位数
32
clock_frequency_max
66.67 MHz
DAC通道
YES
DMA通道
YES
jesd_30_code
S-PBGA-B240
moisture_sensitivity_level
3
包装材料
PLASTIC/EPOXY
ckage_code
LFBGA
包装形状
SQUARE
包装尺寸
GRID ARRAY, LOW PROFILE, FINE PITCH
eak_reflow_temperature__cel_
260
PWM通道
NO
qualification_status
COMMERCIAL
seated_height_max
1.4 mm
额定供电电压
1.9 V
最小供电电压
1.7 V
最大供电电压
2.05 V
表面贴装
YES
温度等级
COMMERCIAL EXTENDED
端子涂层
NOT SPECIFIED
端子形式
BALL
端子间距
0.6500 mm
端子位置
BOTTOM
ime_peak_reflow_temperature_max__s_
20
length
13 mm
width
13 mm
文档预览
REJ09B0254-0500
32
SH7727
Group
Hardware Manual
Renesas 32-Bit RISC Microcomputer
SuperH RISC engine Family/SH7700 Series
SH7727
HD6417727
Rev. 5.00
Revision Date: Dec 12, 2005
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-
party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
be exported under a license from the Japanese government and cannot be imported into a country
other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
Rev. 5.00 Dec 12, 2005 page ii of lxxii
General Precautions on the Handling of Products
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are not connected to any of the internal circuitry; they are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a pass-
through current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product’s state is undefined. The states of internal
circuits are undefined until full power is supplied throughout the chip and a low level is
input on the reset pin. During the period where the states are undefined, the register
settings and the output state of each pin are also undefined. Design your system so that it
does not malfunction because of processing while it is in this undefined state. For those
products which have a reset function, reset the LSI immediately after the power supply has
been turned on.
4. Prohibition of access to undefined or reserved address
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these address. Do not access these registers: the system’s
operation is not guaranteed if they are accessed.
Rev. 5.00 Dec 12, 2005 page iii of lxxii
Rev. 5.00 Dec 12, 2005 page iv of lxxii
Preface
The SH7727 microprocessor incorporates the 32-bit SH-3 CPU and is also equipped with
peripheral functions necessary for configuring a user system.
The SH7727 is built in with a variety of peripheral functions such as cache memory, memory
management unit (MMU), interrupt controller, timers, three serial communication interfaces (SCI,
SCIF, SIOF), real-time clock (RTC), user break controller (UBC), bus state controller (BSC) and
AFE interface. The SH7727 can be used in a variety of applications that demand a high-speed
microcomputer with low power consumption.
The descriptions in this manual are based on the SH7727C. For details on using versions previous
to the SH7727B please refer to Using Versions Previous to the SH7727B at the end of the manual.
Note that the version is the SH7727C if “C” is engraved on the chip and the version is the
SH7727B if “B” is engraved. If there is no such indication the product is a version previous to the
SH7727B. (See Appendix E.)
Target Readers:
This manual is designed for use by people who design application systems using
the SH7727.
To use this manual, basic knowledge of electric circuits, logic circuits and microcomputers is
required.
Purpose:
This manual provides the information of the hardware functions and electrical
characteristics of the SH7727.
The SH-3, SH-3E, SH3-DSP Programming Manual contains detailed information of executable
instructions. Please read the Programming Manual together with this manual.
How to Use the Book:
To understand general functions
Read the manual from the beginning.
The manual explains the CPU, system control functions, peripheral functions and electrical
characteristics in that order.
To understanding CPU functions
Refer to the separate SH-3, SH-3E, SH3-DSP Programming Manual.
Explanatory Note:
Bit sequence: upper bit at left, and lower bit at right
List of Related Documents:
The latest documents are available on our Web site. Please make
sure that you have the latest version. (http://www.renesas.com/)
Rev. 5.00 Dec 12, 2005 page v of lxxii
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参数对比
与HD6417727相近的元器件有:HD6417727BP160C、HD6417727F160C、SH7727、HD6417727BP100C。描述及对比如下:
型号 HD6417727 HD6417727BP160C HD6417727F160C SH7727 HD6417727BP100C
描述 32-BIT, 160 MHz, RISC MICROCONTROLLER, PBGA240 32-BIT, 160 MHz, RISC MICROCONTROLLER, PBGA240 32-BIT, 160 MHz, RISC MICROCONTROLLER, PBGA240 32-BIT, 160 MHz, RISC MICROCONTROLLER, PBGA240 32-BIT, 160 MHz, RISC MICROCONTROLLER, PBGA240
外部数据总线宽度 32 32 32 32 32
端子数量 240 240 240 240 240
地址总线宽度 26 26 26 26 26
最小供电电压 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
最大供电电压 2.05 V 2.05 V 2.05 V 2.05 V 2.05 V
表面贴装 YES YES YES YES YES
温度等级 COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
端子形式 BALL BALL GULL WING BALL BALL
端子位置 BOTTOM BOTTOM QUAD BOTTOM BOTTOM
是否无铅 - 不含铅 不含铅 - 不含铅
是否Rohs认证 - 符合 符合 - 符合
零件包装代码 - BGA QFP - BGA
包装说明 - LFBGA, FQFP, - 13 X 13 MM, 0.65 MM PITCH, PLASTIC, LFBGA-240
针数 - 240 240 - 240
Reach Compliance Code - compli compliant - compli
ECCN代码 - 3A001.A.3 3A001.A.3 - 3A001.A.3
具有ADC - YES YES - YES
位大小 - 32 32 - 32
最大时钟频率 - 66.67 MHz 66.67 MHz - 50 MHz
DAC 通道 - YES YES - YES
DMA 通道 - YES YES - YES
JESD-30 代码 - S-PBGA-B240 S-PQFP-G240 - S-PBGA-B240
长度 - 13 mm 32 mm - 13 mm
湿度敏感等级 - 3 3 - 3
I/O 线路数量 - 104 104 - 104
最高工作温度 - 75 °C 75 °C - 75 °C
最低工作温度 - -20 °C -20 °C - -20 °C
PWM 通道 - NO NO - NO
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 - LFBGA FQFP - LFBGA
封装形状 - SQUARE SQUARE - SQUARE
封装形式 - GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, FINE PITCH - GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度) - 260 240 - 260
认证状态 - Not Qualified Not Qualified - Not Qualified
座面最大高度 - 1.4 mm 3.95 mm - 1.4 mm
速度 - 160 MHz 160 MHz - 100 MHz
标称供电电压 - 1.9 V 1.9 V - 1.9 V
技术 - CMOS CMOS - CMOS
端子节距 - 0.65 mm 0.5 mm - 0.65 mm
处于峰值回流温度下的最长时间 - 20 20 - 20
宽度 - 13 mm 32 mm - 13 mm
uPs/uCs/外围集成电路类型 - MICROCONTROLLER, RISC MICROCONTROLLER, RISC - MICROCONTROLLER, RISC
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