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HD64F7058BP80L

Renesas SuperHTM RISC engine

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Renesas(瑞萨电子)
Reach Compliance Code
unknow
具有ADC
YES
地址总线宽度
22
位大小
32
CPU系列
SH7000
最大时钟频率
20 MHz
DAC 通道
NO
DMA 通道
YES
外部数据总线宽度
16
JESD-30 代码
S-PBGA-B272
JESD-609代码
e0
长度
21 mm
I/O 线路数量
149
端子数量
272
最高工作温度
105 °C
最低工作温度
-40 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA272,20X20,40
封装形状
SQUARE
封装形式
GRID ARRAY
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
3.3,5 V
认证状态
Not Qualified
RAM(字节)
49152
ROM(单词)
1048576
ROM可编程性
FLASH
座面最大高度
2.1 mm
速度
80 MHz
最大压摆率
150 mA
最大供电电压
3.6 V
最小供电电压
3 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
TIN LEAD
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
21 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER, RISC
文档预览
REJ09B0046-0300H
32
SH-2E SH7058 F-ZTAT
TM
Hardware Manual
Renesas SuperH
TM
RISC engine
Rev. 3.00
Revision date: Sep. 17, 2004
www.renesas.com
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-
party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
be exported under a license from the Japanese government and cannot be imported into a country
other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.The NC (not connected) pins are either not
connected to any of the internal circuitry or are they are used as test pins or to reduce noise.
If something is connected to the NC pins, the operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.Generally, the input pins of CMOS products
are high-impedance input pins. If unused pins are in their open states, intermediate levels
are induced by noise in the vicinity, a pass-through current flows internally, and a
malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product’s state is undefined.The states of internal circuits
are undefined until full power is supplied throughout the chip and a low level is input on the
reset pin. During the period where the states are undefined, the register settings and the
output state of each pin are also undefined. Design your system so that it does not
malfunction because of processing while it is in this undefined state. For those products
which have a reset function, reset the LSI immediately after the power supply has been
turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited. The undefined or reserved
addresses may be used to expand functions, or test registers may have been be allocated to
these addresses. Do not access these registers; the system’s operation is not guaranteed if
they are accessed.
Preface
The SH7058 is a single-chip RISC (reduced instruction set computer) microcomputer that has the
32-bit internal architecture CPU, SH-2E, as its core, and also includes peripheral functions
necessary for system configuration.
The SH7058 is equipped with on-chip peripheral functions necessary for system configuration,
including a floating-point unit (FPU), large-capacity ROM and RAM, a direct memory access
controller (DMAC), timers, a serial communication interface (SCI), controller area network
(HCAN), A/D converter, and I/O ports, therefore, it can be used as a microprocessor built in a
high-level control system.
The SH7058 is an F-ZTAT™* (Flexible Zero Turn-Around Time) version with flash memory as
its on-chip ROM, and it can rapidly and flexibly deal with each situation on an application system
with fluid specifications from an early stage of mass production to full-scale production.
Note: * F-ZTAT™ is a trademark of Renesas Technology, Corp.
Target users: This manual was written for users who will be using the SH7058 F-ZTAT in the
design of application systems. Users of this manual are expected to understand
the fundamentals of electrical curcuits, logical circuits, and microcomputers.
Objective:
This manual was written to explain the hardware functions and electrical
characteristics of the SH7058 F-ZTAT to the above users.
Refer to the SH-2E Programming Manual for a detailed description of the
instruction set.
Notes on reading this manual:
In order to understand the overall functions of the chip
Read the manual according to the contents. This manual can be roughly categorized into parts
on the CPU, system control functions, peripheral functions and electrical characteristics.
In order to understand the details of the CPU's functions
Read the SH-2E Programming Manual.
Rule:
Bit order:
The MSB (most significant bit) is on the left and the LSB (least
significant bit) is on the right.
Releated Manuals: The latest versions of all related manuals are available from our web site.
Please ensure you have the latest versions of all documents you require.
http://www.renesas.com/
Rev. 3.0, 09/04, page i of xxxviii
SH7058 F-ZTAT manuals:
Manual Title
SH7058 F-ZTAT Hardware Manual
SH-2E Programming Manual
Document No.
