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HD6433062VF

Renesas 16-Bit Single-Chip Microcomputer H8 Family/H8/300H Series

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

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器件参数
参数名称
属性值
厂商名称
Renesas(瑞萨电子)
包装说明
FQFP,
Reach Compliance Code
compli
具有ADC
YES
地址总线宽度
24
位大小
32
最大时钟频率
20 MHz
DMA 通道
NO
外部数据总线宽度
16
长度
14 mm
I/O 线路数量
79
端子数量
100
PWM 通道
YES
封装代码
FQFP
封装形状
SQUARE
封装形式
FLATPACK, FINE PITCH
速度
25 MHz
最大供电电压
5.5 V
最小供电电压
4.5 V
标称供电电压
5 V
表面贴装
YES
技术
CMOS
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
宽度
14 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
文档预览
REJ09B0215-0600
16
H8/3062, H8/3062B
Group
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer
H8 Family/H8/300H Series
H8/3062
HD6433062,
HD6433061,
HD6433060
H8/3062B HD6433064B,
HD6433062B,
HD6433061B,
HD6433060B
H8/3062F HD64F3062R,
HD64F3062B
H8/3064F HD64F3064B
Rev. 6.00
Revision Date: Mar 18, 2005
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-
party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
be exported under a license from the Japanese government and cannot be imported into a country
other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
Rev. 6.00 Mar 18, 2005 page ii of xlviii
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a pass-
through current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product’s state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Address
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these address. Do not access these registers; the system’s
operation is not guaranteed if they are accessed.
Rev. 6.00 Mar 18, 2005 page iii of xlviii
Configuration of This Manual
This manual comprises the following items:
1.
2.
3.
4.
5.
6.
General Precautions on Handling of Product
Configuration of This Manual
Preface
Contents
Overview
Description of Functional Modules
• CPU and System-Control Modules
• On-Chip Peripheral Modules
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
When designing an application system that includes this LSI, take notes into account. Each
section includes notes in relation to the descriptions given, and usage notes are given, as required,
as the final part of each section.
7. List of Registers
8. Electrical Characteristics
9. Appendix
10. Main Revisions and Additions in this Edition (only for revised versions)
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
11. Index
Rev. 6.00 Mar 18, 2005 page iv of xlviii
Preface
The H8/3062 Group is a high-performance single-chip microcomputer that integrates peripheral
functions necessary for system configuration with an H8/300H CPU featuring a 32-bit internal
architecture as its core.
The on-chip peripheral functions include ROM, RAM, 16-bit timers, 8-bit timers, a programmable
timing pattern controller (TPC), a watchdog timer (WDT), a serial communication interface (SCI),
a D/A converter, an A/D converter, and I/O ports, providing an ideal configuration as a
microcomputer for embedding in sophisticated control systems. Flash memory (F-ZTAT™*) and
masked ROM are available as on-chip ROM, enabling users to respond quickly and flexibly to
changing application specifications and the demands of the transition from initial to full-fledged
volume production.
Note: * F-ZTAT is a trademark of Renesas Technology Corp.
Intended Readership: This manual is intended for users undertaking the design of an application
system using the H8/3062 Group. Readers using this manual require a basic
knowledge of electrical circuits, logic circuits, and microcomputers.
Purpose:
The purpose of this manual is to give users an understanding of the hardware
functions and electrical characteristics of the H8/3062 Group. Details of
execution instructions can be found in the H8/300H Series Programming
Manual, which should be read in conjunction with the present manual.
Using this Manual:
For an overall understanding of the H8/3062 Group's functions
Follow the Table of Contents. This manual is broadly divided into sections on the CPU, system
control functions, peripheral functions, and electrical characteristics.
For a detailed understanding of CPU functions
Refer to the separate publication H8/300H Series Programming Manual.
Note on bit notation: Bits are shown in high-to-low order from left to right.
Related Material:
The latest information is available at our web site. Please make sure that you
have the most up-to-date information available.
http://www.renesas.com/eng/
Rev. 6.00 Mar 18, 2005 page v of xlviii
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