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HD6433067VFP

32-BIT, MROM, MICROCONTROLLER, PQFP100, QFP-100

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

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器件参数
参数名称
属性值
厂商名称
Renesas(瑞萨电子)
包装说明
QFP,
Reach Compliance Code
compliant
具有ADC
YES
地址总线宽度
24
位大小
16
最大时钟频率
20 MHz
DMA 通道
YES
外部数据总线宽度
16
长度
20 mm
I/O 线路数量
70
端子数量
100
PWM 通道
YES
封装代码
QFP
封装形状
RECTANGULAR
封装形式
FLATPACK
速度
20 MHz
最大供电电压
5.5 V
最小供电电压
4.5 V
标称供电电压
5 V
表面贴装
YES
技术
CMOS
端子形式
GULL WING
端子节距
0.65 mm
端子位置
QUAD
宽度
14 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
Base Number Matches
1
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To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1.
Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but
there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire
or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i)
placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or
mishap.
Notes regarding these materials
1.
These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation
product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any
other rights, belonging to Renesas Technology Corporation or a third party.
2.
Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights,
originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in
these materials.
3.
All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents
information on products at the time of publication of these materials, and are subject to change by Renesas Technology
Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these
inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various means, including the
Renesas Technology Corporation Semiconductor home page (http://www.renesas.com).
4.
When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and
algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of
the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other
loss resulting from the information contained herein.
5.
Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used
under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an
authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for
any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea
repeater use.
6.
The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these
materials.
7.
If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license
from the Japanese government and cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is
prohibited.
8.
Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
H8/3067 Series
H8/3067, H8/3066, H8/3065
H8/3067 F-ZTAT
H8/3067F, H8/3067FR
Hardware Manual
TM
ADE-602-135B
Rev. 3.0
22/2/99
Hitachi, Ltd.
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
Preface
The H8/3067 Series is a series of high-performance single-chip microcontrollers that integrate
system supporting functions together with an H8/300H CPU core.
The H8/300H CPU has a 32-bit internal architecture with sixteen 16-bit general registers, and a
concise, optimized instruction set designed for speed. It can address a 16-Mbyte linear address
space.
The on-chip supporting functions include ROM, RAM, 16-bit timers, 8-bit timers, a
programmable timing pattern controller (TPC), a watchdog timer (WDT), a serial communication
interface (SCI), an A/D converter, a D/A converter, I/O ports, a DMA controller (DMAC), and
other facilities. The three-channel SCI has been expanded to support the ISO/IEC7816-3 smart
card interface. Functions have also been added to reduce power consumption in battery-powered
applications: individual modules can be placed in standby, and the frequency of the system clock
supplied to the chip can be divided down under software control.
The address space is divided into eight areas. The data bus width and access cycle length can be
selected independently in each area, simplifying the connection of different types of memory.
Seven MCU operating modes (modes 1 to 7) are provided, offering a choice of data bus width and
address space size.
With these features, the H8/3067 Series offers easy implementation of compact, high-performance
systems.
In addition to its mask ROM versions, the H8/3067 Series has an F-ZTAT™* version with on-
chip flash memory that can be programmed on-board. This version enables users to respond
quickly and flexibly to changing application specifications.
This manual describes the H8/3067 Series hardware. For details of the instruction set, refer to the
H8/300H Series Programming Manual.
Note: * F-ZTAT™ (Flexible ZTAT) is a registered trademark of Hitachi, Ltd.
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