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HD64F2326CVTE

16-BIT, FLASH, 25MHz, MICROCONTROLLER, PQFP120, TQFP-120

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Renesas(瑞萨电子)
零件包装代码
QFP
包装说明
TFQFP, TQFP100,.63SQ
针数
120
Reach Compliance Code
unknown
具有ADC
YES
地址总线宽度
24
位大小
16
CPU系列
H8S/2000
DAC 通道
YES
DMA 通道
YES
外部数据总线宽度
16
JESD-30 代码
S-PQFP-G120
JESD-609代码
e6
长度
14 mm
I/O 线路数量
95
端子数量
120
最高工作温度
75 °C
最低工作温度
-20 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
TFQFP
封装等效代码
TQFP100,.63SQ
封装形状
SQUARE
封装形式
FLATPACK, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
3.3 V
认证状态
Not Qualified
RAM(字节)
16384
ROM(单词)
524288
ROM可编程性
FLASH
座面最大高度
1.2 mm
速度
25 MHz
最大供电电压
3.6 V
最小供电电压
3 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL EXTENDED
端子面层
Tin/Bismuth (Sn/Bi)
端子形式
GULL WING
端子节距
0.4 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
14 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
Base Number Matches
1
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To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1.
Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but
there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire
or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i)
placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or
mishap.
Notes regarding these materials
1.
These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation
product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any
other rights, belonging to Renesas Technology Corporation or a third party.
2.
Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights,
originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in
these materials.
3.
All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents
information on products at the time of publication of these materials, and are subject to change by Renesas Technology
Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these
inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various means, including the
Renesas Technology Corporation Semiconductor home page (http://www.renesas.com).
4.
When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and
algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of
the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other
loss resulting from the information contained herein.
5.
Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used
under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an
authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for
any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea
repeater use.
6.
The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these
materials.
7.
If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license
from the Japanese government and cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is
prohibited.
8.
Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
Hitachi 16-Bit Single-Chip Microcomputer
H8S/2329 Series, H8S/2328 Series
Hardware Manual
— Specifications Common to All Series —
ADE-602-171C
Rev. 4.0
3/20/2003
Hitachi, Ltd.
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that demands
especially high quality and reliability or where its failure or malfunction may directly threaten
human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power,
combustion control, transportation, traffic, safety equipment or medical equipment for life
support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider
normally foreseeable failure rates or failure modes in semiconductor devices and employ
systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does
not cause bodily injury, fire or other consequential damage due to operation of the Hitachi
product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
Preface
The H8S/2329 Series and H8S/2328 Series are series of high-performance microcontrollers with a
32-bit H8S/2000 CPU core, and a set of on-chip supporting functions required for system
configuration.
The H8S/2000 CPU can execute basic instructions in one state, and is provided with sixteen 16-bit
general registers with a 32-bit internal configuration, and a concise and optimized instruction set.
The CPU can handle a 16-Mbyte linear address space (architecturally 4 Gbytes). Programs based
on the high-level language C can also be run efficiently.
The address space is divided into eight areas. The data bus width and access states can be selected
for each of these areas, and various kinds of memory can be connected fast and easily.
Single-power-supply flash memory (F-ZTAT™) and mask ROM versions are available, providing
a quick and flexible response to conditions from ramp-up through full-scale volume production,
even for applications with frequently changing specifications.
On-chip supporting functions include a 16-bit timer pulse unit (TPU), programmable pulse
generator (PPG), 8-bit timer, watchdog timer (WDT), serial communication interface (SCI), A/D
converter, D/A converter, and I/O ports.
In addition, an on-chip DMA controller (DMAC) and data transfer controller (DTC) are provided,
enabling high-speed data transfer without CPU intervention.
Use of the H8S/2329 Series and H8S/2328 Series enables easy implementation of compact, high-
performance systems capable of processing large volumes of data.
Refer to the H8S/2600 Series, H8S/2000 Series Programming Manual for a detailed description of
the instruction set and programming-related information.
Rev. 4.0, 03/03 page iii of xliv
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参数对比
与HD64F2326CVTE相近的元器件有:HD64F2326CVF。描述及对比如下:
型号 HD64F2326CVTE HD64F2326CVF
描述 16-BIT, FLASH, 25MHz, MICROCONTROLLER, PQFP120, TQFP-120 16-BIT, FLASH, 25MHz, MICROCONTROLLER, PQFP128, QFP-128
是否Rohs认证 符合 符合
厂商名称 Renesas(瑞萨电子) Renesas(瑞萨电子)
零件包装代码 QFP QFP
包装说明 TFQFP, TQFP100,.63SQ FQFP, QFP128,.63X.87,20
针数 120 128
Reach Compliance Code unknown unknown
具有ADC YES YES
地址总线宽度 24 24
位大小 16 16
CPU系列 H8S/2000 H8S/2000
DAC 通道 YES YES
DMA 通道 YES YES
外部数据总线宽度 16 16
JESD-30 代码 S-PQFP-G120 R-PQFP-G128
JESD-609代码 e6 e6
长度 14 mm 20 mm
I/O 线路数量 95 93
端子数量 120 128
最高工作温度 75 °C 75 °C
最低工作温度 -20 °C -20 °C
PWM 通道 YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TFQFP FQFP
封装等效代码 TQFP100,.63SQ QFP128,.63X.87,20
封装形状 SQUARE RECTANGULAR
封装形式 FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, FINE PITCH
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
电源 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified
RAM(字节) 16384 16384
ROM(单词) 524288 524288
ROM可编程性 FLASH FLASH
座面最大高度 1.2 mm 3.15 mm
速度 25 MHz 25 MHz
最大供电电压 3.6 V 3.6 V
最小供电电压 3 V 3 V
标称供电电压 3.3 V 3.3 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL EXTENDED COMMERCIAL EXTENDED
端子面层 Tin/Bismuth (Sn/Bi) Tin/Bismuth (Sn/Bi)
端子形式 GULL WING GULL WING
端子节距 0.4 mm 0.5 mm
端子位置 QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 14 mm 14 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
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