This manual
Users manuals for development tools:
Manual Title
SH Series C/C++ Compiler, Assembler, Optimizing Linkage Editor User's
Manual
SH Series Simulator/Debugger (for Windows) User's Manual
SH Series Simulator/Debugger (for UNIX) User's Manual
High-performance Embedded Workshop User's Manual
Document No.
ADE-702-246
ADE-702-186
ADE-702-203
ADE-702-201
Application note:
Manual Title
C/C++ Compiler
Document No.
Rev. 3.0, 09/04, page ii of xxxviii
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参数对比
与HD64F7058BP80L相近的元器件有:HD64F7058BF80L、SH7058、SH7058F、HD64F7058BP80K、HD64F7058BF80K。描述及对比如下:
型号 HD64F7058BP80L HD64F7058BF80L SH7058 SH7058F HD64F7058BP80K HD64F7058BF80K
描述 Renesas SuperHTM RISC engine Renesas SuperHTM RISC engine Renesas SuperHTM RISC engine Renesas SuperHTM RISC engine Renesas SuperHTM RISC engine Renesas SuperHTM RISC engine
是否Rohs认证 不符合 不符合 - - 不符合 不符合
厂商名称 Renesas(瑞萨电子) Renesas(瑞萨电子) - - Renesas(瑞萨电子) Renesas(瑞萨电子)
Reach Compliance Code unknow unknow - - unknow unknow
具有ADC YES YES - - YES YES
地址总线宽度 22 22 - - 22 22
位大小 32 32 - - 32 32
CPU系列 SH7000 SH7000 - - SH7000 SH7000
最大时钟频率 20 MHz 20 MHz - - 20 MHz 20 MHz
DAC 通道 NO NO - - NO NO
DMA 通道 YES YES - - YES YES
外部数据总线宽度 16 16 - - 16 16
JESD-30 代码 S-PBGA-B272 R-PQFP-G256 - - S-PBGA-B272 R-PQFP-G256
JESD-609代码 e0 e0 - - e0 e0
长度 21 mm 40 mm - - 21 mm 40 mm
I/O 线路数量 149 149 - - 149 149
端子数量 272 256 - - 272 256
最高工作温度 105 °C 105 °C - - 125 °C 125 °C
最低工作温度 -40 °C -40 °C - - -40 °C -40 °C
PWM 通道 YES YES - - YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA FQFP - - BGA FQFP
封装等效代码 BGA272,20X20,40 QFP256,1.2X1.7,20 - - BGA272,20X20,40 QFP256,1.2X1.7,20
封装形状 SQUARE RECTANGULAR - - SQUARE RECTANGULAR
封装形式 GRID ARRAY FLATPACK, FINE PITCH - - GRID ARRAY FLATPACK, FINE PITCH
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED
电源 3.3,5 V 3.3,5 V - - 3.3,5 V 3.3,5 V
认证状态 Not Qualified Not Qualified - - Not Qualified Not Qualified
RAM(字节) 49152 49152 - - 49152 49152
ROM(单词) 1048576 1048576 - - 1048576 1048576
ROM可编程性 FLASH FLASH - - FLASH FLASH
座面最大高度 2.1 mm 3.56 mm - - 2.1 mm 3.56 mm
速度 80 MHz 80 MHz - - 80 MHz 80 MHz
最大压摆率 150 mA 150 mA - - 150 mA 150 mA
最大供电电压 3.6 V 3.6 V - - 3.6 V 3.6 V
最小供电电压 3 V 3 V - - 3 V 3 V
标称供电电压 3.3 V 3.3 V - - 3.3 V 3.3 V
表面贴装 YES YES - - YES YES
技术 CMOS CMOS - - CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL - - AUTOMOTIVE AUTOMOTIVE
端子面层 TIN LEAD TIN LEAD - - TIN LEAD TIN LEAD
端子形式 BALL GULL WING - - BALL GULL WING
端子节距 1 mm 0.5 mm - - 1 mm 0.5 mm
端子位置 BOTTOM QUAD - - BOTTOM QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED
宽度 21 mm 28 mm - - 21 mm 28 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER, RISC MICROCONTROLLER, RISC - - MICROCONTROLLER, RISC MICROCONTROLLER, RISC
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A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
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